CA2688245C - Method of forming connection between electrode and actuator in an inkjet nozzle assembly - Google Patents
Method of forming connection between electrode and actuator in an inkjet nozzle assembly Download PDFInfo
- Publication number
- CA2688245C CA2688245C CA2688245A CA2688245A CA2688245C CA 2688245 C CA2688245 C CA 2688245C CA 2688245 A CA2688245 A CA 2688245A CA 2688245 A CA2688245 A CA 2688245A CA 2688245 C CA2688245 C CA 2688245C
- Authority
- CA
- Canada
- Prior art keywords
- actuator
- electrode
- nozzle
- nozzle assembly
- active beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 30
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- 239000011810 insulating material Substances 0.000 claims abstract description 10
- 238000007772 electroless plating Methods 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims description 33
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 32
- 229910052751 metal Inorganic materials 0.000 claims description 32
- 239000002184 metal Substances 0.000 claims description 32
- 238000000151 deposition Methods 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 230000008021 deposition Effects 0.000 claims description 12
- 235000012239 silicon dioxide Nutrition 0.000 claims description 11
- 239000000377 silicon dioxide Substances 0.000 claims description 11
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical group [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 6
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- 239000003054 catalyst Substances 0.000 claims description 5
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- 238000000429 assembly Methods 0.000 description 18
- 230000000712 assembly Effects 0.000 description 18
- 238000004519 manufacturing process Methods 0.000 description 17
- 238000013461 design Methods 0.000 description 14
- 229910052681 coesite Inorganic materials 0.000 description 13
- 229910052906 cristobalite Inorganic materials 0.000 description 13
- 229910052682 stishovite Inorganic materials 0.000 description 13
- 229910052905 tridymite Inorganic materials 0.000 description 13
- 229920001600 hydrophobic polymer Polymers 0.000 description 10
- 229920002120 photoresistant polymer Polymers 0.000 description 9
- 230000008901 benefit Effects 0.000 description 8
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 8
- 239000004642 Polyimide Substances 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- 229910000838 Al alloy Inorganic materials 0.000 description 5
- 239000004411 aluminium Substances 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
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- 239000010936 titanium Substances 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 3
- PTXMVOUNAHFTFC-UHFFFAOYSA-N alumane;vanadium Chemical compound [AlH3].[V] PTXMVOUNAHFTFC-UHFFFAOYSA-N 0.000 description 3
- 238000004380 ashing Methods 0.000 description 3
- 229910017083 AlN Inorganic materials 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000000708 deep reactive-ion etching Methods 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- -1 polydimethylsiloxane Polymers 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 150000004699 copper complex Chemical class 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1648—Production of print heads with thermal bend detached actuators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1635—Manufacturing processes dividing the wafer into individual chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14427—Structure of ink jet print heads with thermal bend detached actuators
- B41J2002/14435—Moving nozzle made of thermal bend detached actuator
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/18—Electrical connection established using vias
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA2795383A CA2795383C (en) | 2007-06-15 | 2007-06-15 | Printhead integrated circuit comprising nozzle assemblies with connector posts defined in chamber sidewalls |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/AU2007/000846 WO2008151351A1 (en) | 2007-06-15 | 2007-06-15 | Method of forming connection between electrode and actuator in an inkjet nozzle assembly |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA2795383A Division CA2795383C (en) | 2007-06-15 | 2007-06-15 | Printhead integrated circuit comprising nozzle assemblies with connector posts defined in chamber sidewalls |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2688245A1 CA2688245A1 (en) | 2008-12-18 |
