KR20020038707A - 펨토 초 펄스 레이저를 이용하여 실리카에 기초한 유리광학 디바이스의 직접 기입방법 - Google Patents
펨토 초 펄스 레이저를 이용하여 실리카에 기초한 유리광학 디바이스의 직접 기입방법 Download PDFInfo
- Publication number
- KR20020038707A KR20020038707A KR1020027001193A KR20027001193A KR20020038707A KR 20020038707 A KR20020038707 A KR 20020038707A KR 1020027001193 A KR1020027001193 A KR 1020027001193A KR 20027001193 A KR20027001193 A KR 20027001193A KR 20020038707 A KR20020038707 A KR 20020038707A
- Authority
- KR
- South Korea
- Prior art keywords
- focus
- substrate
- scan
- laser
- path
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/04—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using optical elements ; using other beam accessed elements, e.g. electron or ion beam
- G11C13/041—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using optical elements ; using other beam accessed elements, e.g. electron or ion beam using photochromic storage elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/04—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using optical elements ; using other beam accessed elements, e.g. electron or ion beam
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Optical Integrated Circuits (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Lasers (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14627499P | 1999-07-29 | 1999-07-29 | |
US60/146,274 | 1999-07-29 | ||
PCT/US2000/020446 WO2001009899A1 (fr) | 1999-07-29 | 2000-07-28 | Ecriture directe de dispositifs optiques en verre a base de silice faisant appel des lasers a impulsion femtoseconde |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20020038707A true KR20020038707A (ko) | 2002-05-23 |
Family
ID=22516612
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020027001193A KR20020038707A (ko) | 1999-07-29 | 2000-07-28 | 펨토 초 펄스 레이저를 이용하여 실리카에 기초한 유리광학 디바이스의 직접 기입방법 |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP1204977A4 (fr) |
JP (1) | JP2003506731A (fr) |
KR (1) | KR20020038707A (fr) |
CN (1) | CN1365500A (fr) |
AU (1) | AU6382700A (fr) |
BR (1) | BR0012797A (fr) |
CA (1) | CA2380541A1 (fr) |
WO (1) | WO2001009899A1 (fr) |
Cited By (6)
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US10756003B2 (en) | 2016-06-29 | 2020-08-25 | Corning Incorporated | Inorganic wafer having through-holes attached to semiconductor wafer |
US11062986B2 (en) | 2017-05-25 | 2021-07-13 | Corning Incorporated | Articles having vias with geometry attributes and methods for fabricating the same |
US11078112B2 (en) | 2017-05-25 | 2021-08-03 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
US11114309B2 (en) | 2016-06-01 | 2021-09-07 | Corning Incorporated | Articles and methods of forming vias in substrates |
US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
US11774233B2 (en) | 2016-06-29 | 2023-10-03 | Corning Incorporated | Method and system for measuring geometric parameters of through holes |
Families Citing this family (37)
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US6796148B1 (en) | 1999-09-30 | 2004-09-28 | Corning Incorporated | Deep UV laser internally induced densification in silica glasses |
JP3531738B2 (ja) * | 2000-02-22 | 2004-05-31 | 日本電気株式会社 | 屈折率の修正方法、屈折率の修正装置、及び光導波路デバイス |
US6884960B2 (en) | 2000-08-21 | 2005-04-26 | National Research Council Of Canada | Methods for creating optical structures in dielectrics using controlled energy deposition |
JP4514999B2 (ja) * | 2001-07-27 | 2010-07-28 | 株式会社フジクラ | 光合分波器及び光合分波器の製造方法 |
JP4588269B2 (ja) * | 2001-08-21 | 2010-11-24 | 株式会社フジクラ | 光導波路部品の製造方法 |
