CN210006754U

CN210006754U - LED support capable of improving luminous effect

Info

Publication number: CN210006754U
Application number: CN201920567422.5U
Authority: CN
Inventors: 林宪登; 陈建华
Original assignee: BOLUO CHENGCHUANG PRECISION INDUSTRY Co Ltd
Current assignee: BOLUO CHENGCHUANG PRECISION INDUSTRY Co Ltd
Priority date: 2019-04-24
Filing date: 2019-04-24
Publication date: 2020-01-31
Anticipated expiration: 2029-04-24

Abstract

The utility model discloses an LED support that can improve luminous effect, including the plastic main part with inlay in the conductive terminal of plastic main part, this plastic main part has reflection of light cup, conductive terminal is including 0 terminal and second terminal, the fixed brilliant portion of this 1 terminal and second terminal extends in the middle part of the side direction reflection of light cup of connecting portion respectively, the extension width W1 of the solid brilliant portion of this terminal and the extension width W2 of the solid brilliant portion of second terminal are equal, like this the soldering tin wafer realizes luminous on every solid brilliant portion, compare in the technique that a plurality of wafers of soldering tin realize luminous on the solid brilliant portion of the same conductive terminal in the past, the light source can not gather in side for reflection of light cup light source is more balanced, improve the luminous effect of its light source, can also guarantee every solid brilliant portion can in time to every wafer heat dissipation, can improve a plurality of wafer welding in the past effectively and lead to the unable radiating problem in time of radiating on the same solid brilliant portion.

Description

LED support capable of improving luminous effect

Technical Field

The utility model belongs to the technical field of the LED support technique and specifically relates to indicate LED supports that can improve luminous effect.

Background

An LED (Light Emitting Diode) is kinds of solid semiconductor devices, which can directly convert electricity into Light, and has many advantages of small size, low power consumption, long service life, high brightness, low heat, environmental protection, firmness and durability, etc., and is the most ideal Light source.

However, in the case of the technology of soldering a plurality of chips to die-bonding portions with and , a plurality of chips are soldered to the same die-bonding portions at , which results in that the plurality of chips can only be located at a position on the left or right of the bottom of the reflector cup, resulting in a poor light-emitting effect of the reflector cup, and in addition, heat of the plurality of chips is simultaneously accumulated on the same die-bonding portions at , resulting in a situation that the die-bonding portions cannot dissipate heat in time.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model discloses to the disappearance that prior art exists, its main objective provides kinds of LED supports that can improve luminous effect, and its structure sets up rationally, has effectively low solved in the past LED support have luminous effect not good and solid brilliant portion can't in time radiating problem.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

LED support capable of improving luminous effect comprises a plastic main body and a conductive terminal embedded in the plastic main body, wherein the plastic main body is provided with a reflective cup, the conductive terminal comprises a die bonding part, a connecting part and a pin, the front surface of the die bonding part is exposed at the bottom of the reflective cup, the connecting part is embedded in the plastic main body, and the pin is exposed at the side surface of the plastic main body;

the conductive terminal comprises an th terminal and a second terminal, the die bonding part of each terminal extends from the side of the connecting part to the middle part of the reflector cup, and the extending width W1 of the die bonding part of the terminal is equal to the extending width W2 of the die bonding part of the second terminal.

the preferred scheme is that the bottom of the die bonding part and the connecting part of the conductive terminal is provided with a th card glue concave position.

As preferred solutions, the th glue recess is a stepped structure which is gradually thinned outwards.

it is preferable that the bottom of side face of terminal and the bottom of the second terminal adjacent to the die bonding part are provided with a second card glue concave position.

As preferred schemes, the second card glue concave position is a step structure which is designed to be gradually thinned outwards.

Preferably , a third card glue concave position is arranged on the side surface of the connection part between the connection part and the die bonding part.

Preferably , the front surface of the connecting part is provided with at least three anti-seepage grooves, the is located in the middle of the connecting part, the second is located at the connecting part of the connecting part and the die bonding part, and the third is located at the connecting part of the connecting part and the pin.

it is preferable that the connecting part is provided with a glue clamping hole.

preferable schemes are that the reflecting cup is rectangular, the top of the reflecting cup is larger than the bottom of the reflecting cup to form an inclined plane structure with the inner side surface, and four corners of the reflecting cup are provided with guide inclined planes.

it is preferable that the terminal and the second terminal are mirror images.

