CA2474054A1 - Appareil comprenant des composants de grande taille et de petite taille et son procede de fabrication - Google Patents
Appareil comprenant des composants de grande taille et de petite taille et son procede de fabrication Download PDFInfo
- Publication number
- CA2474054A1 CA2474054A1 CA002474054A CA2474054A CA2474054A1 CA 2474054 A1 CA2474054 A1 CA 2474054A1 CA 002474054 A CA002474054 A CA 002474054A CA 2474054 A CA2474054 A CA 2474054A CA 2474054 A1 CA2474054 A1 CA 2474054A1
- Authority
- CA
- Canada
- Prior art keywords
- conductive medium
- integrated circuit
- substrate
- scale component
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000000034 method Methods 0.000 title claims abstract description 103
- 239000000758 substrate Substances 0.000 claims abstract description 113
- 239000010409 thin film Substances 0.000 claims abstract description 25
- 239000004020 conductor Substances 0.000 claims description 45
- 239000012212 insulator Substances 0.000 claims description 38
- 230000008569 process Effects 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 13
- 239000010408 film Substances 0.000 claims description 12
- 230000008878 coupling Effects 0.000 claims description 9
- 238000010168 coupling process Methods 0.000 claims description 9
- 238000005859 coupling reaction Methods 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 238000007639 printing Methods 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- 229920001940 conductive polymer Polymers 0.000 claims description 6
- 239000002923 metal particle Substances 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 238000007650 screen-printing Methods 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 238000007766 curtain coating Methods 0.000 claims description 3
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- 238000010030 laminating Methods 0.000 claims description 2
- 238000000151 deposition Methods 0.000 claims 1
- 238000009413 insulation Methods 0.000 description 6
- 239000000654 additive Substances 0.000 description 5
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
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- 239000000084 colloidal system Substances 0.000 description 1
- 238000013036 cure process Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
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- 238000001182 laser chemical vapour deposition Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
- G06K19/07752—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna using an interposer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
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- H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
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- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
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- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
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- H01L2224/241—Disposition
- H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
- H01L2924/15155—Shape the die mounting substrate comprising a recess for hosting the device the shape of the recess being other than a cuboid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/15165—Monolayer substrate
Abstract
La présente invention porte sur la fabrication d'éléments sur un substrat. Selon une forme d'exécution, l'invention est un appareil comprenant une barrette dans laquelle est encastrée un circuit intégré pourvu d'une plage conductrice. L'appareil comprend également un support conducteur relié à la plage conductrice du circuit intégré. L'invention porte également sur un procédé visant à fixer un support conducteur à une barrette dans laquelle est encastré un circuit intégré de sorte que le support conducteur soit connecté électriquement au circuit intégré. Le procédé consiste à fixer un composant de grande taille au support conducteur de sorte que ceux-ci soient connectés électriquement. Cet appareil comprend également une couche de diélectrique à film mince formée sur une partie du circuit intégré et sur une partie du substrat.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US5619202A | 2002-01-23 | 2002-01-23 | |