DE10155492A1 (de) * | 2001-11-13 | 2003-10-09 | Univ Schiller Jena | Verfahren zur Herstellung eines optischen Verzweigers, insbesondere eines Mehrfach-Strahlteilers, sowie verfahrensgemäß hergestellter Verzweiger |
US6853785B2 (en) | 2001-12-14 | 2005-02-08 | 3M Innovative Properties Co. | Index modulation in glass using a femtosecond laser |
JP2003321252A (ja) * | 2002-04-25 | 2003-11-11 | Japan Science & Technology Corp | ガラス内部への分相領域の形成方法 |
US6950591B2 (en) | 2002-05-16 | 2005-09-27 | Corning Incorporated | Laser-written cladding for waveguide formations in glass |
DE10231463A1 (de) * | 2002-07-05 | 2004-01-15 | Laser- Und Medizin-Technologie Gmbh, Berlin | Verfahren zur Mikrostrukturierung von Lichtwellenleitern zur Erzeugung von optischen Funktionselementen |
CA2396831A1 (fr) * | 2002-08-02 | 2004-02-02 | Femtonics Corporation | Dispositifs de microstructuration a guide d'ondes optiques avec pulses optiques de l'ordre de la femtoseconde |
US7294454B1 (en) * | 2002-09-30 | 2007-11-13 | Translume, Inc. | Waveguide fabrication methods and devices |
US6941052B2 (en) | 2002-12-19 | 2005-09-06 | 3M Innovative Properties Company | Sensitized optical fiber method and article |
DE10304382A1 (de) * | 2003-02-03 | 2004-08-12 | Schott Glas | Photostrukturierbarer Körper sowie Verfahren zur Bearbeitung eines Glases und/oder einer Glaskeramik |
US7736819B2 (en) * | 2003-07-18 | 2010-06-15 | Pixer Technology Ltd | Method for correcting critical dimension variations in photomasks |
US20050023473A1 (en) * | 2003-08-01 | 2005-02-03 | Burr Kent Charles | System and method for reducing optical crosstalk in multi-anode photomultiplier tube |
CN1993807B (zh) * | 2004-08-06 | 2010-05-05 | 住友电气工业株式会社 | 形成p型半导体区域的方法及半导体元件 |
TWI395978B (zh) | 2004-12-03 | 2013-05-11 | Ohara Kk | 光學元件與製造光學元件的方法 |
EP1851837B1 (fr) | 2004-12-20 | 2015-03-04 | Imra America, Inc. | Source laser a impulsions avec compresseur a reseau ajustable |
US8097337B2 (en) | 2005-08-16 | 2012-01-17 | Ohara Inc. | Structure and manufacturing method of the same |
CN100424531C (zh) * | 2006-08-07 | 2008-10-08 | 华中科技大学 | 一种用于制备聚合物光波导的专用直写装置 |
CN102005688A (zh) * | 2010-09-17 | 2011-04-06 | 山东大学 | 在钕掺杂钒酸镥晶体内制备条形波导激光器件的方法 |
CN102466900B (zh) * | 2010-11-04 | 2015-02-18 | 财团法人工业技术研究院 | 平面显示器的修补方法与系统 |
ITTO20110327A1 (it) * | 2011-04-08 | 2012-10-09 | Osai A S S R L | Metodo di taglio laser intramateriale con profondita' di campo estesa |
CN102785031B (zh) * | 2012-08-15 | 2015-04-01 | 武汉隽龙科技有限公司 | 一种利用超短脉冲激光的透明材料切割方法及切割装置 |
CN103399377A (zh) * | 2013-07-22 | 2013-11-20 | 西安电子科技大学 | 飞秒激光直写蓝宝石环形光波导及其制备方法 |
CN104345386A (zh) * | 2013-08-02 | 2015-02-11 | 宜兴新崛起光集成芯片科技有限公司 | 一种玻璃基光波导芯片激光内雕工艺 |
GB2527553B (en) * | 2014-06-25 | 2017-08-23 | Fianium Ltd | Laser processing |
CN104216047A (zh) * | 2014-09-26 | 2014-12-17 | 南京先进激光技术研究院 | 基于自聚焦成丝的超短脉冲激光制备光波导器件的方法 |
RU2578747C1 (ru) * | 2014-12-24 | 2016-03-27 | Общество С Ограниченной Ответственностью "Оптосистемы" | Способ формирования оболочки волноводной структуры в прозрачном объемном материале и оболочка волноводной структуры |
CN104767106A (zh) * | 2015-04-17 | 2015-07-08 | 山东大学 | 一种铒掺杂钇铝石榴石晶体镶套光波导放大器及其制备方法 |
CN106125166B (zh) * | 2016-07-22 | 2018-04-10 | 中国工程物理研究院激光聚变研究中心 | 原位调控材料微结构制备熔石英微透镜阵列的方法 |
DE102017002986B4 (de) * | 2016-12-13 | 2019-08-29 | AIXLens GmbH | Verfahren zur Herstellung einer transmitiven Optik und Intraokularlinse |
CN109590602B (zh) * | 2017-09-28 | 2022-02-15 | 福州高意光学有限公司 | 一种制作非球面的方法 |
CN109445017A (zh) * | 2019-01-02 | 2019-03-08 | 京东方科技集团股份有限公司 | 导光板及其制作方法、背光模组和显示装置 |
