CA2380541A1 - Ecriture directe de dispositifs optiques en verre a base de silice faisant appel des lasers a impulsion femtoseconde - Google Patents

Ecriture directe de dispositifs optiques en verre a base de silice faisant appel des lasers a impulsion femtoseconde Download PDF

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Publication number
CA2380541A1
CA2380541A1 CA002380541A CA2380541A CA2380541A1 CA 2380541 A1 CA2380541 A1 CA 2380541A1 CA 002380541 A CA002380541 A CA 002380541A CA 2380541 A CA2380541 A CA 2380541A CA 2380541 A1 CA2380541 A1 CA 2380541A1
Authority
CA
Canada
Prior art keywords
focus
refractive index
substrate
scan
silica
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002380541A
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English (en)
Inventor
Nicholas F. Borrelli
Charlene M. Smith
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Corning Inc
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2380541A1 publication Critical patent/CA2380541A1/fr
Abandoned legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/04—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using optical elements ; using other beam accessed elements, e.g. electron or ion beam
    • G11C13/041—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using optical elements ; using other beam accessed elements, e.g. electron or ion beam using photochromic storage elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/04—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using optical elements ; using other beam accessed elements, e.g. electron or ion beam

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Optical Integrated Circuits (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

L'invention concerne des procédés d'écriture d'une structure de guidage de lumière dans un substrat en verre en vrac. Ce substrat est de préférence obtenu à partir d'une matière molle à base de silice présentant une température de recuit inférieure à environ 1380 DEG K. Un faisceau laser à impulsions est focalisé dans le substrat tandis que le foyer est déplacé par rapport au substrat le long d'un trajet de balayage à une vitesse de balayage efficace pour induire une augmentation de l'indice de réfraction de la matière le long du trajet. La matière ne subit pratiquement aucun dommage physique induit par le laser le long du trajet de balayage. Différents dispositifs optiques peut être obtenus grâce à ce procédé.
CA002380541A 1999-07-29 2000-07-28 Ecriture directe de dispositifs optiques en verre a base de silice faisant appel des lasers a impulsion femtoseconde Abandoned CA2380541A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14627499P 1999-07-29 1999-07-29
US60/146,274 1999-07-29
PCT/US2000/020446 WO2001009899A1 (fr) 1999-07-29 2000-07-28 Ecriture directe de dispositifs optiques en verre a base de silice faisant appel des lasers a impulsion femtoseconde

Publications (1)

Publication Number Publication Date
CA2380541A1 true CA2380541A1 (fr) 2001-02-08

Family

ID=22516612

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002380541A Abandoned CA2380541A1 (fr) 1999-07-29 2000-07-28 Ecriture directe de dispositifs optiques en verre a base de silice faisant appel des lasers a impulsion femtoseconde

Country Status (8)

Country Link
EP (1) EP1204977A4 (fr)
JP (1) JP2003506731A (fr)
KR (1) KR20020038707A (fr)
CN (1) CN1365500A (fr)
AU (1) AU6382700A (fr)
BR (1) BR0012797A (fr)
CA (1) CA2380541A1 (fr)
WO (1) WO2001009899A1 (fr)

