CA2586342A1 - Led module - Google Patents
Led module Download PDFInfo
- Publication number
- CA2586342A1 CA2586342A1 CA 2586342 CA2586342A CA2586342A1 CA 2586342 A1 CA2586342 A1 CA 2586342A1 CA 2586342 CA2586342 CA 2586342 CA 2586342 A CA2586342 A CA 2586342A CA 2586342 A1 CA2586342 A1 CA 2586342A1
- Authority
- CA
- Canada
- Prior art keywords
- heat sink
- led module
- lens holder
- groove
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- Led Device Packages (AREA)
Abstract
A LED module includes a heat sink, which is partially covered with an insulative layer and has a groove in a top recess thereof, and a plurality of mounting through holes cut through the top and bottom sides, a LED mounted in the groove of the heat sink, metal conduction plates fastened to the mounting through holes and extended to the outside of the heat sink, lead wires respectively connected between the metal conduction plates and positive and negative terminals of the LED, a light transmittance resin molded on the groove over the LED, and a lens holder fastened to the heat sink to hold an optical lens over the light transmittance resin.
Description
11y q LED MODULE
BACKGROUND OF THE INVENTION
1. Field of the Invention:
The present invention relates to a LED (light emitting diode) and more particularly, to a LED module that dissipates heat quickly durinc, operation.
BACKGROUND OF THE INVENTION
1. Field of the Invention:
The present invention relates to a LED (light emitting diode) and more particularly, to a LED module that dissipates heat quickly durinc, operation.
2. Description of the Related Art:
In recent decades, human beings consume eneray heavily, resultina in an energy crisis. Nowadays, scientists in different countries are trying hard to develop new eneray and every-savina products. In consequence, various petroleum substitutes have been developed, the utilization of solar power has been enhanced, and various low power consumption type fuel enaines and motors and power-savin~ li~htin~ fixtures have been created. Nowadays, LEDs (light emittina diodes) have been intensively used to substitute for conventional incandescent bulbs and fluorescent bulbs in various fields for the advantaQe of low power consumption.
The lower power consumption characteristic of LEDs is well known. Followinj fast development of semiconductor technology, high brightness LEDs are developed for use in many fields for illumination. For exan:ple, T Ens have been . i 1 li IY11h.
intensively used in motor vehicles for vehicle lights.
However, a LED must be paekaQed with a light transmittance resin before application. Because a high brightness LED releases much heat durino, operation and is enclosed in the package, heat cannot be quickly dissipated durinc, the operation.
SUMMARY OF THE INVENTION
The present invention has been accomplished under the circumstances in view. It is therefore the main object of the present invention to provide a LED (light emitting diode) module, which dissipates heat quickly durina the operation of the LED (li-ht emittinc, diode). Accordina to one embodiment of the present invention, the LED module comprises a heat sink, which is partially covered with an insulative layer and has a groove in a top recess thereof, and a plurality of mountin~
through holes cut through the top and bottom sides, a LED
mounted in the groove of the heat sink, metal conduction plates fastened to the mountina through holes and extended to the outside of the heat sink, lead wires respectively connected between the metal condu-ction plates and positive and negative terminals of the LED, a li~ht transmittance resin molded on the sink groove over the LED, and a lens holder fastened P~ *o *~ ~V r-~+.lA,*lJ111 t ~LL l to hold an optical lens over the liQht transmittance resin.
AccordinQ to another embodiment of the present invention, the LED module comprises a heat sink, the heat sink havincy a top side, a top orroove in the top side, an insulative layer covered on the top side outside the groove; a metal thin film covered on the 1:op Qroove; at least one light emitting diode respectively fixedly on the metal thin film; a plurality of metal conduction plates affixed to the heat sink; a plurality of lead wires respectively connected between the metal conduction plates and positive and negative terminals of the at last one light emitting diode; and a ]liaht transmittance resin molded on the aroove of the heat sink and coverin- the li-ht emittincr diode.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is an exploded view of a LED module in accordance with a first embodiment of the present invention.
FIG. 2 is a sectional assembly view of the LED module ;in accordance with the first embodiment of the present invention.
