CA2499585C - Junction between a microstrip line and a waveguide - Google Patents
Junction between a microstrip line and a waveguide Download PDFInfo
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- CA2499585C CA2499585C CA2499585A CA2499585A CA2499585C CA 2499585 C CA2499585 C CA 2499585C CA 2499585 A CA2499585 A CA 2499585A CA 2499585 A CA2499585 A CA 2499585A CA 2499585 C CA2499585 C CA 2499585C
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- 239000000758 substrate Substances 0.000 claims abstract description 44
- 238000001465 metallisation Methods 0.000 claims abstract description 16
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
- H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
- H01P5/107—Hollow-waveguide/strip-line transitions
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- Waveguides (AREA)
- Structure Of Printed Boards (AREA)
- Waveguide Connection Structure (AREA)
- Non-Reversible Transmitting Devices (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Tires In General (AREA)
- Automatic Analysis And Handling Materials Therefor (AREA)
Abstract
The invention relates to a configuration for a junction between a microstrip line and a waveguide, comprising: a microstrip line (ML), which is placed on the top side of a dielectric substrate (S); a waveguide, which is placed on the top side of the substrate (S) and which has an opening (OB) on at least one face and on a step-like structure (ST) provided on a lateral wall in the vicinity of the opening (OB) while, in at least one part (ST1), being conductively connected to the microstrip line (ML), whereby a lateral wall of the waveguide is a metallized layer (LS) provided on the substrate (S); a recess (A), which is made in the metallized layer (LS) and into which the microstrip line (ML) protrudes; a rear side metallization (RM) provided on the rear side of the substrate (S), and; electrically conductive through connections (VH) between the metallized layer (LS) on the top side of the substrate (S) and the rear side metallization (RM) that surround the recess (A).
Description
JUNCTION BETWEEN MICROSTRIP LINE AND A WAVEGUIDE
The invention relates to a function between a microstipline and a waveguide.
In many extra-high frequency technology applications, in particular for millimetric wave technology, it is necessary to inject a wave which has been carried in a microstripline into a waveguide, and vice versa. In this case, the junction should be as free of reflections and losses as possible. This junction ensures, within a limited frequency range, that the impedances between the waveguide and the stripline are matched to one another, and that the field pattern of the first waveguide type is transferred to the field pattern of the other waveguide type.
Microstripline/waveguide junctions are known, for example, from DE 197 41 944 Al or US 6,265,950 B1.
DE 197 41 944 Al describes an arrangement in which the microstripline is applied to the upper face of the substrate (Figure 1). An end surface of the waveguide HL is fitted on the lower face of the substrate S. The substrate S has an aperture D in the area of the waveguide HL, which aperture D corresponds essentially to the cross section of the waveguide HL. A coupling element (not illustrated) is arranged on the microstripline ML and projects into the aperture D. The aperture D is surrounded on the upper face of the substrate S by a screening cap SK, which is electrically conductively connected by means of electrically conductive drilled holes (via holes) VH to the metallization RM on the lower face of the substrate S.
This arrangement has the disadvantage that the printed circuit board must be mounted conductively on a prepared mounting plate containing the waveguide HL. In addition, a precision manufactured shielding cap SK, which is mechanically positioned with precision and must be applied conductively, is required. The production of this arrangement is time-consuming and costly owing to the large number of different types of processing steps. Further disadvantages result from the large amount of space required as a result of the waveguide being arranged outside the printed circuit board.
In the arrangement described in US 6,265,950 E31 for a junction between a microstripline and a waveguide, the substrate with the microstripline applied to it projects into the waveguide. One disadvantage of this arrangement is the integration of the waveguide in a printed circuit board environment. The waveguide can be arranged only on the boundary surfaces of the printed circuit board (substrate). The waveguide cannot be integrated within the printed circuit board, because of the costly preparation of the printed circuit board.
The object of the invention is to specify an arrangement for a junction between a microstripline and a waveguide, which can be produced easily and at low cost and which occupies only a small amount of space.
2a The arrangement according to the invention for a junction between a microstripline and a waveguide comprises:
a microstripline which is fitted on the upper face of a dielectric substrate, a waveguide which is fitted on the upper face of the substrate and has an opening on at least one end surface and has a structure which is in the form of a step or steps in the area of the opening on one side wall and is conductively connected in at least one part to the microstripline, and wherein one side wall of the waveguide is a metallized layer formed on the substrate, a cutout which is formed in the metallized layer and into which the microstripline projects, rear-face metallization which is formed on the rear face of the substrate, and electrically conductive via holes between the metallized layer on the upper face of the substrate and the rear-face metallization, which surround the cutout.
