CA2298684A1 - Copper coatings to improve peel strength - Google Patents

Copper coatings to improve peel strength Download PDF

Info

Publication number
CA2298684A1
CA2298684A1 CA002298684A CA2298684A CA2298684A1 CA 2298684 A1 CA2298684 A1 CA 2298684A1 CA 002298684 A CA002298684 A CA 002298684A CA 2298684 A CA2298684 A CA 2298684A CA 2298684 A1 CA2298684 A1 CA 2298684A1
Authority
CA
Canada
Prior art keywords
laminate
copper foil
peel strength
organic resin
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002298684A
Other languages
English (en)
French (fr)
Inventor
Eric L. Holman
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honeywell International Inc
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2298684A1 publication Critical patent/CA2298684A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CA002298684A 1998-05-01 1999-04-29 Copper coatings to improve peel strength Abandoned CA2298684A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US7124498A 1998-05-01 1998-05-01
US09/071,244 1998-05-01
PCT/US1999/009551 WO1999057949A1 (en) 1998-05-01 1999-04-29 Intermediate layer to improve peel strength of copper foils

Publications (1)

Publication Number Publication Date
CA2298684A1 true CA2298684A1 (en) 1999-11-11

Family

ID=22100156

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002298684A Abandoned CA2298684A1 (en) 1998-05-01 1999-04-29 Copper coatings to improve peel strength

Country Status (4)

Country Link
EP (1) EP1004227A1 (zh)
CA (1) CA2298684A1 (zh)
TW (1) TW486430B (zh)
WO (1) WO1999057949A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE523150C2 (sv) 2000-01-14 2004-03-30 Ericsson Telefon Ab L M Kretsmönsterkort och metod för tillverkning av kretsmönsterkort med tunt kopparskikt
WO2002015302A2 (en) 2000-08-14 2002-02-21 World Properties Inc. Thermosetting composition for electrochemical cell components and methods of making thereof
US7138203B2 (en) 2001-01-19 2006-11-21 World Properties, Inc. Apparatus and method of manufacture of electrochemical cell components
WO2008020984A2 (en) 2006-08-08 2008-02-21 World Properties, Inc. Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom
JP2011517112A (ja) 2008-04-10 2011-05-26 ワールド・プロパティーズ・インコーポレイテッド 結合性が改良された回路材料およびその製造方法と製造物品
WO2010144792A1 (en) 2009-06-11 2010-12-16 Rogers Corporation Dielectric materials, methods of forming subassemblies therefrom, and the subassemblies formed therewith

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3873637A (en) * 1973-02-23 1975-03-25 Sony Corp Adhesive composition containing phenoxy and epoxy resins and a cross-linking agent therefor
CA1304865C (en) * 1985-12-20 1992-07-07 Kollmorgen Technologies Corporation Heat activatable adhesive for wire scribed circuits
US5403869A (en) * 1992-08-17 1995-04-04 Hitachi Chemical Company, Ltd. Adhesive of epoxy resins, epoxy-modified polybutadiene and photoinitiator

Also Published As

Publication number Publication date
WO1999057949A1 (en) 1999-11-11
EP1004227A1 (en) 2000-05-31
TW486430B (en) 2002-05-11

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Legal Events

Date Code Title Description
EEER Examination request
FZDE Discontinued