FIG. 2A is similar to FIG. 2 but showing the LED
mounted on a metal thin film on the groove in the top recess of ithe heat sink.
FIG. 3 is a perspective assembly view of the LED
In recent decades, human beings consume eneray heavily, resultina in an energy crisis. Nowadays, scientists in different countries are trying hard to develop new eneray and every-savina products. In consequence, various petroleum substitutes have been developed, the utilization of solar power has been enhanced, and various low power consumption type fuel enaines and motors and power-savin~ li~htin~ fixtures have been created. Nowadays, LEDs (light emittina diodes) have been intensively used to substitute for conventional incandescent bulbs and fluorescent bulbs in various fields for the advantaQe of low power consumption.
The lower power consumption characteristic of LEDs is well known. Followinj fast development of semiconductor technology, high brightness LEDs are developed for use in many fields for illumination. For exan:ple, T Ens have been . i 1 li IY11h.
intensively used in motor vehicles for vehicle lights.
However, a LED must be paekaQed with a light transmittance resin before application. Because a high brightness LED releases much heat durino, operation and is enclosed in the package, heat cannot be quickly dissipated durinc, the operation.
SUMMARY OF THE INVENTION
The present invention has been accomplished under the circumstances in view. It is therefore the main object of the present invention to provide a LED (light emitting diode) module, which dissipates heat quickly durina the operation of the LED (li-ht emittinc, diode). Accordina to one embodiment of the present invention, the LED module comprises a heat sink, which is partially covered with an insulative layer and has a groove in a top recess thereof, and a plurality of mountin~
through holes cut through the top and bottom sides, a LED
mounted in the groove of the heat sink, metal conduction plates fastened to the mountina through holes and extended to the outside of the heat sink, lead wires respectively connected between the metal condu-ction plates and positive and negative terminals of the LED, a li~ht transmittance resin molded on the sink groove over the LED, and a lens holder fastened P~ *o *~ ~V r-~+.lA,*lJ111 t ~LL l to hold an optical lens over the liQht transmittance resin.
AccordinQ to another embodiment of the present invention, the LED module comprises a heat sink, the heat sink havincy a top side, a top orroove in the top side, an insulative layer covered on the top side outside the groove; a metal thin film covered on the 1:op Qroove; at least one light emitting diode respectively fixedly on the metal thin film; a plurality of metal conduction plates affixed to the heat sink; a plurality of lead wires respectively connected between the metal conduction plates and positive and negative terminals of the at last one light emitting diode; and a ]liaht transmittance resin molded on the aroove of the heat sink and coverin- the li-ht emittincr diode.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is an exploded view of a LED module in accordance with a first embodiment of the present invention.
FIG. 2 is a sectional assembly view of the LED module ;in accordance with the first embodiment of the present invention.
FIG. 2A is similar to FIG. 2 but showing the LED
mounted on a metal thin film on the groove in the top recess of ithe heat sink.
FIG. 3 is a perspective assembly view of the LED
3 I II I M111~
module in accordance with the first embodinient of the present invention.
FIG. 4 is an exploded view of a LED module in accordance with a second embodiment of the present invention.
FIG. 5 is a sectional assembly view of the LED module in accordance with the second embodiment of the present invention.
FIG. 6 is a perspective assembly view of the LED
module in accordance with the second embodiment of the present invention.
FIG. 7 is an exploded view of a LED module in accordance with a third embodiment of the present invention.
FIG. 8 is sectional assembly view of the LED module in accordance with the third embodiment of the present invention.