One advantage of the arrangement according to the invention is that the microstrip/waveguide junction can be produced easily and at low cost. The production of the junction requires fewer components than the prior art. A further advantage is that the implementation of the waveguide in the printed circuit board environment need not be at the edge of the printed circuit board as in the case of the US 6,265,950 but can be provided at any desired point on the printed circuit board. The arrangement according to the invention thus occupies little space.
The waveguide is advantageously a surface mounted device. The waveguide part is for this purpose fitted to and conductively connected to the printed circuit board from above in a single fitting step. The connection of the waveguide to the junction can thus be integrated in known component placement methods. This saves manufacturing steps, thus reducing the production costs and time.
The invention as well as further advantageous refinements of the arrangement according to the invention will be explained in more detail in the following text with reference to the drawings, in which:
Figure 1 shows a longitudinal section through an arrangement for a microstrip/waveguide junction according to the prior art, Figure 2 shows a plan view of the metallized layer on the upper face of the substrate, Figure 3 shows a perspective view of an example of an internal structure, which is in the form of a step or steps, for the surface mounted device, Figure 4 shows a longitudinal section through an arrangement according to the invention for a microstrip/waveguide junction, Figure 5 shows a first cross section through the area 3 in Figure 4, Figure 6 shows a second cross section through the area 4 in Figure 4, Figure 7 shows a third cross section through the area 5 in Figure 4, Figure 8 shows a fourth cross section through the area 6 in Figure 4, and Figure 9 shows a further advantageous embodiment of the microstrip/waveguide junction according to the invention.
Figure 2 shows a plan view of the metallized layer of the substrate. This metallized layer is also referred to as a land structure for the microstrip/waveguide junction. The land structure LS has a cutout A with an -opening OZ. The microstripline ML runs through this opening OZ and ends within the cutout A. The cutout A
is surrounded by via holes VH. These via holes VH are electrically conductive apertures in the substrate, 5 connecting the land structure LS to the rear-face metallization (not illustrated) on the rear face of the substrate. The distance between the via holes VH is chosen to be sufficiently short that the radiated emission of the electromagnetic wave through the intermediate spaces is small within the useful frequency range. The via holes VH may in this case advantageously also run in a number of rows, which are arranged parallel to one another, in order to reduce the radiated emission.
Figure 3 shows a perspective illustration of an example of an internal structure, which is in the form of a step or steps, for the surface mounted device. The component B likewise has an opening OB, corresponding to the opening in the cutout in the land structure (see Figure 2). A structure ST1, ST, which is in the form of a step or steps or steps, is formed in the longitudinal direction of the component, at a distance which can be predetermined from the opening OB on the side wall.
That side wall of the component B which contains the stepped structure ST1 and ST is opposite the substrate surface after installation of the land structure LS
(see Figure 4). The waveguide component B to be fitted is open at the bottom (in the direction of the substrate) before being fitted, and is thus still incomplete. The side wall which is still missing is formed by the land structure LS on the substrate.
The arrangement according to the invention is, furthermore, not restricted by the number of steps illustrated in Figure 3 or Figure 4. The number, length and width of the individual steps in the structure ST
can be matched to the respective requirements of the junction. It is, of course, also possible to provide a continuous junction.
In the illustration shown, the step annotated with the reference symbol ST1 is of such a height that, when the component B is fitted to the land structure as shown in Figure 2 in an interlocking manner, the step ST1 rests directly on the microstripline ML, thus making an electrically conductive connection between the microstropline ML and the component B.
Figure 4 shows a longitudinal section through an l0 arrangement according to the invention of a microstrip/waveguide junction. In this case, the component B as shown in Figure 3 is fitted in an interlocking manner to the land structure LS. The component B is in this case fitted, in particular, to the substrate in such a way that an electrically conductive connection is made between the land structure and the component B.
On the lower face, the substrate S has an essentially continuous metallic coating RM. The waveguide area is annotated with the reference symbol HB in the 20 illustration. The junction area is annotated with the reference symbol UB.
The microstrip/waveguide junction according to the invention operates on the following principle:
the radio-frequency signal outside the waveguide HL is passed through a microstripline ML with the impedance Zo (area 1) . The radio-frequency signal within the 6a waveguide HL is carried in the form of the TE10 basic waveguide mode. The junction UB converts the field pattern of the microstrip mode in steps to the field pattern of the waveguide mode. At the same time, by virtue of the steps in the component B the junction UB
transforms the characteristic impedance and ensures that the impedance Zo is matched, within the useful frequency range, to the impedance ZHL of the waveguide HL. This allows a low-loss and low-reflection junction between the two waveguides.
