CA2359710C - Couches minces epitaxiales - Google Patents

Couches minces epitaxiales Download PDF

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Publication number
CA2359710C
CA2359710C CA002359710A CA2359710A CA2359710C CA 2359710 C CA2359710 C CA 2359710C CA 002359710 A CA002359710 A CA 002359710A CA 2359710 A CA2359710 A CA 2359710A CA 2359710 C CA2359710 C CA 2359710C
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CA
Canada
Prior art keywords
epitaxial
ccvd
thin films
films
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA002359710A
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English (en)
Other versions
CA2359710A1 (fr
Inventor
Andrew T. Hunt
Girish Deshpande
Donald H. Cousins
Tzyy-Jiuan Jan Hwang
Wen-Yi Lin
Shara S. Shoup
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Microcoating Technologies Inc
Original Assignee
Microcoating Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Microcoating Technologies Inc filed Critical Microcoating Technologies Inc
Publication of CA2359710A1 publication Critical patent/CA2359710A1/fr
Application granted granted Critical
Publication of CA2359710C publication Critical patent/CA2359710C/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00Superconducting devices
    • H10N60/01Manufacture or treatment
    • H10N60/0268Manufacture or treatment of devices comprising copper oxide
    • H10N60/0296Processes for depositing or forming copper oxide superconductor layers
    • H10N60/0576Processes for depositing or forming copper oxide superconductor layers characterised by the substrate
    • H10N60/0632Intermediate layers, e.g. for growth control

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Vapour Deposition (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Fuel Cell (AREA)
  • Superconductor Devices And Manufacturing Methods Thereof (AREA)
  • Ceramic Capacitors (AREA)
  • Inert Electrodes (AREA)

Abstract

L'invention concerne des couches minces épitaxiales qui s'utilisent comme couches tampons destinées à des supraconducteurs à haute température, à des électrolytes pour piles à combustible oxyde solide (SOFC), à des membranes de séparation gazeuse ou à des matériels diélectriques équipant des dispositifs électroniques. La mise en oeuvre d'une méthode CCVD, CACVD ou de n'importe quelle autre méthode de dépôt appropriée permet de former des couches épitaxiales sans porosité présentant des joints de grain parfaits et une structure dense. Plusieurs types de matériau différents peuvent être utilisés pour former les couches tampons dans des supraconducteurs à haute température. En outre, l'utilisation de couches minces épitaxiales pour former des électrolytes et des électrodes dans des SOFC produit une microstructure densifiée sans porosité, présentant une interface et un joint de grain parfaits. L'invention concerne également des membranes de séparation gazeuse destinées à produire de l'oxygène et de l'hydrogène. Ces membranes semi perméables sont constituées de couches submicroniques d'oxydes mixtes conducteurs de haute qualité, denses, étanches au gaz et exemptes de trous d'épingle, disposées sur des substrats céramiques. L'invention concerne en outre des couches minces épitaxiales utilisées comme matériel diélectrique dans des condensateurs. Ces condensateurs sont utilisés selon leurs valeurs capacitives, lesquelles dépendent de la structure physique et de la permitivité diélectrique des condensateurs. Les couches minces épitaxiales de l'invention forment des couches diélectriques à faible perte ayant une permitivité extrêmement élevée. Cette permitivité élevée permet de former des condensateurs dont la capacité peut être réglée par application d'une polarisation en continu entre leurs électrodes.
CA002359710A 1999-01-12 2000-01-12 Couches minces epitaxiales Expired - Fee Related CA2359710C (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11551999P 1999-01-12 1999-01-12
US60/115,519 1999-01-12
PCT/US2000/000824 WO2000042621A2 (fr) 1999-01-12 2000-01-12 Couches minces epitaxiales

Publications (2)

Publication Number Publication Date
CA2359710A1 CA2359710A1 (fr) 2000-07-20
CA2359710C true CA2359710C (fr) 2008-09-02

Family

ID=22361922

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002359710A Expired - Fee Related CA2359710C (fr) 1999-01-12 2000-01-12 Couches minces epitaxiales