FIG. 9 is a perspective assembly view of the LED
module in accordance with the third embodiment of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
ReferrinQ to FIGS. 1-3, a LED module in accordance with a first embodiment of the present invention is shown comprisin~ a heat sink 1, a LED (Li~ht Emitting Diode) 2 mounted in the heat S:nk 1, n n:l u 1Pnc hnlder ? fa3te.~.ed t~ tl:e ~
ww heat sink 1 and holding an optical lens 33 corresponding to the LED 2. The heat sink 1 has a top recess 11, a groove 12 fornzed in the top recess 11 for the mounting of the LED 2, and a plurality of mountina through holes 13 cut throuah the top and bottom sides. Further, the top surface of the heat sink 1 is covered with an insulation layer A. Further, a plurality of metal conducting plates 131 are respectively fastened to the heat sink 1. The metal conducting plates 131 each have an upright shank 132 respectively inserted from the bottom side of the heat sink 1 into the mountin- through holes 13. After insertion of the upright shanks 132 into the mounting through holes 13, the top ends 133 of the upright shanks 132 are hammered down to affix the upright shanks 132 to the heat sink 1. Further, lead wires 21 are respectively connected between the positive and negative electrodes of the LED 2 and the upright shanks 132 of the metal conductina plates 131. A light transmittance resin 4 is molded on the top recess 11 over the LED 2, keepina the LED 2 embedded in the light transmittance resin 4. The lend holder 3 has a plurality of bottom hooks 31 respectively hooked on the bottom ed(ye of the heat sink 1, and a center opening 32. The optical lens 33 is fastened to the center openin- 32 of the lens holder 3. The heat sink 1 is made out of a metal material, for . I I I I Y 111 .
example, gold, silver, copper, iron, aluminum, or their alloy that transfers heat energy efficiently. Further, a metal thin film 121 may be directly bonded to the aroove 12 that is not covered by the insulative layer A so that the LED 2 can be directly fastened to the metal thin film 121. Durinc, the operation, heat energy is quickly transferred from the LED 2 to the heat sink 1 through the metal thin film 121 (see FIG. 2A). The metal thin film 121 can be a film of nickel gold alloy, nickel silver alloy, or nickel copper alloy.
FIGS. 4-6 show a LED module in accordance with a second embodiment of the present invention. This embodiment is substantially similar to the aforesaid first embodiment with the exception that the heat sink 1 has a plurality of peripheral notches 14 for securing the bottom hooks 31 of the lens holder 3.
Further, the heat sink 1 has only two mountina through holes 13 for the mounting of two metal conducting plates 131.
FIGS. 7-9 show a LED module in accordance with a third embodiment of the present invention. Accordinc, to this embodiment, the LED module comprises a heat sink 5, a LED
(Light Emitting Diode) 2 mounted in the heat sink 5, and a lens liolder 3 fastened to the heat sink 5 and holdina an optical lens A1V IVKL J1L1 / LLJ I.L LV ~.L.. L
33 correspondinb t.o the LED 2. The A~+ c;~k e r., ., +~p n'l.r Y
recess 52 for the mountinc, of the LED 2, a plurality of top border recesses 51 spaced around the top center recess 52, an upriQht rod 511 respectively disposed in each top border recess 51, and a plurality of peripheral bottom notches 53. Further, the top surface of the heat sink 5 is covered with an insulation layer A. Further, a plurality of metal conducting plates 512 are respectively fastened to the top border recesses 51 of the heat sink 5 and extended to the periphery of the heat sink 5. The imetal conducting plates 512 each have a vertical through hole 513 respectively coupled to the upright rod 511. Further, lead wires 21 are respectively connected between the positive and negative electrodes of the LED 2 and the metal conducting plates 512. A light transmittance resin 4 is molded on the top side of the heat sink 5 over the LED 2, keeping the LED 2 embedded in the light transmittance resin 4. The lend holder 3 has a plurality of bottom hooks 31 respectively hooked on the peripheral bottom notches 53 of the heat sink 5, and a center opening 32. The optical lens 33 is fastened to the center opening 32 of the lens holder 3. Further, a locating frame 6 is sandwiched between the heat sink 5 and the lens holder 3, having a center opening 61 correspondin- to the center openina i2 of the lens holder 3, and 1plurality a Tof inside notciiecu 62 iiiut I I Idllli accommodate the upright rods 511 respectively.
In the aforesaid embodiments, the lens holder 3 and the optical lens 33 are two independent members. Alternatively, the optical lens 33 can be formed integral with the lens holder 3. If desired, the lens holder 3 and the optical lens 33 can be eliminated from the LED module. Further, the LED module can be made carrying two or more LEDs 2.
Although particular embodiments of the invention have been described in detail for purposes of illustration, various modifications and enhancements may be made without departing from the spirit and scope of the invention.
module in accordance with the first embodinient of the present invention.