First of all, the microstripline ML leads into the area 2 of a so-called cutoff channel. This channel is formed from the component B, the rear-face metallization RM
and the via holes VH, which create a conductive connection between the component B and the rear-face metallization RM. The width of the cutoff channel is chosen such that no additional wave type other than the signal-carrying microstrip mode can propagate in this area 2. The length of the channel determines the attenuation of the undesirable waveguide mode which cannot propagate, and prevents radiated emissions into free space (area 1).
In the area 3, the microstripline ML is located in a type of partially filled waveguide. The waveguide is formed from the component B, the rear-face metallization RM and the via holes VH (Figure 5). The structure of the component B, which is in the form of a step or steps or steps, is connected in the area 4 to the microstripline ML (Figure 6). The side walls of the component B are conductively connected to the rear face metallization RM of the substrate S by means of a so-called shielding row of via holes VH.
This results in the formation of a dielectrically loaded ridge waveguide. The signal energy is concentrated between the rear-face metallization RM and the ridge which is formed from the microstripline ML
and that of the step ST1 of the component B.
In comparison to the area 4, the height of the stepped structure ST contained in the component B decreases in the area 5, so that a defined air gap L is formed between the substrate material and the stepped structure ST when the component B is connected in an interlocking manner to the land structure LS on the substrate S (Figure 7). The side walls of the component B are conductively connected to the rear-face metallization RM through via holes VH. This results in a partially filled, dielectrically loaded ridge waveguide.
The width of the step widens for the purpose of gradually matching the field pattern from area 4 to the field pattern of the waveguide mode (area 6). The length, width and height of the steps are chosen such that the impedance of the microstrip mode Zo is transformed to the impedance of the waveguide mode Z.
at the end of the area 6. If required, the number of steps in the structure of the component B in the area 5 can also be increased, or a continuously tapered ridge may be used.
The area 6 illustrates the waveguide area HB. The component B forms the side walls and the cover of the waveguide HL. The waveguide base is formed by the land structure LS on the substrate S, that is to say, in comparison to the area 5, there is now no dielectric filling in the waveguide HL.
One or more shielding rows of via holes VH in the junction area between the area 5 and the area 6, which run transversely with respect to the propagation direction of the wave in the waveguide, provide the junction between the partially dielectrically filled waveguide and the purely air-filled waveguide. At the same time, these shielding rows prevent the signal from being injected between the land structure LS and the rear-face metallization.
A stepped structure (analogous to the stepped structure in the area 5) can optionally also be provided in the area 6 in the cap upper part.
The length and height of these steps is chosen analogously to the area 5, so that, in combination with the other areas, the impedance of the microstrip mode Zo is transformed to the impedance ZHL for the waveguide mode at the end of the area 6.
Figure 9 shows a further advantageous embodiment of the microstrip/waveguide junction according to the invention. This embodiment makes it possible to provide a simple and low-cost waveguide junction in which the radio-frequency signal can be output through the substrate S downwards through the continuous waveguide to opening DB which is contained in the substrate. The waveguide opening DB advantageously has electrically conductive internal walls (IW). The component B
advantageously has a stepped shape ST in the area of the aperture DB on the side wall opposite the waveguide opening DB. This stepped shape ST deflects the wave in the waveguide through 900 from the waveguide area HB of the component B into the waveguide opening DB in the substrate S. A further waveguide or a radiating element, for example, can be arranged on the lower face 20 of the substrate S, in the area of the waveguide opening DB. In the present example shown in Figure 9, a further support material TP, for example a printed circuit board having one or more layers or a metal mount, is fitted to the rear-face metallization RM. In comparison to DE 197 41 944 Al, the advantage of this arrangement is the simplified, more cost-effective design of the substrate S and of the support material TP. The waveguide opening is milled all the way through, and the internal walls are electrochemically 9a metallized. Both process steps are standard processes which are normally used in printed circuit board technology and can be carried out easily.
The invention relates to a function between a microstipline and a waveguide.
In many extra-high frequency technology applications, in particular for millimetric wave technology, it is necessary to inject a wave which has been carried in a microstripline into a waveguide, and vice versa. In this case, the junction should be as free of reflections and losses as possible. This junction ensures, within a limited frequency range, that the impedances between the waveguide and the stripline are matched to one another, and that the field pattern of the first waveguide type is transferred to the field pattern of the other waveguide type.
Microstripline/waveguide junctions are known, for example, from DE 197 41 944 Al or US 6,265,950 B1.