Compared with the prior art, the utility model has obvious advantages and beneficial effects, particularly, can know by above-mentioned technical scheme that through setting up terminal and second terminal, this terminal is equal to the width W1 that extends to the middle part of the reflection cup and the width W2 that extends to the middle part of the reflection cup with the second terminal, realize luminous in the solid brilliant portion of every go up soldering tin wafer, compare in the past and realize luminous technique in a plurality of wafers of soldering tin on the solid brilliant portion of the same conductive terminal, the light source can not gather in side, make reflection cup reflection light source more balanced, improve the luminous effect of its light source, can also guarantee every solid brilliant portion can be in time to every wafer heat dissipation, can improve the problem that a plurality of wafers welded in the past lead to in time radiating on the solid brilliant portion of the same effectively;

secondly, can make conductive terminal and plastic main part inlay the shaping back through card glue concave position, second card glue concave position and the third card that sets up on conductive terminal, the plastic can bury in corresponding card glues concave position, can make conductive terminal and plastic main part inlay more firmly, prevents that the condition of plastic main part and conductive terminal separation can appear when the product is die-cut.

To illustrate the structural features and functions of the present invention more clearly, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.

Drawings

Fig. 1 is a schematic perspective view of a preferred embodiment of the present invention.

Fig. 2 is an exploded view of the preferred embodiment of the present invention.

Fig. 3 is a further angle exploded view of the preferred embodiment of the present invention.

Fig. 4 is a top view of the preferred embodiment of the present invention.

The attached drawings indicate the following:

10. plastic main body 11 and reflecting cup

111. Guide inclined plane 20 and conductive terminal

201. th terminal 202, second terminal

21. Die bonding part 211 and th glue clamping concave position

212. Second glue groove 213 and third glue groove

22. Connecting part 221 and anti-seepage groove

222. A glue clamping hole 23 and a pin.

Detailed Description

Referring to fig. 1 to 4, which show the specific structure of the preferred embodiment of the present invention, kinds of LED holders capable of improving the light emitting effect include a plastic main body 10 and conductive terminals 20 embedded in the plastic main body 10.

The plastic main body 10 is provided with reflective cups 11, in this embodiment, the reflective cups 11 are arranged in a rectangular structure, the top of the reflective cups 11 is larger than the bottom to form an inner side surface, the inner side surface is arranged in an inclined plane structure, the four corners of the reflective cups 11 are provided with guide inclined planes 111, and the reflective effect of the reflective cups arranged in the inclined plane structure can be improved.

The conductive terminal 20 comprises a die bonding portion 21, a connecting portion 22 and a pin 23, wherein the front surface of the die bonding portion 21 is exposed at the bottom of the reflector 11, the connecting portion 22 is embedded in the plastic body 10, and the pin 23 is exposed at the side surface of the plastic body 10, wherein the conductive terminal 20 comprises a -th terminal 201 and a second terminal 202, the die bonding portion 21 of each terminal extends from the side of the connecting portion 22 to the middle of the reflector 11, the extension width W1 of the die bonding portion 21 of the terminal 201 is equal to the extension width W2 of the die bonding portion 21 of the second terminal 202, and the terminal 201 and the second terminal 202 which extend to the middle are arranged in a mirror image.

In this embodiment, the bottom of the die bonding portion 21 and the bottom of the connecting portion 22 of the conductive terminal 20 are provided with th glue recesses 211, the bottom of the side surface of the th terminal 201 adjacent to the die bonding portion 21 of the second terminal 202 is provided with second glue recesses 212, the side surface of the connecting portion 22 and the die bonding portion 21 is provided with third glue recesses 213, and the th glue recesses 211 and the second glue recesses 212 are of a step structure which is gradually thinned outwards.