FIG. 4 is an exploded view of a LED module in accordance with a second embodiment of the present invention.
FIG. 5 is a sectional assembly view of the LED module in accordance with the second embodiment of the present invention.
FIG. 6 is a perspective assembly view of the LED
module in accordance with the second embodiment of the present invention.
FIG. 7 is an exploded view of a LED module in accordance with a third embodiment of the present invention.
FIG. 8 is sectional assembly view of the LED module in accordance with the third embodiment of the present invention.
FIG. 9 is a perspective assembly view of the LED
module in accordance with the third embodiment of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
ReferrinQ to FIGS. 1-3, a LED module in accordance with a first embodiment of the present invention is shown comprisin~ a heat sink 1, a LED (Li~ht Emitting Diode) 2 mounted in the heat S:nk 1, n n:l u 1Pnc hnlder ? fa3te.~.ed t~ tl:e ~
ww heat sink 1 and holding an optical lens 33 corresponding to the LED 2. The heat sink 1 has a top recess 11, a groove 12 fornzed in the top recess 11 for the mounting of the LED 2, and a plurality of mountina through holes 13 cut throuah the top and bottom sides. Further, the top surface of the heat sink 1 is covered with an insulation layer A. Further, a plurality of metal conducting plates 131 are respectively fastened to the heat sink 1. The metal conducting plates 131 each have an upright shank 132 respectively inserted from the bottom side of the heat sink 1 into the mountin- through holes 13. After insertion of the upright shanks 132 into the mounting through holes 13, the top ends 133 of the upright shanks 132 are hammered down to affix the upright shanks 132 to the heat sink 1. Further, lead wires 21 are respectively connected between the positive and negative electrodes of the LED 2 and the upright shanks 132 of the metal conductina plates 131. A light transmittance resin 4 is molded on the top recess 11 over the LED 2, keepina the LED 2 embedded in the light transmittance resin 4. The lend holder 3 has a plurality of bottom hooks 31 respectively hooked on the bottom ed(ye of the heat sink 1, and a center opening 32. The optical lens 33 is fastened to the center openin- 32 of the lens holder 3. The heat sink 1 is made out of a metal material, for . I I I I Y 111 .
example, gold, silver, copper, iron, aluminum, or their alloy that transfers heat energy efficiently. Further, a metal thin film 121 may be directly bonded to the aroove 12 that is not covered by the insulative layer A so that the LED 2 can be directly fastened to the metal thin film 121. Durinc, the operation, heat energy is quickly transferred from the LED 2 to the heat sink 1 through the metal thin film 121 (see FIG. 2A). The metal thin film 121 can be a film of nickel gold alloy, nickel silver alloy, or nickel copper alloy.
FIGS. 4-6 show a LED module in accordance with a second embodiment of the present invention. This embodiment is substantially similar to the aforesaid first embodiment with the exception that the heat sink 1 has a plurality of peripheral notches 14 for securing the bottom hooks 31 of the lens holder 3.
Further, the heat sink 1 has only two mountina through holes 13 for the mounting of two metal conducting plates 131.
FIGS. 7-9 show a LED module in accordance with a third embodiment of the present invention. Accordinc, to this embodiment, the LED module comprises a heat sink 5, a LED
(Light Emitting Diode) 2 mounted in the heat sink 5, and a lens liolder 3 fastened to the heat sink 5 and holdina an optical lens A1V IVKL J1L1 / LLJ I.L LV ~.L.. L
33 correspondinb t.o the LED 2. The A~+ c;~k e r., ., +~p n'l.r Y
recess 52 for the mountinc, of the LED 2, a plurality of top border recesses 51 spaced around the top center recess 52, an upriQht rod 511 respectively disposed in each top border recess 51, and a plurality of peripheral bottom notches 53. Further, the top surface of the heat sink 5 is covered with an insulation layer A. Further, a plurality of metal conducting plates 512 are respectively fastened to the top border recesses 51 of the heat sink 5 and extended to the periphery of the heat sink 5. The imetal conducting plates 512 each have a vertical through hole 513 respectively coupled to the upright rod 511. Further, lead wires 21 are respectively connected between the positive and negative electrodes of the LED 2 and the metal conducting plates 512. A light transmittance resin 4 is molded on the top side of the heat sink 5 over the LED 2, keeping the LED 2 embedded in the light transmittance resin 4. The lend holder 3 has a plurality of bottom hooks 31 respectively hooked on the peripheral bottom notches 53 of the heat sink 5, and a center opening 32. The optical lens 33 is fastened to the center opening 32 of the lens holder 3. Further, a locating frame 6 is sandwiched between the heat sink 5 and the lens holder 3, having a center opening 61 correspondin- to the center openina i2 of the lens holder 3, and 1plurality a Tof inside notciiecu 62 iiiut I I Idllli accommodate the upright rods 511 respectively.