DE 197 41 944 Al describes an arrangement in which the microstripline is applied to the upper face of the substrate (Figure 1). An end surface of the waveguide HL is fitted on the lower face of the substrate S. The substrate S has an aperture D in the area of the waveguide HL, which aperture D corresponds essentially to the cross section of the waveguide HL. A coupling element (not illustrated) is arranged on the microstripline ML and projects into the aperture D. The aperture D is surrounded on the upper face of the substrate S by a screening cap SK, which is electrically conductively connected by means of electrically conductive drilled holes (via holes) VH to the metallization RM on the lower face of the substrate S.
This arrangement has the disadvantage that the printed circuit board must be mounted conductively on a prepared mounting plate containing the waveguide HL. In addition, a precision manufactured shielding cap SK, which is mechanically positioned with precision and must be applied conductively, is required. The production of this arrangement is time-consuming and costly owing to the large number of different types of processing steps. Further disadvantages result from the large amount of space required as a result of the waveguide being arranged outside the printed circuit board.
In the arrangement described in US 6,265,950 E31 for a junction between a microstripline and a waveguide, the substrate with the microstripline applied to it projects into the waveguide. One disadvantage of this arrangement is the integration of the waveguide in a printed circuit board environment. The waveguide can be arranged only on the boundary surfaces of the printed circuit board (substrate). The waveguide cannot be integrated within the printed circuit board, because of the costly preparation of the printed circuit board.
The object of the invention is to specify an arrangement for a junction between a microstripline and a waveguide, which can be produced easily and at low cost and which occupies only a small amount of space.
2a The arrangement according to the invention for a junction between a microstripline and a waveguide comprises:
a microstripline which is fitted on the upper face of a dielectric substrate, a waveguide which is fitted on the upper face of the substrate and has an opening on at least one end surface and has a structure which is in the form of a step or steps in the area of the opening on one side wall and is conductively connected in at least one part to the microstripline, and wherein one side wall of the waveguide is a metallized layer formed on the substrate, a cutout which is formed in the metallized layer and into which the microstripline projects, rear-face metallization which is formed on the rear face of the substrate, and electrically conductive via holes between the metallized layer on the upper face of the substrate and the rear-face metallization, which surround the cutout.
One advantage of the arrangement according to the invention is that the microstrip/waveguide junction can be produced easily and at low cost. The production of the junction requires fewer components than the prior art. A further advantage is that the implementation of the waveguide in the printed circuit board environment need not be at the edge of the printed circuit board as in the case of the US 6,265,950 but can be provided at any desired point on the printed circuit board. The arrangement according to the invention thus occupies little space.
The waveguide is advantageously a surface mounted device. The waveguide part is for this purpose fitted to and conductively connected to the printed circuit board from above in a single fitting step. The connection of the waveguide to the junction can thus be integrated in known component placement methods. This saves manufacturing steps, thus reducing the production costs and time.
The invention as well as further advantageous refinements of the arrangement according to the invention will be explained in more detail in the following text with reference to the drawings, in which:
Figure 1 shows a longitudinal section through an arrangement for a microstrip/waveguide junction according to the prior art, Figure 2 shows a plan view of the metallized layer on the upper face of the substrate, Figure 3 shows a perspective view of an example of an internal structure, which is in the form of a step or steps, for the surface mounted device, Figure 4 shows a longitudinal section through an arrangement according to the invention for a microstrip/waveguide junction, Figure 5 shows a first cross section through the area 3 in Figure 4, Figure 6 shows a second cross section through the area 4 in Figure 4, Figure 7 shows a third cross section through the area 5 in Figure 4, Figure 8 shows a fourth cross section through the area 6 in Figure 4, and Figure 9 shows a further advantageous embodiment of the microstrip/waveguide junction according to the invention.
Figure 2 shows a plan view of the metallized layer of the substrate. This metallized layer is also referred to as a land structure for the microstrip/waveguide junction. The land structure LS has a cutout A with an -opening OZ. The microstripline ML runs through this opening OZ and ends within the cutout A. The cutout A
is surrounded by via holes VH. These via holes VH are electrically conductive apertures in the substrate, 5 connecting the land structure LS to the rear-face metallization (not illustrated) on the rear face of the substrate. The distance between the via holes VH is chosen to be sufficiently short that the radiated emission of the electromagnetic wave through the intermediate spaces is small within the useful frequency range. The via holes VH may in this case advantageously also run in a number of rows, which are arranged parallel to one another, in order to reduce the radiated emission.