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EP1358035A2 (fr) * 2000-08-21 2003-11-05 National Research Council Of Canada Procedes de creation de structures optiques dans des dielectriques par depot d'energie controle
JP4514999B2 (ja) * 2001-07-27 2010-07-28 株式会社フジクラ 光合分波器及び光合分波器の製造方法
JP4588269B2 (ja) * 2001-08-21 2010-11-24 株式会社フジクラ 光導波路部品の製造方法
DE10155492A1 (de) * 2001-11-13 2003-10-09 Univ Schiller Jena Verfahren zur Herstellung eines optischen Verzweigers, insbesondere eines Mehrfach-Strahlteilers, sowie verfahrensgemäß hergestellter Verzweiger
US6853785B2 (en) 2001-12-14 2005-02-08 3M Innovative Properties Co. Index modulation in glass using a femtosecond laser
JP2003321252A (ja) * 2002-04-25 2003-11-11 Japan Science & Technology Corp ガラス内部への分相領域の形成方法
US6950591B2 (en) 2002-05-16 2005-09-27 Corning Incorporated Laser-written cladding for waveguide formations in glass
DE10231463A1 (de) * 2002-07-05 2004-01-15 Laser- Und Medizin-Technologie Gmbh, Berlin Verfahren zur Mikrostrukturierung von Lichtwellenleitern zur Erzeugung von optischen Funktionselementen
CA2396831A1 (fr) * 2002-08-02 2004-02-02 Femtonics Corporation Dispositifs de microstructuration a guide d'ondes optiques avec pulses optiques de l'ordre de la femtoseconde
US7294454B1 (en) * 2002-09-30 2007-11-13 Translume, Inc. Waveguide fabrication methods and devices
US6941052B2 (en) 2002-12-19 2005-09-06 3M Innovative Properties Company Sensitized optical fiber method and article
DE10304382A1 (de) * 2003-02-03 2004-08-12 Schott Glas Photostrukturierbarer Körper sowie Verfahren zur Bearbeitung eines Glases und/oder einer Glaskeramik
EP1649323B1 (fr) * 2003-07-18 2015-11-18 Carl Zeiss SMS Ltd Procede permettant de corriger des variations dimensionnelles critiques dans un photomasque
US20050023473A1 (en) * 2003-08-01 2005-02-03 Burr Kent Charles System and method for reducing optical crosstalk in multi-anode photomultiplier tube
JP4992424B2 (ja) 2004-08-06 2012-08-08 住友電気工業株式会社 ｐ型半導体領域を形成する方法
TWI395978B (zh) 2004-12-03 2013-05-11 Ohara Kk 光學元件與製造光學元件的方法
WO2007046833A2 (fr) 2004-12-20 2007-04-26 Imra America, Inc. Source laser a impulsions avec compresseur a reseau ajustable
WO2007021022A1 (fr) 2005-08-16 2007-02-22 Ohara Inc. Structure et procede de fabrication correspondant
CN100424531C (zh) * 2006-08-07 2008-10-08 华中科技大学 一种用于制备聚合物光波导的专用直写装置
CN102005688A (zh) * 2010-09-17 2011-04-06 山东大学 在钕掺杂钒酸镥晶体内制备条形波导激光器件的方法
CN102466900B (zh) * 2010-11-04 2015-02-18 财团法人工业技术研究院 平面显示器的修补方法与系统
ITTO20110327A1 (it) * 2011-04-08 2012-10-09 Osai A S S R L Metodo di taglio laser intramateriale con profondita' di campo estesa
CN102785031B (zh) * 2012-08-15 2015-04-01 武汉隽龙科技有限公司 一种利用超短脉冲激光的透明材料切割方法及切割装置
CN103399377A (zh) * 2013-07-22 2013-11-20 西安电子科技大学 飞秒激光直写蓝宝石环形光波导及其制备方法
CN104345386A (zh) * 2013-08-02 2015-02-11 宜兴新崛起光集成芯片科技有限公司 一种玻璃基光波导芯片激光内雕工艺
GB2527553B (en) * 2014-06-25 2017-08-23 Fianium Ltd Laser processing
CN104216047A (zh) * 2014-09-26 2014-12-17 南京先进激光技术研究院 基于自聚焦成丝的超短脉冲激光制备光波导器件的方法
RU2578747C1 (ru) * 2014-12-24 2016-03-27 Общество С Ограниченной Ответственностью "Оптосистемы" Способ формирования оболочки волноводной структуры в прозрачном объемном материале и оболочка волноводной структуры
CN104767106A (zh) * 2015-04-17 2015-07-08 山东大学 一种铒掺杂钇铝石榴石晶体镶套光波导放大器及其制备方法
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10134657B2 (en) 2016-06-29 2018-11-20 Corning Incorporated Inorganic wafer having through-holes attached to semiconductor wafer
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
CN106125166B (zh) * 2016-07-22 2018-04-10 中国工程物理研究院激光聚变研究中心 原位调控材料微结构制备熔石英微透镜阵列的方法
DE102017002986B4 (de) * 2016-12-13 2019-08-29 AIXLens GmbH Verfahren zur Herstellung einer transmitiven Optik und Intraokularlinse
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
CN109590602B (zh) * 2017-09-28 2022-02-15 福州高意光学有限公司 一种制作非球面的方法
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
CN109445017A (zh) * 2019-01-02 2019-03-08 京东方科技集团股份有限公司 导光板及其制作方法、背光模组和显示装置
CN111922512B (zh) * 2020-06-12 2021-12-31 杭州奥创光子技术有限公司 一种工业化贝塞尔脉冲激光系统及其制造方法
JP7540506B2 (ja) 2020-12-01 2024-08-27 富士通株式会社 量子回路の製造方法

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Also Published As

Publication number Publication date
CN1365500A (zh) 2002-08-21
KR20020038707A (ko) 2002-05-23
JP2003506731A (ja) 2003-02-18
EP1204977A4 (fr) 2003-08-13
BR0012797A (pt) 2003-07-15
WO2001009899A1 (fr) 2001-02-08
AU6382700A (en) 2001-02-19
EP1204977A1 (fr) 2002-05-15

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