CA2443754A1 - Composition d'interface thermique a changement de phase presentant une propriete de liaison induite - Google Patents

Composition d'interface thermique a changement de phase presentant une propriete de liaison induite Download PDF

Info

Publication number
CA2443754A1
CA2443754A1 CA002443754A CA2443754A CA2443754A1 CA 2443754 A1 CA2443754 A1 CA 2443754A1 CA 002443754 A CA002443754 A CA 002443754A CA 2443754 A CA2443754 A CA 2443754A CA 2443754 A1 CA2443754 A1 CA 2443754A1
Authority
CA
Canada
Prior art keywords
composition
heat
weight
paraffin
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002443754A
Other languages
English (en)
Inventor
Gary E. Flynn
Raymond G. Freuler (Deceased)
Robert A. Rauch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Henkel Loctite Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Loctite Corp filed Critical Henkel Loctite Corp
Publication of CA2443754A1 publication Critical patent/CA2443754A1/fr
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/26—Thermosensitive paints
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/01—Hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/02—Materials undergoing a change of physical state when used
    • C09K5/06—Materials undergoing a change of physical state when used the change of state being from liquid to solid or vice versa
    • C09K5/063—Materials absorbing or liberating heat during crystallisation; Heat storage materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)

Abstract

La présente invention concerne une composition à conductivité thermique améliorée et plus durable permettant le transfert thermique à partir d'un composant de dissipation thermique vers un dissipateur de chaleur et un procédé permettant de produire une telle composition. De préférence, la composition comporte une base de paraffine et, éventuellement, de la paraffine et de la vaseline présentant des particules en suspension en leur sein, qui préférablement comprennent du diamant de graphite, ou des métaux élémentaires tels que l'argent. Dans le mode de réalisation préféré, la composition comporte en outre une polymère de résine pour en augmenter la durabilité. La composition est préparée à être sous forme solide aux températures ambiantes normales, mais se liquéfie lorsqu'elle est soumise à des températures juste en dessous de la plage à laquelle des dispositifs semi-conducteurs électroniques chauffants fonctionnent habituellement. La présente invention concerne en outre des procédés de conditionnement des compositions de l'invention, ainsi que l'application de la composition à conductivité thermique à une interface entre un composant à dissipation de chaleur et un dissipateur de chaleur.
CA002443754A 2001-04-12 2002-03-13 Composition d'interface thermique a changement de phase presentant une propriete de liaison induite Abandoned CA2443754A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/834,158 US6869642B2 (en) 2000-05-18 2001-04-12 Phase change thermal interface composition having induced bonding property
US09/834,158 2001-04-12
PCT/US2002/007550 WO2002085339A1 (fr) 2001-04-12 2002-03-13 Composition d'interface thermique a changement de phase presentant une propriete de liaison induite

Publications (1)

Publication Number Publication Date
CA2443754A1 true CA2443754A1 (fr) 2002-10-31

Family

ID=25266244

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002443754A Abandoned CA2443754A1 (fr) 2001-04-12 2002-03-13 Composition d'interface thermique a changement de phase presentant une propriete de liaison induite

Country Status (8)