Figure 3 shows a perspective illustration of an example of an internal structure, which is in the form of a step or steps, for the surface mounted device. The component B likewise has an opening OB, corresponding to the opening in the cutout in the land structure (see Figure 2). A structure ST1, ST, which is in the form of a step or steps or steps, is formed in the longitudinal direction of the component, at a distance which can be predetermined from the opening OB on the side wall.
That side wall of the component B which contains the stepped structure ST1 and ST is opposite the substrate surface after installation of the land structure LS
(see Figure 4). The waveguide component B to be fitted is open at the bottom (in the direction of the substrate) before being fitted, and is thus still incomplete. The side wall which is still missing is formed by the land structure LS on the substrate.
The arrangement according to the invention is, furthermore, not restricted by the number of steps illustrated in Figure 3 or Figure 4. The number, length and width of the individual steps in the structure ST
can be matched to the respective requirements of the junction. It is, of course, also possible to provide a continuous junction.
In the illustration shown, the step annotated with the reference symbol ST1 is of such a height that, when the component B is fitted to the land structure as shown in Figure 2 in an interlocking manner, the step ST1 rests directly on the microstripline ML, thus making an electrically conductive connection between the microstropline ML and the component B.
Figure 4 shows a longitudinal section through an l0 arrangement according to the invention of a microstrip/waveguide junction. In this case, the component B as shown in Figure 3 is fitted in an interlocking manner to the land structure LS. The component B is in this case fitted, in particular, to the substrate in such a way that an electrically conductive connection is made between the land structure and the component B.
On the lower face, the substrate S has an essentially continuous metallic coating RM. The waveguide area is annotated with the reference symbol HB in the 20 illustration. The junction area is annotated with the reference symbol UB.
The microstrip/waveguide junction according to the invention operates on the following principle:
the radio-frequency signal outside the waveguide HL is passed through a microstripline ML with the impedance Zo (area 1) . The radio-frequency signal within the 6a waveguide HL is carried in the form of the TE10 basic waveguide mode. The junction UB converts the field pattern of the microstrip mode in steps to the field pattern of the waveguide mode. At the same time, by virtue of the steps in the component B the junction UB
transforms the characteristic impedance and ensures that the impedance Zo is matched, within the useful frequency range, to the impedance ZHL of the waveguide HL. This allows a low-loss and low-reflection junction between the two waveguides.
First of all, the microstripline ML leads into the area 2 of a so-called cutoff channel. This channel is formed from the component B, the rear-face metallization RM
and the via holes VH, which create a conductive connection between the component B and the rear-face metallization RM. The width of the cutoff channel is chosen such that no additional wave type other than the signal-carrying microstrip mode can propagate in this area 2. The length of the channel determines the attenuation of the undesirable waveguide mode which cannot propagate, and prevents radiated emissions into free space (area 1).
In the area 3, the microstripline ML is located in a type of partially filled waveguide. The waveguide is formed from the component B, the rear-face metallization RM and the via holes VH (Figure 5). The structure of the component B, which is in the form of a step or steps or steps, is connected in the area 4 to the microstripline ML (Figure 6). The side walls of the component B are conductively connected to the rear face metallization RM of the substrate S by means of a so-called shielding row of via holes VH.
This results in the formation of a dielectrically loaded ridge waveguide. The signal energy is concentrated between the rear-face metallization RM and the ridge which is formed from the microstripline ML
and that of the step ST1 of the component B.
In comparison to the area 4, the height of the stepped structure ST contained in the component B decreases in the area 5, so that a defined air gap L is formed between the substrate material and the stepped structure ST when the component B is connected in an interlocking manner to the land structure LS on the substrate S (Figure 7). The side walls of the component B are conductively connected to the rear-face metallization RM through via holes VH. This results in a partially filled, dielectrically loaded ridge waveguide.
The width of the step widens for the purpose of gradually matching the field pattern from area 4 to the field pattern of the waveguide mode (area 6). The length, width and height of the steps are chosen such that the impedance of the microstrip mode Zo is transformed to the impedance of the waveguide mode Z.
at the end of the area 6. If required, the number of steps in the structure of the component B in the area 5 can also be increased, or a continuously tapered ridge may be used.
The area 6 illustrates the waveguide area HB. The component B forms the side walls and the cover of the waveguide HL. The waveguide base is formed by the land structure LS on the substrate S, that is to say, in comparison to the area 5, there is now no dielectric filling in the waveguide HL.
One or more shielding rows of via holes VH in the junction area between the area 5 and the area 6, which run transversely with respect to the propagation direction of the wave in the waveguide, provide the junction between the partially dielectrically filled waveguide and the purely air-filled waveguide. At the same time, these shielding rows prevent the signal from being injected between the land structure LS and the rear-face metallization.
