BR0012797A - Dispositivos óticos de inscrição direta em vidro baseado em sìlica usando lasers de pulso femtossegundos - Google Patents

Dispositivos óticos de inscrição direta em vidro baseado em sìlica usando lasers de pulso femtossegundos

Info

Publication number
BR0012797A
BR0012797A BR0012797-3A BR0012797A BR0012797A BR 0012797 A BR0012797 A BR 0012797A BR 0012797 A BR0012797 A BR 0012797A BR 0012797 A BR0012797 A BR 0012797A
Authority
BR
Brazil
Prior art keywords
optical devices
pulse lasers
silica
based glass
substrate
Prior art date
Application number
BR0012797-3A
Other languages
English (en)
Inventor
Nicholas Francis Borrelli
Charlene M Smith
Original Assignee
Corning Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Inc filed Critical Corning Inc
Publication of BR0012797A publication Critical patent/BR0012797A/pt

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/04—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using optical elements ; using other beam accessed elements, e.g. electron or ion beam
    • G11C13/041—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using optical elements ; using other beam accessed elements, e.g. electron or ion beam using photochromic storage elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/04—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using optical elements ; using other beam accessed elements, e.g. electron or ion beam

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Optical Integrated Circuits (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

"DISPOSITIVOS óTICOS DE INSCRIçãO DIRETA EM VIDRO BASEADO EM SìLICA USANDO LASERS DE PULSO FEMTOSSEGUNDOS". A invenção se refere a métodos de inscrição de uma estrutura de guia de luz em um substrato de vidro em massa. O substrato de vidro em massa é preferivelmente feito de um material baseado em silica suave possuindo um ponto de recozimento menor que cerca de 1380<198>K Feixe de laser pulsado é focado dentro do substrato enquanto o foco é trasladado em relação ao substrato ao longo da trajetória escaneada, em uma efetiva velocidade de escaneamento para induzir um aumento no índice refrativo do material ao longo da trajetória escaneada. Substancialmente o laser não induz dano físico ao material ao longo da trajetória escaneada. Vários dispositivos óticos podem ser feitos usando este método.
BR0012797-3A 1999-07-29 2000-07-28 Dispositivos óticos de inscrição direta em vidro baseado em sìlica usando lasers de pulso femtossegundos BR0012797A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14627499P 1999-07-29 1999-07-29
PCT/US2000/020446 WO2001009899A1 (en) 1999-07-29 2000-07-28 Direct writing of optical devices in silica-based glass using femtosecond pulse lasers

Publications (1)

Publication Number Publication Date
BR0012797A true BR0012797A (pt) 2003-07-15

Family

ID=22516612

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0012797-3A BR0012797A (pt) 1999-07-29 2000-07-28 Dispositivos óticos de inscrição direta em vidro baseado em sìlica usando lasers de pulso femtossegundos

Country Status (8)

Country Link
EP (1) EP1204977A4 (pt)
JP (1) JP2003506731A (pt)
KR (1) KR20020038707A (pt)
CN (1) CN1365500A (pt)
AU (1) AU6382700A (pt)
BR (1) BR0012797A (pt)
CA (1) CA2380541A1 (pt)
WO (1) WO2001009899A1 (pt)

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US6853785B2 (en) 2001-12-14 2005-02-08 3M Innovative Properties Co. Index modulation in glass using a femtosecond laser
JP2003321252A (ja) * 2002-04-25 2003-11-11 Japan Science & Technology Corp ガラス内部への分相領域の形成方法
US6950591B2 (en) 2002-05-16 2005-09-27 Corning Incorporated Laser-written cladding for waveguide formations in glass
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US7405883B2 (en) 2004-12-03 2008-07-29 Ohara Inc. Optical component and method of manufacture of optical component
EP1851837B1 (en) * 2004-12-20 2015-03-04 Imra America, Inc. Pulsed laser source with adjustable grating compressor
JP5152806B2 (ja) 2005-08-16 2013-02-27 株式会社オハラ 構造体及びその製造方法
CN100424531C (zh) * 2006-08-07 2008-10-08 华中科技大学 一种用于制备聚合物光波导的专用直写装置
CN102005688A (zh) * 2010-09-17 2011-04-06 山东大学 在钕掺杂钒酸镥晶体内制备条形波导激光器件的方法
CN102466900B (zh) * 2010-11-04 2015-02-18 财团法人工业技术研究院 平面显示器的修补方法与系统
ITTO20110327A1 (it) * 2011-04-08 2012-10-09 Osai A S S R L Metodo di taglio laser intramateriale con profondita' di campo estesa
CN102785031B (zh) * 2012-08-15 2015-04-01 武汉隽龙科技有限公司 一种利用超短脉冲激光的透明材料切割方法及切割装置
CN103399377A (zh) * 2013-07-22 2013-11-20 西安电子科技大学 飞秒激光直写蓝宝石环形光波导及其制备方法
CN104345386A (zh) * 2013-08-02 2015-02-11 宜兴新崛起光集成芯片科技有限公司 一种玻璃基光波导芯片激光内雕工艺
GB2527553B (en) * 2014-06-25 2017-08-23 Fianium Ltd Laser processing
CN104216047A (zh) * 2014-09-26 2014-12-17 南京先进激光技术研究院 基于自聚焦成丝的超短脉冲激光制备光波导器件的方法
RU2578747C1 (ru) * 2014-12-24 2016-03-27 Общество С Ограниченной Ответственностью "Оптосистемы" Способ формирования оболочки волноводной структуры в прозрачном объемном материале и оболочка волноводной структуры
CN104767106A (zh) * 2015-04-17 2015-07-08 山东大学 一种铒掺杂钇铝石榴石晶体镶套光波导放大器及其制备方法
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
US10134657B2 (en) 2016-06-29 2018-11-20 Corning Incorporated Inorganic wafer having through-holes attached to semiconductor wafer
CN106125166B (zh) * 2016-07-22 2018-04-10 中国工程物理研究院激光聚变研究中心 原位调控材料微结构制备熔石英微透镜阵列的方法
DE102017002986B4 (de) * 2016-12-13 2019-08-29 AIXLens GmbH Verfahren zur Herstellung einer transmitiven Optik und Intraokularlinse
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
CN109590602B (zh) * 2017-09-28 2022-02-15 福州高意光学有限公司 一种制作非球面的方法
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JPWO2022118366A1 (pt) * 2020-12-01 2022-06-09

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Also Published As

Publication number Publication date
WO2001009899A1 (en) 2001-02-08
CN1365500A (zh) 2002-08-21
AU6382700A (en) 2001-02-19
CA2380541A1 (en) 2001-02-08
EP1204977A4 (en) 2003-08-13
EP1204977A1 (en) 2002-05-15
JP2003506731A (ja) 2003-02-18
KR20020038707A (ko) 2002-05-23

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Legal Events

Date Code Title Description
FA10 Dismissal: dismissal - article 33 of industrial property law
B11Y Definitive dismissal acc. article 33 of ipl - extension of time limit for request of examination expired