Country Link
US (2) US6869642B2 (fr)
EP (1) EP1385491A1 (fr)
JP (1) JP2004537163A (fr)
KR (1) KR100852070B1 (fr)
CN (1) CN1290963C (fr)
CA (1) CA2443754A1 (fr)
MX (1) MXPA03009363A (fr)
WO (1) WO2002085339A1 (fr)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10009678C1 (de) * 2000-02-29 2001-07-19 Siemens Ag Wärmeleitende Klebstoffverbindung und Verfahren zum Herstellen einer wärmeleitenden Klebstoffverbindung
US7473995B2 (en) * 2002-03-25 2009-01-06 Intel Corporation Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly
US7846778B2 (en) * 2002-02-08 2010-12-07 Intel Corporation Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly
US6858157B2 (en) * 2003-04-17 2005-02-22 Vnaderbilt University Compositions with nano-particle size diamond powder and methods of using same for transferring heat between a heat source and a heat sink
US20050072334A1 (en) * 2003-10-07 2005-04-07 Saint-Gobain Performance Plastics, Inc. Thermal interface material
US20050245852A1 (en) * 2004-04-30 2005-11-03 Ellefson Kimberly L System and method for providing therapy to an area of a body
US20070032610A1 (en) * 2005-08-08 2007-02-08 General Electric Company Energy responsive composition and associated method
JP5069876B2 (ja) 2006-07-13 2012-11-07 新光電気工業株式会社 半導体モジュールおよび放熱板
JP5430645B2 (ja) * 2008-03-20 2014-03-05 ディーエスエム アイピー アセッツ ビー．ブイ． 熱伝導性プラスチック材料のヒートシンク
WO2009129237A1 (fr) * 2008-04-15 2009-10-22 Jbc Technologies, Inc. Système de distribution de matériau d'interface thermique
CN101508886B (zh) * 2009-03-18 2011-01-12 北京交通大学 一种储热相变材料及其制造方法
CN102505574B (zh) * 2011-10-21 2013-09-18 中国科学院合肥物质科学研究院 一种智能节能氧化石墨烯复合纸及其制备方法
EP2780775A4 (fr) * 2011-11-15 2015-08-26 Henkel IP & Holding GmbH Dispositifs électroniques assemblés avec des couches d'isolation thermique
CN104185825A (zh) * 2011-11-15 2014-12-03 汉高知识产权控股有限责任公司 装配有隔热层的电子设备
CN102917574B (zh) * 2012-10-24 2015-05-27 华为技术有限公司 导热垫、制造导热垫的方法、散热装置和电子设备
TWI657132B (zh) 2013-12-19 2019-04-21 德商漢高智慧財產控股公司 具有基質及經密封相變材料分散於其中之組合物及以其組裝之電子裝置
CN104018207B (zh) * 2014-05-19 2016-08-24 山东科技大学 阴极电泳树脂金刚石线锯制备及其超高压处理方法
CN104032357B (zh) * 2014-05-19 2016-08-24 山东科技大学 阴极电泳树脂金刚石线锯的制备方法
CN104388054A (zh) * 2014-11-04 2015-03-04 镇江新梦溪能源科技有限公司 一种新型复合有机储热材料及其制备方法
CN105348821A (zh) * 2015-11-06 2016-02-24 深圳德邦界面材料有限公司 一种高导热性能的相变石墨导热材料及制备方法
CN106893561A (zh) * 2015-12-17 2017-06-27 比亚迪股份有限公司 相变复合材料及电子设备
EP3524658B1 (fr) * 2016-10-07 2022-04-06 Showa Denko Materials Co., Ltd. Élément en résine et feuille l'utilisant, et matériau de stockage de chaleur et feuille de régulation thermique l'utilisant
US10531174B2 (en) * 2016-10-13 2020-01-07 Bose Corporation Earpiece employing cooling and sensation inducing materials
US10602250B2 (en) 2016-10-13 2020-03-24 Bose Corporation Acoustaical devices employing phase change materials
EP3522211B1 (fr) * 2018-01-31 2020-09-30 Nolato Silikonteknik AB Rouleau de distribution et son procédé de fabrication
US10968351B2 (en) 2018-03-22 2021-04-06 Momentive Performance Materials Inc. Thermal conducting silicone polymer composition
US10941251B2 (en) 2018-03-22 2021-03-09 Momentive Performance Materials Inc. Silicone polymer and composition comprising the same
US11472925B2 (en) 2018-03-22 2022-10-18 Momentive Performance Materials Inc. Silicone polymer
US11319414B2 (en) 2018-03-22 2022-05-03 Momentive Performance Materials Inc. Silicone polymer
KR20210016363A (ko) * 2018-05-31 2021-02-15 세키스이가가쿠 고교가부시키가이샤 방열 조성물, 방열 부재, 및 방열 부재용 필러 집합체
TWI731289B (zh) * 2018-12-24 2021-06-21 信紘科技股份有限公司 組合式散熱熱沉複合材料成品製造方法
US20220025241A1 (en) * 2020-07-27 2022-01-27 Google Llc Thermal interface material and method for making the same
CN112469239A (zh) * 2020-10-23 2021-03-09 广东工业大学 一种大尺寸金刚石散热片及其制备方法