A stepped structure (analogous to the stepped structure in the area 5) can optionally also be provided in the area 6 in the cap upper part.
The length and height of these steps is chosen analogously to the area 5, so that, in combination with the other areas, the impedance of the microstrip mode Zo is transformed to the impedance ZHL for the waveguide mode at the end of the area 6.
Figure 9 shows a further advantageous embodiment of the microstrip/waveguide junction according to the invention. This embodiment makes it possible to provide a simple and low-cost waveguide junction in which the radio-frequency signal can be output through the substrate S downwards through the continuous waveguide to opening DB which is contained in the substrate. The waveguide opening DB advantageously has electrically conductive internal walls (IW). The component B
advantageously has a stepped shape ST in the area of the aperture DB on the side wall opposite the waveguide opening DB. This stepped shape ST deflects the wave in the waveguide through 900 from the waveguide area HB of the component B into the waveguide opening DB in the substrate S. A further waveguide or a radiating element, for example, can be arranged on the lower face 20 of the substrate S, in the area of the waveguide opening DB. In the present example shown in Figure 9, a further support material TP, for example a printed circuit board having one or more layers or a metal mount, is fitted to the rear-face metallization RM. In comparison to DE 197 41 944 Al, the advantage of this arrangement is the simplified, more cost-effective design of the substrate S and of the support material TP. The waveguide opening is milled all the way through, and the internal walls are electrochemically 9a metallized. Both process steps are standard processes which are normally used in printed circuit board technology and can be carried out easily.
Claims (11)
1. An arrangement for a junction between a microstripline and a waveguide, comprising:
a microstripline which is fitted on an upper face of a dielectric substrate;
a waveguide which is fitted on the upper face of the substrate and has an opening on at least one end surface thereof and has a structure which is in the form of a step or steps in the area of the opening on one side wall and is conductively connected in at least one part to the microstripline, and wherein the one side wall of the waveguide is a metallized layer disposed on the substrate;
a cutout which is disposed in the metallized layer and into which the microstripline projects;
rear-face metallization which is disposed on a rear face of the substrate; and electrically conductive via holes between the metallized layer on the upper face of the substrate and the rear-face metallization, which surround the cutout
a microstripline which is fitted on an upper face of a dielectric substrate;
a waveguide which is fitted on the upper face of the substrate and has an opening on at least one end surface thereof and has a structure which is in the form of a step or steps in the area of the opening on one side wall and is conductively connected in at least one part to the microstripline, and wherein the one side wall of the waveguide is a metallized layer disposed on the substrate;
a cutout which is disposed in the metallized layer and into which the microstripline projects;
rear-face metallization which is disposed on a rear face of the substrate; and electrically conductive via holes between the metallized layer on the upper face of the substrate and the rear-face metallization, which surround the cutout
2. The arrangement as claimed in claim 1, wherein the structure which is in the form of a step or steps is disposed on a second side wall of the waveguide which is opposite the cutout.
3. The arrangement as claimed in claim 2, wherein the cutout has a waveguide opening in the area of the metallized layer on the upper face of the substrate.
4. The arrangement as claimed in claim 1, wherein a distance between the via holes is chosen such that the radiated emission of an electromagnetic wave in the useful frequency range through intermediate spaces is small, and the junction operates without increased losses or undesirable couplings.
5. The arrangement as claimed in claim 4, wherein the via holes run in a number of rows which are arranged parallel to one another.
6. The arrangement as claimed in claim 5, wherein a second side wall of the waveguide which is opposite the upper face of the substrate has the structure, which is in the form of the step or steps, in the area of the waveguide opening.
7. The arrangement as claimed in claim 5, wherein an inner surface of the waveguide opening is electrically conductive.
8. The arrangement as claimed in claim 1, wherein the cutout has a waveguide opening in the area of the metallized layer on the upper face of the substrate.
9. The arrangement as claimed in claim 8, wherein a second side wall of the waveguide which is opposite the upper face of the substrate has a structure, which is in the form of the step or steps, in the area of the waveguide opening.