US10/056,192 | 2002-01-23 | ||
PCT/US2003/002115 WO2003063211A1 (fr) | 2002-01-23 | 2003-01-23 | Appareil comprenant des composants de grande taille et de petite taille et son procede de fabrication |
Publications (1)
Publication Number | Publication Date |
---|---|
CA2474054A1 true CA2474054A1 (fr) | 2003-07-31 |
Family
ID=27609271
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002474054A Abandoned CA2474054A1 (fr) | 2002-01-23 | 2003-01-23 | Appareil comprenant des composants de grande taille et de petite taille et son procede de fabrication |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP1468443A1 (fr) |
JP (1) | JP2006504251A (fr) |
KR (1) | KR20040105705A (fr) |
CN (1) | CN1606796A (fr) |
AU (1) | AU2003205307B2 (fr) |
CA (1) | CA2474054A1 (fr) |
WO (1) | WO2003063211A1 (fr) |
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US7214569B2 (en) * | 2002-01-23 | 2007-05-08 | Alien Technology Corporation | Apparatus incorporating small-feature-size and large-feature-size components and method for making same |
US7253735B2 (en) | 2003-03-24 | 2007-08-07 | Alien Technology Corporation | RFID tags and processes for producing RFID tags |
US7230580B1 (en) * | 2003-08-29 | 2007-06-12 | National Semiconductor Corporation | Design of a two interconnect IC chip for a radio frequency identification tag and method for manufacturing same |
WO2005104756A2 (fr) | 2004-04-27 | 2005-11-10 | The Board Of Trustees Of The University Of Illinois | Dispositifs de formation de motifs composites pour lithographie molle |
WO2005122285A2 (fr) | 2004-06-04 | 2005-12-22 | The Board Of Trustees Of The University Of Illinois | Procedes et dispositifs permettant de fabriquer et d'assembler des elements a semi-conducteur imprimables |
US7943491B2 (en) | 2004-06-04 | 2011-05-17 | The Board Of Trustees Of The University Of Illinois | Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp |
US7799699B2 (en) | 2004-06-04 | 2010-09-21 | The Board Of Trustees Of The University Of Illinois | Printable semiconductor structures and related methods of making and assembling |
US8217381B2 (en) | 2004-06-04 | 2012-07-10 | The Board Of Trustees Of The University Of Illinois | Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics |
US7521292B2 (en) | 2004-06-04 | 2009-04-21 | The Board Of Trustees Of The University Of Illinois | Stretchable form of single crystal silicon for high performance electronics on rubber substrates |
US7688206B2 (en) | 2004-11-22 | 2010-03-30 | Alien Technology Corporation | Radio frequency identification (RFID) tag for an item having a conductive layer included or attached |
US7576656B2 (en) | 2005-09-15 | 2009-08-18 | Alien Technology Corporation | Apparatuses and methods for high speed bonding |
KR101519038B1 (ko) | 2007-01-17 | 2015-05-11 | 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 | 프린팅기반 어셈블리에 의해 제조되는 광학 시스템 |
CN102113089B (zh) | 2008-03-05 | 2014-04-23 | 伊利诺伊大学评议会 | 可拉伸和可折叠的电子器件 |
WO2010005707A1 (fr) | 2008-06-16 | 2010-01-14 | The Board Of Trustees Of The University Of Illinois | Circuits intégrés à film mince de nanotube de carbone d’échelle intermédiaire sur substrats en plastique flexibles |
US9289132B2 (en) | 2008-10-07 | 2016-03-22 | Mc10, Inc. | Catheter balloon having stretchable integrated circuitry and sensor array |
US8886334B2 (en) | 2008-10-07 | 2014-11-11 | Mc10, Inc. | Systems, methods, and devices using stretchable or flexible electronics for medical applications |