| CA2688245C true CA2688245C (en) | 2012-12-18 |
Family
ID=40129117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA2688245A Active CA2688245C (en) | 2007-06-15 | 2007-06-15 | Method of forming connection between electrode and actuator in an inkjet nozzle assembly |
Country Status (5)
| Country | Link |
|---|---|
| EP (2) | EP2527152B1 (zh) |
| KR (1) | KR101064043B1 (zh) |
| CA (1) | CA2688245C (zh) |
| TW (2) | TWI406772B (zh) |
| WO (1) | WO2008151351A1 (zh) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI495570B (zh) * | 2009-07-27 | 2015-08-11 | Memjet Technology Ltd | 具背側電連接之噴墨列印頭組件 |
| JP6575097B2 (ja) * | 2015-03-24 | 2019-09-18 | セイコーエプソン株式会社 | ヘッドユニットおよび液体吐出装置 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0901415B1 (en) | 1996-04-23 | 2002-07-24 | Xaar Technology Limited | Droplet deposition apparatus |
| JPH11320873A (ja) * | 1997-06-05 | 1999-11-24 | Ricoh Co Ltd | インクジェットヘッド |
| US6416168B1 (en) | 1997-07-15 | 2002-07-09 | Silverbrook Research Pty Ltd | Pump action refill ink jet printing mechanism |
| US6648453B2 (en) * | 1997-07-15 | 2003-11-18 | Silverbrook Research Pty Ltd | Ink jet printhead chip with predetermined micro-electromechanical systems height |
| US6416167B1 (en) | 1997-07-15 | 2002-07-09 | Silverbrook Research Pty Ltd | Thermally actuated ink jet printing mechanism having a series of thermal actuator units |
| US6682174B2 (en) * | 1998-03-25 | 2004-01-27 | Silverbrook Research Pty Ltd | Ink jet nozzle arrangement configuration |
| US6260953B1 (en) | 1997-07-15 | 2001-07-17 | Silverbrook Research Pty Ltd | Surface bend actuator vented ink supply ink jet printing mechanism |
| JP4296361B2 (ja) * | 1999-04-06 | 2009-07-15 | 富士フイルム株式会社 | インクジェットヘッド、インクジェットプリンタ、及び、インクジェットヘッドの製造方法 |
| US6265301B1 (en) * | 1999-05-12 | 2001-07-24 | Taiwan Semiconductor Manufacturing Company | Method of forming metal interconnect structures and metal via structures using photolithographic and electroplating or electro-less plating procedures |
| WO2001074592A1 (fr) * | 2000-03-31 | 2001-10-11 | Fujitsu Limited | Tete a jet d'encre a buses multiples et son procede de fabrication |
| US6896358B1 (en) * | 2000-05-24 | 2005-05-24 | Silverbrook Research Pty Ltd | Fluidic seal for an ink jet nozzle assembly |
| US6623101B1 (en) | 2000-10-20 | 2003-09-23 | Silverbrook Research Pty Ltd | Moving nozzle ink jet |
| KR100552660B1 (ko) * | 2001-08-09 | 2006-02-20 | 삼성전자주식회사 | 버블 젯 방식의 잉크 젯 프린트 헤드 |
| TW200500292A (en) * | 2002-11-20 | 2005-01-01 | Reveo Inc | Method of fabricating multi layer MENs and microfluidic devices |
| US6755509B2 (en) * | 2002-11-23 | 2004-06-29 | Silverbrook Research Pty Ltd | Thermal ink jet printhead with suspended beam heater |
| US7614727B2 (en) * | 2004-09-30 | 2009-11-10 | Fujifilm Corporation | Liquid ejection head, manufacturing method thereof, and image forming apparatus |
| JP5008844B2 (ja) | 2005-08-23 | 2012-08-22 | 株式会社リコー | 液滴吐出ヘッド、インクジェット記録装置、及び液滴吐出ヘッドの製造方法 |
-
2007
- 2007-06-15 KR KR1020097025354A patent/KR101064043B1/ko active IP Right Grant
- 2007-06-15 EP EP12174685.3A patent/EP2527152B1/en active Active
- 2007-06-15 CA CA2688245A patent/CA2688245C/en active Active
- 2007-06-15 WO PCT/AU2007/000846 patent/WO2008151351A1/en active Application Filing
- 2007-06-15 EP EP07870177A patent/EP2160296B1/en active Active
- 2007-10-09 TW TW096137838A patent/TWI406772B/zh active
- 2007-10-09 TW TW096137839A patent/TWI409175B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI409175B (zh) | 2013-09-21 |
| EP2160296A4 (en) | 2010-09-08 |
| CA2688245A1 (en) | 2008-12-18 |
| EP2160296B1 (en) | 2012-08-15 |
| TW200848270A (en) | 2008-12-16 |
| TW200848271A (en) | 2008-12-16 |
| KR101064043B1 (ko) | 2011-09-08 |
| EP2527152B1 (en) | 2013-12-11 |
| EP2160296A1 (en) | 2010-03-10 |
| EP2527152A1 (en) | 2012-11-28 |
| WO2008151351A1 (en) | 2008-12-18 |
| TWI406772B (zh) | 2013-09-01 |
| KR20100029187A (ko) | 2010-03-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request |