10. The arrangement as claimed in claim 1, wherein the waveguide is a surface mounted device.
11. The arrangement as claimed in claim 9, wherein the structure which is in the form of the step or steps is disposed on the second side wall of the wave guide which is opposite the cutout.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10243671.1 | 2002-09-20 | ||
| DE10243671A DE10243671B3 (en) | 2002-09-20 | 2002-09-20 | Arrangement for transition between microstrip conductor, hollow conductor has one hollow conductor side wall as metallised coating on substrate with opening into which microstrip conductor protrudes |
| PCT/DE2003/002553 WO2004030142A1 (en) | 2002-09-20 | 2003-07-30 | Junction between a microstrip line and a waveguide |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2499585A1 CA2499585A1 (en) | 2004-04-08 |
| CA2499585C true CA2499585C (en) | 2011-02-15 |
Family
ID=31896216
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA2499585A Expired - Fee Related CA2499585C (en) | 2002-09-20 | 2003-07-30 | Junction between a microstrip line and a waveguide |
Country Status (15)
| Country | Link |
|---|---|
| US (1) | US7336141B2 (en) |
| EP (1) | EP1540762B1 (en) |
| JP (1) | JP4145876B2 (en) |
| KR (1) | KR100958790B1 (en) |
| CN (1) | CN100391045C (en) |
| AT (1) | ATE406672T1 (en) |
| AU (1) | AU2003257396B2 (en) |
| BR (1) | BR0306449A (en) |
| CA (1) | CA2499585C (en) |
| DE (2) | DE10243671B3 (en) |
| ES (1) | ES2312850T3 (en) |
| IL (1) | IL167325A (en) |
| NO (1) | NO20041694L (en) |
| PL (1) | PL207180B1 (en) |
| WO (1) | WO2004030142A1 (en) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7603097B2 (en) | 2004-12-30 | 2009-10-13 | Valeo Radar Systems, Inc. | Vehicle radar sensor assembly |
| US7680464B2 (en) * | 2004-12-30 | 2010-03-16 | Valeo Radar Systems, Inc. | Waveguide—printed wiring board (PWB) interconnection |
| US7752911B2 (en) | 2005-11-14 | 2010-07-13 | Vega Grieshaber Kg | Waveguide transition for a fill level radar |
| JP4365852B2 (en) * | 2006-11-30 | 2009-11-18 | 株式会社日立製作所 | Waveguide structure |
| WO2008069714A1 (en) * | 2006-12-05 | 2008-06-12 | Telefonaktiebolaget Lm Ericsson (Publ) | A surface-mountable waveguide arrangement |
| ATE504957T1 (en) * | 2007-11-30 | 2011-04-15 | Ericsson Telefon Ab L M | TRANSITION ARRANGEMENT FROM MICRO STRIP TO WAVEGUIDE |
| EP2224535B1 (en) * | 2007-12-28 | 2013-12-18 | Kyocera Corporation | High-frequency transmission line connection structure, wiring substrate, high-frequency module, and radar device |
| US8598961B2 (en) * | 2008-04-16 | 2013-12-03 | Telefonaktiebolaget L M Ericsson (Publ) | Waveguide transition for connecting U-shaped surface mounted waveguide parts through a dielectric carrier |
| CA2794675A1 (en) * | 2010-03-10 | 2011-09-15 | Huawei Technologies Co., Ltd. | Microstrip coupler |
| US9653796B2 (en) | 2013-12-16 | 2017-05-16 | Valeo Radar Systems, Inc. | Structure and technique for antenna decoupling in a vehicle mounted sensor |
| DE102014109120B4 (en) | 2014-06-30 | 2017-04-06 | Krohne Messtechnik Gmbh | microwave module |
| KR102674456B1 (en) * | 2017-01-26 | 2024-06-13 | 주식회사 케이엠더블유 | Transmission line - waveguide transition device |
| US10468736B2 (en) | 2017-02-08 | 2019-11-05 | Aptiv Technologies Limited | Radar assembly with ultra wide band waveguide to substrate integrated waveguide transition |
| DE102017214871A1 (en) | 2017-08-24 | 2019-02-28 | Astyx Gmbh | Transition from a stripline to a waveguide |
| KR101827952B1 (en) | 2017-10-18 | 2018-02-09 | 엘아이지넥스원 주식회사 | Millimeter wave compact radar system |
| KR101839045B1 (en) | 2017-10-18 | 2018-03-15 | 엘아이지넥스원 주식회사 | Structure for transmitting signal in millimeter wave system |
| KR101858585B1 (en) | 2018-03-15 | 2018-05-16 | 엘아이지넥스원 주식회사 | Apparatus for combining power in millimeter wave system |