In the aforesaid embodiments, the lens holder 3 and the optical lens 33 are two independent members. Alternatively, the optical lens 33 can be formed integral with the lens holder 3. If desired, the lens holder 3 and the optical lens 33 can be eliminated from the LED module. Further, the LED module can be made carrying two or more LEDs 2.
Although particular embodiments of the invention have been described in detail for purposes of illustration, various modifications and enhancements may be made without departing from the spirit and scope of the invention.
Claims (12)
1. A LED module comprising:
a heat sink, said heat sink having a top recess in a top side thereof, a groove in said top recess, and a plurality of mounting through holes cut through top and bottom sides thereof and spaced around said groove;
at least one light emitting diode respectively fixedly mounted in said groove of said heat sink;
a plurality of metal conduction plates affixed to said heat sink at a bottom side, said metal conducting plates each having an upright shank respectively affixed to the mounting through holes of said heat sink;
a plurality of lead wires respectively connected between said metal conduction plates and positive and negative terminals of said at last one light emitting diode; and a light transmittance resin molded on said groove of said heat sink and covering said light emitting diode.
a heat sink, said heat sink having a top recess in a top side thereof, a groove in said top recess, and a plurality of mounting through holes cut through top and bottom sides thereof and spaced around said groove;
at least one light emitting diode respectively fixedly mounted in said groove of said heat sink;
a plurality of metal conduction plates affixed to said heat sink at a bottom side, said metal conducting plates each having an upright shank respectively affixed to the mounting through holes of said heat sink;
a plurality of lead wires respectively connected between said metal conduction plates and positive and negative terminals of said at last one light emitting diode; and a light transmittance resin molded on said groove of said heat sink and covering said light emitting diode.
2. The LED module as claimed in claim 1, further comprising a lens holder fastened to said heat sink to hold an optical lens over said light transmittance resin, said lens holder having a plurality of bottom hooks respectively hooked on a bottom edge of said heat sink.
3. The LED module as claimed in claim 2, wherein said lens holder has a center opening for accommodating said optical lens.
4. The LED module as claimed in claim 1, further comprising an insulative layer covered on at least one part of said heat sink.
5. The LED module as claimed in claim 1, wherein said heat sink is made of a metal material of high coefficient of heat transfer.
6. The LED module as claimed in claim 1, further comprising a lens holder fastened to said heat sink, said lens holder having a plurality of bottom hooks respectively hooked on a bottom edge of said heat sink, and an optical lens formed integral with said lens holder and covered over said light transmittance resin.
7. A LED module comprising:
a heat sink, said heat sink having a top side, a top groove in said top side, an insulative layer covered on the outside surface thereof beyond said groove;
a metal thin film covered on said top groove;
at least one light emitting diode respectively fixedly on said metal thin film;
a plurality of metal conduction plates affixed to said heat sink:
a plurality of lead wires respectively connected between said metal conduction plates and positive and negative terminals of said at last one light emitting diode; and a light transmittance resin molded on said groove of said heat sink and covering said light emitting diode.
a heat sink, said heat sink having a top side, a top groove in said top side, an insulative layer covered on the outside surface thereof beyond said groove;
a metal thin film covered on said top groove;
at least one light emitting diode respectively fixedly on said metal thin film;
a plurality of metal conduction plates affixed to said heat sink:
a plurality of lead wires respectively connected between said metal conduction plates and positive and negative terminals of said at last one light emitting diode; and a light transmittance resin molded on said groove of said heat sink and covering said light emitting diode.