Country Status (6)

Country Link
EP (1) EP1145252A2 (fr)
JP (2) JP2002535224A (fr)
CN (1) CN100385696C (fr)
AU (1) AU774828B2 (fr)
CA (1) CA2359710C (fr)
WO (1) WO2000042621A2 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005531885A (ja) * 2002-04-23 2005-10-20 フラウンホフェル−ゲゼルシャフト ツ−ル フォルダルング デル アンゲバンドテン フォルシュング エー.ファウ. ナノ多孔性薄層電極と構造化電解質との複合物を含んでなる高温固体電解質燃料電池
CN100365740C (zh) * 2006-04-27 2008-01-30 西南交通大学 一种高温超导涂层导体的缓冲层
DE102007024166B4 (de) * 2007-05-24 2011-01-05 Zenergy Power Gmbh Verfahren zum Bearbeiten eines Metallsubstrats und Verwendung dessen für einen Hochtemperatur-Supraleiter
JP5376500B2 (ja) * 2008-12-04 2013-12-25 株式会社ノリタケカンパニーリミテド 酸素イオン伝導性セラミック膜材およびその製造方法
CN102039264A (zh) * 2009-10-21 2011-05-04 正峰新能源股份有限公司 非真空铜铟镓硒薄膜密实方法
CN102804434A (zh) * 2010-03-26 2012-11-28 俄亥俄大学 通过电荷转移设计制造超薄分子超导体
EP2426684A1 (fr) 2010-09-02 2012-03-07 Mitsubishi Materials Corporation Composition de formation de film mince diélectrique, procédé de formation de film mince diélectrique et film mince diélectrique ainsi formé
WO2014181526A1 (fr) 2013-05-07 2014-11-13 パナソニックIpマネジメント株式会社 Conducteur de protons et dispositif conducteur de protons
CN109234679B (zh) * 2018-08-31 2020-06-12 内蒙古科技大学 一种双层pnzst钙钛矿反铁电薄膜及其制备方法
CN114774844A (zh) * 2022-03-31 2022-07-22 清华大学 在原子级别调控薄膜平整表面成分的方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3822904A1 (de) * 1988-07-06 1990-01-11 Siemens Ag Josephson-element mit oxidkeramischem supraleitermaterial und verfahren zur herstellung des elements
US5027253A (en) * 1990-04-09 1991-06-25 Ibm Corporation Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards
JPH05299584A (ja) * 1992-02-21 1993-11-12 Toshiba Corp 薄膜容量素子及び半導体記憶装置
JPH07283069A (ja) * 1994-04-07 1995-10-27 Murata Mfg Co Ltd 誘電体薄膜およびその製造方法
JPH0864216A (ja) * 1994-08-25 1996-03-08 Tonen Corp 酸素イオン導電体薄膜及びその製造方法
US5741377A (en) * 1995-04-10 1998-04-21 Martin Marietta Energy Systems, Inc. Structures having enhanced biaxial texture and method of fabricating same
JPH09221393A (ja) * 1996-02-13 1997-08-26 Tdk Corp 鉛含有ペロブスカイト型強誘電体単結晶膜及びその製造方法
JP3724049B2 (ja) * 1996-04-17 2005-12-07 株式会社村田製作所 薄膜コンデンサの製造方法
JPH09321361A (ja) * 1996-05-27 1997-12-12 Tdk Corp 圧電振動部品及びその製造方法

Also Published As

Publication number Publication date
AU4165600A (en) 2000-08-01
CA2359710A1 (fr) 2000-07-20
JP2011044705A (ja) 2011-03-03
CN100385696C (zh) 2008-04-30
AU774828B2 (en) 2004-07-08
JP2002535224A (ja) 2002-10-22
EP1145252A2 (fr) 2001-10-17
WO2000042621A2 (fr) 2000-07-20
CN1526172A (zh) 2004-09-01
WO2000042621A3 (fr) 2001-08-02

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