Family Cites Families (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2799793A (en) 1952-10-31 1957-07-16 Gen Precision Lab Inc Electronic tube shield
US3013104A (en) 1957-07-18 1961-12-12 Video Instr Company Inc Heat bank for transistorized circuits
US3249680A (en) 1964-04-14 1966-05-03 Nat Beryllia Corp Insulating, heat-sink holder for transistors
GB1063743A (en) 1964-04-30 1967-03-30 Raymond Francis Furness Improvements in or relating to methods of and/or means for the storage of heat and/orheaters incorporating such storage means
US3463161A (en) 1965-04-13 1969-08-26 Stella Andrassy Temperature maintaining device
US3391242A (en) 1966-12-27 1968-07-02 Admiral Corp Transistor insulator with self-contained silicone grease supply
DE1283404B (de) 1967-02-16 1968-11-21 Philips Patentverwertung Gmbh Kuehlkoerperanordnung zur Kontaktkuehlung fuer elektrische Entladungsroehren
US3467547A (en) 1967-07-06 1969-09-16 Sun Oil Co Corrugated paperboard having improved wet strength properties
US3463140A (en) 1967-10-11 1969-08-26 Edward A Rollor Jr Container for heated liquids
US3819530A (en) 1968-07-15 1974-06-25 Sun Oil Co Stabilized wax emulsions
US3586102A (en) 1969-02-17 1971-06-22 Teledyne Inc Heat sink pillow
US3823089A (en) 1969-03-27 1974-07-09 J Ryan Heat storage composition
US3755610A (en) * 1971-09-15 1973-08-28 Hercules Inc Electrically conductive cable
US3887628A (en) 1973-02-23 1975-06-03 Diamond Shamrock Corp Methylene chloride stabilized with organic epoxides
US3972821A (en) 1973-04-30 1976-08-03 Amchem Products, Inc. Heat transfer composition and method of making
US4065908A (en) 1976-04-26 1978-01-03 Owens-Illinois, Inc. Method and apparatus for sealing tamper-indicating tabs to a container sidewall
US4139051A (en) 1976-09-07 1979-02-13 Rockwell International Corporation Method and apparatus for thermally stabilizing workpieces
US4199548A (en) 1977-06-10 1980-04-22 Toyo Ink Manufacturing Co., Ltd. Thermally diffusible composites
US4151547A (en) 1977-09-07 1979-04-24 General Electric Company Arrangement for heat transfer between a heat source and a heat sink
US4253983A (en) * 1978-03-16 1981-03-03 Blanie Marie J M P Paraffin compositions having improved heat reservoir
US4473113A (en) 1978-04-14 1984-09-25 Whitfield Fred J Methods and materials for conducting heat from electronic components and the like
US4299715A (en) 1978-04-14 1981-11-10 Whitfield Fred J Methods and materials for conducting heat from electronic components and the like
US4466483A (en) 1978-04-14 1984-08-21 Whitfield Fred J Methods and means for conducting heat from electronic components and the like
US4237086A (en) 1979-02-22 1980-12-02 Rockwell International Corporation Method for releasably mounting a substrate on a base providing heat transfer and electrical conduction
US4266267A (en) 1979-11-19 1981-05-05 General Electric Company Mounting arrangement for transistors and the like
DE3104623A1 (de) 1981-02-10 1982-08-26 Robert Bosch Gmbh, 7000 Stuttgart Verfahren zum befestigen von bauelementen mit flaechigen anschlusskontakten und bauelement hierfuer
FR2532515B1 (fr) * 1982-08-27 1985-12-13 Thomson Csf Procede de cablage automatise a panne vibrante et machine de cablage utilisant un tel procede
US4722960A (en) * 1983-01-18 1988-02-02 Loctite Corporation Aluminum filled compositions
DE3400014A1 (de) * 1984-01-02 1985-07-18 Henkel KGaA, 4000 Düsseldorf Entschaeumer fuer waessrige dispersionen und loesungen von kunstharzen
DE3580514D1 (de) * 1984-05-30 1990-12-20 Matsushita Electric Ind Co Ltd Waermeuebertragbare schicht und verfahren zur herstellung.
US4732815A (en) * 1984-08-20 1988-03-22 Dai Nippon Insatsu Kabushiki Kaisha Heat transfer sheet
US4797160A (en) * 1984-08-31 1989-01-10 University Of Dayton Phase change compositions
US4708812A (en) * 1985-06-26 1987-11-24 Union Carbide Corporation Encapsulation of phase change materials
US4855209A (en) * 1987-12-04 1989-08-08 Xerox Corporation Low melting encapsulated toners
US5094769A (en) * 1988-05-13 1992-03-10 International Business Machines Corporation Compliant thermally conductive compound
US5237086A (en) 1989-09-02 1993-08-17 Bayer Aktiengesellschaft Fungicidal derivatives of carbocyclic anilides
US5060114A (en) 1990-06-06 1991-10-22 Zenith Electronics Corporation Conformable pad with thermally conductive additive for heat dissipation
US6197859B1 (en) * 1993-06-14 2001-03-06 The Bergquist Company Thermally conductive interface pads for electronic devices
JP3585598B2 (ja) * 1995-08-25 2004-11-04 大日本印刷株式会社 熱転写シート
US5930893A (en) * 1996-05-29 1999-08-03 Eaton; Manford L. Thermally conductive material and method of using the same
US5931831A (en) 1996-07-09 1999-08-03 Linder; Gerald S. Dual-lumen suction catheter with smaller diameter vent lumen having multiple apertures therein
US5904796A (en) 1996-12-05 1999-05-18 Power Devices, Inc. Adhesive thermal interface and method of making the same
US5986884A (en) 1998-07-13 1999-11-16 Ford Motor Company Method for cooling electronic components
US5912805A (en) 1998-11-04 1999-06-15 Freuler; Raymond G. Thermal interface with adhesive
US20020098369A1 (en) * 1999-05-26 2002-07-25 Jason L. Sanders Phase change composition
US6616999B1 (en) * 2000-05-17 2003-09-09 Raymond G. Freuler Preapplicable phase change thermal interface pad