And the front surface of the connecting part 22 is at least provided with three anti-seepage grooves 221, the th strip is positioned in the middle of the connecting part 22, the second strip is positioned at the connecting part of the connecting part 22 and the die bonding part 21, and the third strip is positioned at the connecting part of the connecting part 22 and the pin 23, and the connecting part 22 is provided with a clamping glue hole 222 in a penetrating way.

The utility model has the design key points that the th terminal 201 and the 202 th terminal are arranged, the width W1 of the th terminal 201 extending to the middle part of the reflection cup 11 is equal to the width W2 of the second terminal 202 extending to the middle part of the reflection cup 11, the soldering tin wafer on every crystal fixing part 21 realizes luminescence, compared with the prior art that the luminescence is realized by soldering a plurality of wafers on the crystal fixing part of the same conductive terminals, the light source can not be gathered at the side, so that the reflection light source of the reflection cup is more balanced, the luminescence effect of the light source is improved, the crystal fixing part of every can radiate heat of every wafer in time, and the problem that the plurality of wafers are welded on the same crystal fixing part to cause the heat radiation in time in the past can be effectively improved;

secondly, glue concave position 211, second glue concave position 212 and third glue concave position 213 arranged on the conductive terminal can make the conductive terminal 20 and the plastic main body 10 embedded and formed, and the plastic can be embedded into the corresponding glue concave position, so that the conductive terminal 20 and the plastic main body 10 can be embedded more firmly, and the separation of the plastic main body 10 and the conductive terminal 20 can be prevented when the product is punched.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any slight modifications, equivalent changes and modifications made by the technical spirit of the present invention to the above embodiments are all within the scope of the technical solution of the present invention.

Claims

The utility model provides a LED support that can improve luminous effect, including plastic main part (10) and inlay conductive terminal (20) in plastic main part (10), this plastic main part (10) has reflection of light cup (11), conductive terminal (20) are including solid brilliant portion (21), connecting portion (22) and pin (23), the front of this solid brilliant portion (21) is exposed in the bottom of reflection of light cup (11), connecting portion (22) are inlayed in plastic main part (10), pin (23) are exposed in the side of plastic main part (10), its characterized in that:

the conductive terminal (20) comprises an th terminal (201) and a second terminal (202), a die bonding part (21) of each terminal extends from the side of the connecting part (22) to the middle part of the light reflecting cup (11), and the extending width W1 of the die bonding part (21) of the th terminal (201) is equal to the extending width W2 of the die bonding part (21) of the second terminal (202).
2. The LED support capable of improving the light emitting effect according to claim 1, wherein the bottom of the die bonding portion (21) and the connecting portion (22) of the conductive terminal (20) is provided with an th glue clamping concave (211).
3. The LED support capable of improving the luminous effect according to claim 2, wherein the th glue concave part (211) is a stepped structure which is gradually thinned outwards.
4. The LED support capable of improving the light-emitting effect according to claim 1, wherein the bottoms of the side surfaces of the th terminal (201) and the second terminal (202) adjacent to the die bonding portion (21) are provided with second glue recesses (212).
5. The LED support capable of improving the luminous effect of claim 4, wherein: the second clamping glue concave position (212) is of a broken difference type structure which is gradually thinned outwards.
6. The LED support of claim 1, wherein: and a third card glue concave position (213) is arranged on the side surface of the joint between the connecting part (22) and the die bonding part (21).
7. The LED support capable of improving the luminous effect according to claim 1, wherein the front surface of the connecting portion (22) is provided with at least three anti-permeation grooves (221), the is located in the middle of the connecting portion (22), the second is located at the joint of the connecting portion (22) and the die bonding portion (21), and the third is located at the joint of the connecting portion (22) and the pin (23).
8. The LED support of claim 1, wherein: the connecting part (22) is provided with a clamping glue hole (222) in a penetrating way.
9. The LED support of claim 1, wherein: the reflecting cup (11) is arranged in a rectangular structure, and the inner side surface of the reflecting cup (11) formed by the top part of the reflecting cup is larger than the bottom part of the reflecting cup is arranged in an inclined plane structure; the four corners of the reflecting cup (11) are provided with guide inclined planes (111).
10. The LED support capable of improving the luminous effect according to claim 1, wherein the th terminal (201) and the second terminal (202) are arranged in a mirror image.