CA2702160C - Electronic interface apparatus and method and system for manufacturing same - Google Patents
Electronic interface apparatus and method and system for manufacturing same Download PDFInfo
- Publication number
- CA2702160C CA2702160C CA2702160A CA2702160A CA2702160C CA 2702160 C CA2702160 C CA 2702160C CA 2702160 A CA2702160 A CA 2702160A CA 2702160 A CA2702160 A CA 2702160A CA 2702160 C CA2702160 C CA 2702160C
- Authority
- CA
- Canada
- Prior art keywords
- substrate
- connection wires
- continuous connection
- conductors
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 40
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 93
- 239000004020 conductor Substances 0.000 claims abstract description 50
- 238000007789 sealing Methods 0.000 claims abstract description 9
- 238000005476 soldering Methods 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 4
- 238000003801 milling Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 75
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000000463 material Substances 0.000 description 8
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 6
- 229920000915 polyvinyl chloride Polymers 0.000 description 5
- 239000004800 polyvinyl chloride Substances 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 230000000717 retained effect Effects 0.000 description 3
- 239000004831 Hot glue Substances 0.000 description 2
- 239000002365 multiple layer Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000002131 composite material Substances 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012966 insertion method Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Credit Cards Or The Like (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ILPCT/IL2007/001378 | 2007-11-08 | ||
| PCT/IL2007/001378 WO2008129526A2 (en) | 2007-04-24 | 2007-11-08 | Electronic interface apparatus and method and system for manufacturing same |
| PCT/IL2008/000538 WO2008129547A2 (en) | 2007-04-24 | 2008-04-17 | Method and system for manufacture of an electronic interface card and a card manufactured using same |
| ILPCT/IL2008/000538 | 2008-04-17 | ||
| PCT/IL2008/001397 WO2009060425A2 (en) | 2007-11-08 | 2008-10-23 | Electronic interface apparatus and method and system for manufacturing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2702160A1 CA2702160A1 (en) | 2009-05-14 |
| CA2702160C true CA2702160C (en) | 2013-08-13 |
Family
ID=42238549
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA2702160A Active CA2702160C (en) | 2007-11-08 | 2008-10-23 | Electronic interface apparatus and method and system for manufacturing same |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101103186B1 (es) |
| CA (1) | CA2702160C (es) |
| MX (1) | MX2010004338A (es) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997034247A2 (de) | 1996-03-14 | 1997-09-18 | Pav Card Gmbh | Chipkarte, verbindungsanordnung und verfahren zum herstellen einer chipkarte |
| FR2788646B1 (fr) | 1999-01-19 | 2007-02-09 | Bull Cp8 | Carte a puce munie d'une antenne en boucle, et micromodule associe |
| GB2371264A (en) | 2001-01-18 | 2002-07-24 | Pioneer Oriental Engineering L | Smart card with embedded antenna |
| US6857552B2 (en) | 2003-04-17 | 2005-02-22 | Intercard Limited | Method and apparatus for making smart card solder contacts |
-
2008
- 2008-10-23 KR KR1020107012242A patent/KR101103186B1/ko active IP Right Grant
- 2008-10-23 CA CA2702160A patent/CA2702160C/en active Active
- 2008-10-23 MX MX2010004338A patent/MX2010004338A/es active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| KR101103186B1 (ko) | 2012-01-04 |
| MX2010004338A (es) | 2010-06-08 |
| KR20100080854A (ko) | 2010-07-12 |
| CA2702160A1 (en) | 2009-05-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request |