US8389862B2 (en) | 2008-10-07 | 2013-03-05 | Mc10, Inc. | Extremely stretchable electronics |
EP2430652B1 (fr) | 2009-05-12 | 2019-11-20 | The Board of Trustees of the University of Illionis | Ensembles imprimés de diodes électroluminescentes inorganiques microscopiques ultraminces pour dispositifs d'affichage déformables et semi-transparents |
US9723122B2 (en) | 2009-10-01 | 2017-08-01 | Mc10, Inc. | Protective cases with integrated electronics |
US10441185B2 (en) | 2009-12-16 | 2019-10-15 | The Board Of Trustees Of The University Of Illinois | Flexible and stretchable electronic systems for epidermal electronics |
US9936574B2 (en) | 2009-12-16 | 2018-04-03 | The Board Of Trustees Of The University Of Illinois | Waterproof stretchable optoelectronics |
JP6046491B2 (ja) | 2009-12-16 | 2016-12-21 | ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ | コンフォーマル電子機器を使用した生体内での電気生理学 |
CN102892356B (zh) | 2010-03-17 | 2016-01-13 | 伊利诺伊大学评议会 | 基于生物可吸收基质的可植入生物医学装置 |
US9442285B2 (en) | 2011-01-14 | 2016-09-13 | The Board Of Trustees Of The University Of Illinois | Optical component array having adjustable curvature |
WO2012158709A1 (fr) | 2011-05-16 | 2012-11-22 | The Board Of Trustees Of The University Of Illinois | Barrettes de del à gestion thermique assemblées par impression |
KR102000302B1 (ko) | 2011-05-27 | 2019-07-15 | 엠씨10, 인크 | 전자, 광학, 및/또는 기계 장치 및 시스템, 그리고 이를 제조하기 위한 방법 |
EP2713863B1 (fr) | 2011-06-03 | 2020-01-15 | The Board of Trustees of the University of Illionis | Réseau d'électrodes de surface conformables, multiplexées de manière active et à haute densité, pour un interfaçage avec le cerveau |
KR101979354B1 (ko) | 2011-12-01 | 2019-08-29 | 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 | 프로그램 변형을 실행하도록 설계된 과도 장치 |
CN105283122B (zh) | 2012-03-30 | 2020-02-18 | 伊利诺伊大学评议会 | 可共形于表面的可安装于附肢的电子器件 |
US9171794B2 (en) | 2012-10-09 | 2015-10-27 | Mc10, Inc. | Embedding thin chips in polymer |
CN104224167B (zh) * | 2014-09-21 | 2016-06-01 | 北京师范大学 | 一次性脑状态监测柔性贴片电极 |
BR112017025609A2 (pt) | 2015-06-01 | 2018-08-07 | The Board Of Trustees Of The University Of Illinois | sistemas eletrônicos miniaturizados com potência sem fio e capacidades de comunicação de campo próximo |
KR20180034342A (ko) | 2015-06-01 | 2018-04-04 | 더 보드 오브 트러스티즈 오브 더 유니버시티 오브 일리노이 | 대안적인 자외선 감지방법 |
US10925543B2 (en) | 2015-11-11 | 2021-02-23 | The Board Of Trustees Of The University Of Illinois | Bioresorbable silicon electronics for transient implants |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5545291A (en) * | 1993-12-17 | 1996-08-13 | The Regents Of The University Of California | Method for fabricating self-assembling microstructures |
JP4043601B2 (ja) * | 1998-06-04 | 2008-02-06 | 大日本印刷株式会社 | 非接触型icカードとその製造方法、非接触型icカード用基体 |
JP2001175837A (ja) * | 1999-12-22 | 2001-06-29 | Toppan Printing Co Ltd | Icカード |
US6606247B2 (en) * | 2001-05-31 | 2003-08-12 | Alien Technology Corporation | Multi-feature-size electronic structures |
-
2003
- 2003-01-23 KR KR10-2004-7011487A patent/KR20040105705A/ko not_active Application Discontinuation
- 2003-01-23 EP EP03703985A patent/EP1468443A1/fr not_active Withdrawn
- 2003-01-23 JP JP2003562978A patent/JP2006504251A/ja active Pending
- 2003-01-23 CN CNA038017814A patent/CN1606796A/zh active Pending
- 2003-01-23 WO PCT/US2003/002115 patent/WO2003063211A1/fr active Search and Examination
- 2003-01-23 CA CA002474054A patent/CA2474054A1/fr not_active Abandoned
- 2003-01-23 AU AU2003205307A patent/AU2003205307B2/en not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
KR20040105705A (ko) | 2004-12-16 |
JP2006504251A (ja) | 2006-02-02 |
CN1606796A (zh) | 2005-04-13 |
AU2003205307B2 (en) | 2009-03-26 |
WO2003063211A1 (fr) | 2003-07-31 |
EP1468443A1 (fr) | 2004-10-20 |
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