| US11283162B2 (en) * | 2019-07-23 | 2022-03-22 | Veoneer Us, Inc. | Transitional waveguide structures and related sensor assemblies |
| US11757166B2 (en) * | 2020-11-10 | 2023-09-12 | Aptiv Technologies Limited | Surface-mount waveguide for vertical transitions of a printed circuit board |
| US11616306B2 (en) | 2021-03-22 | 2023-03-28 | Aptiv Technologies Limited | Apparatus, method and system comprising an air waveguide antenna having a single layer material with air channels therein which is interfaced with a circuit board |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4754239A (en) * | 1986-12-19 | 1988-06-28 | The United States Of America As Represented By The Secretary Of The Air Force | Waveguide to stripline transition assembly |
| JPH0590807A (en) * | 1991-09-27 | 1993-04-09 | Nissan Motor Co Ltd | Waveguide/strip line converter |
| JP2682589B2 (en) * | 1992-03-10 | 1997-11-26 | 三菱電機株式会社 | Coaxial microstrip line converter |
| JPH05283915A (en) * | 1992-03-31 | 1993-10-29 | Toshiba Corp | Waveguide-microstrip line converter |
| JPH08162810A (en) * | 1994-12-08 | 1996-06-21 | Nec Corp | Strip line waveguide conversion circuit |
| DE19636890C1 (en) * | 1996-09-11 | 1998-02-12 | Bosch Gmbh Robert | Transition from a waveguide to a strip line |
| DE19741944A1 (en) * | 1997-09-23 | 1999-03-25 | Daimler Benz Aerospace Ag | Microstrip-wave-guide junction |
| US5982250A (en) * | 1997-11-26 | 1999-11-09 | Twr Inc. | Millimeter-wave LTCC package |
| JP2002111312A (en) * | 2000-09-29 | 2002-04-12 | Hitachi Kokusai Electric Inc | Waveguide filter |
-
2002
- 2002-09-20 DE DE10243671A patent/DE10243671B3/en not_active Expired - Fee Related
-
2003
- 2003-07-30 CA CA2499585A patent/CA2499585C/en not_active Expired - Fee Related
- 2003-07-30 US US10/528,431 patent/US7336141B2/en not_active Expired - Fee Related
- 2003-07-30 CN CNB038222183A patent/CN100391045C/en not_active Expired - Fee Related
- 2003-07-30 KR KR1020057004819A patent/KR100958790B1/en not_active IP Right Cessation
- 2003-07-30 WO PCT/DE2003/002553 patent/WO2004030142A1/en active IP Right Grant
- 2003-07-30 ES ES03798047T patent/ES2312850T3/en not_active Expired - Lifetime
- 2003-07-30 PL PL374171A patent/PL207180B1/en not_active IP Right Cessation
- 2003-07-30 JP JP2004538686A patent/JP4145876B2/en not_active Expired - Fee Related
- 2003-07-30 BR BR0306449-2A patent/BR0306449A/en not_active IP Right Cessation
- 2003-07-30 DE DE50310414T patent/DE50310414D1/en not_active Expired - Lifetime
- 2003-07-30 AU AU2003257396A patent/AU2003257396B2/en not_active Ceased
- 2003-07-30 AT AT03798047T patent/ATE406672T1/en not_active IP Right Cessation
- 2003-07-30 EP EP03798047A patent/EP1540762B1/en not_active Expired - Lifetime
-
2004
- 2004-04-27 NO NO20041694A patent/NO20041694L/en not_active Application Discontinuation
-
2005
- 2005-03-08 IL IL167325A patent/IL167325A/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR20050057509A (en) | 2005-06-16 |
| CN100391045C (en) | 2008-05-28 |
| EP1540762A1 (en) | 2005-06-15 |
| EP1540762B1 (en) | 2008-08-27 |
| PL207180B1 (en) | 2010-11-30 |
| NO20041694L (en) | 2004-04-27 |
| WO2004030142A1 (en) | 2004-04-08 |
| CA2499585A1 (en) | 2004-04-08 |
| JP2005539461A (en) | 2005-12-22 |
| US20060145777A1 (en) | 2006-07-06 |
| IL167325A (en) | 2010-04-15 |
| DE50310414D1 (en) | 2008-10-09 |
| ATE406672T1 (en) | 2008-09-15 |
| CN1682404A (en) | 2005-10-12 |
| DE10243671B3 (en) | 2004-03-25 |
| AU2003257396B2 (en) | 2008-09-25 |
| ES2312850T3 (en) | 2009-03-01 |
| JP4145876B2 (en) | 2008-09-03 |
| KR100958790B1 (en) | 2010-05-18 |
| US7336141B2 (en) | 2008-02-26 |
| BR0306449A (en) | 2004-10-26 |
| PL374171A1 (en) | 2005-10-03 |
| AU2003257396A1 (en) | 2004-04-19 |
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| EEER | Examination request | ||
| MKLA | Lapsed |