8. A LED module comprising:
a heat sink, said heat sink having a top side covered with an insulative layer, a top center recess formed on said top side, a plurality of top border recesses formed on said top side and spaced around said top center recess, and a plurality of upright rods respectively upwardly extending from said top side in said top border recesses;
at least one light emitting diode respectively fixedly mounted in said top center recess;
a plurality of metal conduction plates respectively fastened to the top border recesses of said heat sink, said metal conducting plates each having a vertical through hole respectively fastened to said upright rods of said heat sink;
a plurality of lead wires respectively connected between said metal conduction plates and positive and negative terminals of said at last one light emitting diode: and a light transmittance resin molded on said groove of said heat sink and covering said light emitting diode.
a heat sink, said heat sink having a top side covered with an insulative layer, a top center recess formed on said top side, a plurality of top border recesses formed on said top side and spaced around said top center recess, and a plurality of upright rods respectively upwardly extending from said top side in said top border recesses;
at least one light emitting diode respectively fixedly mounted in said top center recess;
a plurality of metal conduction plates respectively fastened to the top border recesses of said heat sink, said metal conducting plates each having a vertical through hole respectively fastened to said upright rods of said heat sink;
a plurality of lead wires respectively connected between said metal conduction plates and positive and negative terminals of said at last one light emitting diode: and a light transmittance resin molded on said groove of said heat sink and covering said light emitting diode.
9. The LED module as claimed in claim 8, further comprising a lens holder fastened to said heat sink and holding an optical lens over said light transmittance resin.
10. The LED module as claimed in claim 9, further comprising a locating frame sandwiched in between said lens holder and said heat sink, said locating frame having a center opening corresponding said light transmittance resin and a plurality of inside notches that accommodate said upright rods of said heat sink respectively.
11. The LED module as claimed in claim 8, wherein said heat sink is made of a metal material of high coefficient of heat transfer.
12. The LED module as claimed in claim 8, further comprising a lens holder fastened to said heat sink, said lens holder having a plurality of bottom hooks respectively hooked on a bottom edge of said heat sink, and an optical lens formed integral with said lens holder and covered over said light transmittance resin.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200620131462.8 | 2006-09-06 | ||
| CN 200620131462 CN200956373Y (en) | 2006-09-06 | 2006-09-06 | Light-emitting diode radiating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2586342A1 true CA2586342A1 (en) | 2008-03-06 |
Family
ID=38774956
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA 2586342 Abandoned CA2586342A1 (en) | 2006-09-06 | 2007-04-27 | Led module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN200956373Y (en) |
| CA (1) | CA2586342A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10591124B2 (en) | 2012-08-30 | 2020-03-17 | Sabic Global Technologies B.V. | Heat dissipating system for a light, headlamp assembly comprising the same, and method of dissipating heat |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101226976B (en) * | 2007-10-09 | 2012-01-04 | 番禺得意精密电子工业有限公司 | LED device and locating structure thereof |
| JP5325197B2 (en) * | 2010-11-30 | 2013-10-23 | 豊田合成株式会社 | Light emitting device and manufacturing method thereof |
| CN102109134B (en) * | 2011-04-02 | 2011-12-28 | 泉州万明光电有限公司 | Street lamp adopting LED light source |
| JP5768664B2 (en) * | 2011-11-02 | 2015-08-26 | 富士電機株式会社 | Semiconductor device assembly method and semiconductor device assembly jig |
| CN103390714B (en) * | 2013-07-10 | 2015-10-28 | 陕西光电科技有限公司 | A kind of all-in-one-piece LED encapsulation structure and method for packing |
-
2006
- 2006-09-06 CN CN 200620131462 patent/CN200956373Y/en not_active Expired - Fee Related
-
2007
- 2007-04-27 CA CA 2586342 patent/CA2586342A1/en not_active Abandoned
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10591124B2 (en) | 2012-08-30 | 2020-03-17 | Sabic Global Technologies B.V. | Heat dissipating system for a light, headlamp assembly comprising the same, and method of dissipating heat |
Also Published As
| Publication number | Publication date |
|---|---|
| CN200956373Y (en) | 2007-10-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Dead |