Also Published As

Publication number Publication date
CN1511028A (zh) 2004-07-07
US20040265495A1 (en) 2004-12-30
CN1290963C (zh) 2006-12-20
JP2004537163A (ja) 2004-12-09
EP1385491A1 (fr) 2004-02-04
KR100852070B1 (ko) 2008-08-13
US20050161632A1 (en) 2005-07-28
KR20030093313A (ko) 2003-12-06
US6869642B2 (en) 2005-03-22
MXPA03009363A (es) 2005-03-07
WO2002085339A1 (fr) 2002-10-31

Similar Documents

Publication Publication Date Title
US6869642B2 (en) Phase change thermal interface composition having induced bonding property
US10600714B2 (en) Methods for establishing thermal joints between heat spreaders or lids and heat sources
AU723258B2 (en) Conformal thermal interface material for electronic components
US7147367B2 (en) Thermal interface material with low melting alloy
CA2355171C (fr) Procede permettant d'appliquer un materiau d'interface thermique a changement de phase
EP1163483B1 (fr) Materiau thermoconducteur et son procede d'utilisation
CA2474740C (fr) Materiaux de gestion thermique presentant une dispersion au changement de phase
TW552690B (en) Clean release, phase change thermal interface
US20160315030A1 (en) Reusable thermoplastic thermal interface materials and methods for establishing thermal joints between heat sources and heat dissipating/removal structures
WO2003024724A2 (fr) Materiau d'interface thermique sec
US6652705B1 (en) Graphitic allotrope interface composition and method of fabricating the same
US6651331B2 (en) Method of establishing a thermal joint on a heat sink
JP4409118B2 (ja) 放熱部材形成用粒状材料及びその用途
JP2002217342A (ja) 相変化型放熱部材及びその製造方法、用途

Legal Events

Date Code Title Description
FZDE Discontinued