CN111922512B (zh) * | 2020-06-12 | 2021-12-31 | 杭州奥创光子技术有限公司 | 一种工业化贝塞尔脉冲激光系统及其制造方法 |
EP4258029A4 (fr) | 2020-12-01 | 2024-01-17 | Fujitsu Limited | Circuit quantique, ordinateur quantique et procédé de production de circuit quantique |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
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US5325324A (en) * | 1989-04-25 | 1994-06-28 | Regents Of The University Of California | Three-dimensional optical memory |
US5157674A (en) * | 1991-06-27 | 1992-10-20 | Intellectual Property Development Associates Of Connecticut, Incorporated | Second harmonic generation and self frequency doubling laser materials comprised of bulk germanosilicate and aluminosilicate glasses |
US5289407A (en) * | 1991-07-22 | 1994-02-22 | Cornell Research Foundation, Inc. | Method for three dimensional optical data storage and retrieval |
US5253198A (en) * | 1991-12-20 | 1993-10-12 | Syracuse University | Three-dimensional optical memory |
US5634955A (en) * | 1995-02-13 | 1997-06-03 | The United States Of America As Represented By The Secretary Of The Air Force | Process of making channel waveguides in gel-silica |
US5761111A (en) * | 1996-03-15 | 1998-06-02 | President And Fellows Of Harvard College | Method and apparatus providing 2-D/3-D optical information storage and retrieval in transparent materials |
JP3649835B2 (ja) * | 1996-03-18 | 2005-05-18 | 独立行政法人科学技術振興機構 | 光導波路の作製方法 |
JPH10288799A (ja) * | 1997-04-14 | 1998-10-27 | Kagaku Gijutsu Shinko Jigyodan | 光導波回路及び非線形光学装置 |
JPH11167036A (ja) * | 1997-12-04 | 1999-06-22 | Japan Science & Technology Corp | 光導波回路及び非線形光学装置 |
-
2000
- 2000-07-28 CN CN00810909A patent/CN1365500A/zh active Pending
- 2000-07-28 CA CA002380541A patent/CA2380541A1/fr not_active Abandoned
- 2000-07-28 WO PCT/US2000/020446 patent/WO2001009899A1/fr not_active Application Discontinuation
- 2000-07-28 EP EP00950775A patent/EP1204977A4/fr not_active Withdrawn
- 2000-07-28 BR BR0012797-3A patent/BR0012797A/pt not_active Application Discontinuation
- 2000-07-28 KR KR1020027001193A patent/KR20020038707A/ko not_active Application Discontinuation
- 2000-07-28 JP JP2001514433A patent/JP2003506731A/ja not_active Withdrawn
- 2000-07-28 AU AU63827/00A patent/AU6382700A/en not_active Abandoned
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11114309B2 (en) | 2016-06-01 | 2021-09-07 | Corning Incorporated | Articles and methods of forming vias in substrates |
US10756003B2 (en) | 2016-06-29 | 2020-08-25 | Corning Incorporated | Inorganic wafer having through-holes attached to semiconductor wafer |
US11774233B2 (en) | 2016-06-29 | 2023-10-03 | Corning Incorporated | Method and system for measuring geometric parameters of through holes |
US11062986B2 (en) | 2017-05-25 | 2021-07-13 | Corning Incorporated | Articles having vias with geometry attributes and methods for fabricating the same |
US11078112B2 (en) | 2017-05-25 | 2021-08-03 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
US11972993B2 (en) | 2017-05-25 | 2024-04-30 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
Also Published As
Publication number | Publication date |
---|---|
JP2003506731A (ja) | 2003-02-18 |
EP1204977A4 (fr) | 2003-08-13 |
CN1365500A (zh) | 2002-08-21 |
WO2001009899A1 (fr) | 2001-02-08 |
BR0012797A (pt) | 2003-07-15 |
EP1204977A1 (fr) | 2002-05-15 |
CA2380541A1 (fr) | 2001-02-08 |
AU6382700A (en) | 2001-02-19 |
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Legal Events
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WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |