CA2295676A1 - Sealing structure for organic light emitting devices - Google Patents
Sealing structure for organic light emitting devices Download PDFInfo
- Publication number
- CA2295676A1 CA2295676A1 CA002295676A CA2295676A CA2295676A1 CA 2295676 A1 CA2295676 A1 CA 2295676A1 CA 002295676 A CA002295676 A CA 002295676A CA 2295676 A CA2295676 A CA 2295676A CA 2295676 A1 CA2295676 A1 CA 2295676A1
- Authority
- CA
- Canada
- Prior art keywords
- dielectric film
- sealing structure
- light emitting
- organic light
- exposed surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000007789 sealing Methods 0.000 title claims abstract description 65
- 229910052751 metal Inorganic materials 0.000 claims abstract description 60
- 239000002184 metal Substances 0.000 claims abstract description 57
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 18
- 239000001301 oxygen Substances 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims description 35
- 239000000463 material Substances 0.000 claims description 25
- 239000011159 matrix material Substances 0.000 claims description 11
- 239000004020 conductor Substances 0.000 claims description 8
- 230000006870 function Effects 0.000 claims description 4
- 229920002120 photoresistant polymer Polymers 0.000 claims description 4
- 230000035699 permeability Effects 0.000 abstract description 6
- 239000010408 film Substances 0.000 description 66
- 239000010410 layer Substances 0.000 description 63
- 239000011368 organic material Substances 0.000 description 9
- 238000000151 deposition Methods 0.000 description 8
- 239000003989 dielectric material Substances 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 238000000576 coating method Methods 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000005361 soda-lime glass Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910001148 Al-Li alloy Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229910019015 Mg-Ag Inorganic materials 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910004286 SiNxOy Inorganic materials 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000010406 cathode material Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000013212 metal-organic material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- DOTMOQHOJINYBL-UHFFFAOYSA-N molecular nitrogen;molecular oxygen Chemical compound N#N.O=O DOTMOQHOJINYBL-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- PQDJYEQOELDLCP-UHFFFAOYSA-N trimethylsilane Chemical compound C[SiH](C)C PQDJYEQOELDLCP-UHFFFAOYSA-N 0.000 description 1
- 230000035899 viability Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
- H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US5235797P | 1997-07-11 | 1997-07-11 | |
| US60/052,357 | 1997-07-11 | ||
| US09/074,406 US6198220B1 (en) | 1997-07-11 | 1998-05-08 | Sealing structure for organic light emitting devices |
| US09/074,406 | 1998-05-08 | ||
| PCT/US1998/014099 WO1999002277A1 (en) | 1997-07-11 | 1998-07-09 | Sealing structure for organic light emitting devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2295676A1 true CA2295676A1 (en) | 1999-01-21 |
Family
ID=26730516
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002295676A Abandoned CA2295676A1 (en) | 1997-07-11 | 1998-07-09 | Sealing structure for organic light emitting devices |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP1021255A1 (de) |
| CA (1) | CA2295676A1 (de) |
| WO (1) | WO1999002277A1 (de) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU1669400A (en) * | 1998-12-17 | 2000-07-03 | Cambridge Display Technology Limited | Organic light-emitting devices |
| US8853696B1 (en) | 1999-06-04 | 2014-10-07 | Semiconductor Energy Laboratory Co., Ltd. | Electro-optical device and electronic device |
| US6366017B1 (en) | 1999-07-14 | 2002-04-02 | Agilent Technologies, Inc/ | Organic light emitting diodes with distributed bragg reflector |
| DE10044841B4 (de) * | 2000-09-11 | 2006-11-30 | Osram Opto Semiconductors Gmbh | Plasmaverkapselung für elektronische und mikroelektronische Bauelemente wie OLEDs sowie Verfahren zu dessen Herstellung |
| US6537688B2 (en) | 2000-12-01 | 2003-03-25 | Universal Display Corporation | Adhesive sealed organic optoelectronic structures |
| US6614057B2 (en) | 2001-02-07 | 2003-09-02 | Universal Display Corporation | Sealed organic optoelectronic structures |
| US6576351B2 (en) | 2001-02-16 | 2003-06-10 | Universal Display Corporation | Barrier region for optoelectronic devices |
| US6624568B2 (en) | 2001-03-28 | 2003-09-23 | Universal Display Corporation | Multilayer barrier region containing moisture- and oxygen-absorbing material for optoelectronic devices |
| US6664137B2 (en) | 2001-03-29 | 2003-12-16 | Universal Display Corporation | Methods and structures for reducing lateral diffusion through cooperative barrier layers |
| DE10137712A1 (de) * | 2001-08-06 | 2003-02-20 | Philips Corp Intellectual Pty | Organische elektrolumineszente Anzeigevorrichtung mit Schutzschicht |
| US6888307B2 (en) | 2001-08-21 | 2005-05-03 | Universal Display Corporation | Patterned oxygen and moisture absorber for organic optoelectronic device structures |
| US20070275181A1 (en) * | 2003-05-16 | 2007-11-29 | Carcia Peter F | Barrier films for plastic substrates fabricated by atomic layer deposition |
| DE102004049955B4 (de) * | 2004-10-13 | 2008-12-04 | Schott Ag | Verfahren zur Herstellung eines optischen Bauelements, insbesondere einer OLED |
| CN105957978B (zh) * | 2016-05-30 | 2018-03-06 | 京东方科技集团股份有限公司 | 封装结构及其制造方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5707745A (en) * | 1994-12-13 | 1998-01-13 | The Trustees Of Princeton University | Multicolor organic light emitting devices |
| US5771562A (en) * | 1995-05-02 | 1998-06-30 | Motorola, Inc. | Passivation of organic devices |
| US5736754A (en) * | 1995-11-17 | 1998-04-07 | Motorola, Inc. | Full color organic light emitting diode array |
| US5686360A (en) * | 1995-11-30 | 1997-11-11 | Motorola | Passivation of organic devices |
| US5734225A (en) * | 1996-07-10 | 1998-03-31 | International Business Machines Corporation | Encapsulation of organic light emitting devices using siloxane or siloxane derivatives |
| US5693956A (en) * | 1996-07-29 | 1997-12-02 | Motorola | Inverted oleds on hard plastic substrate |
-
1998
- 1998-07-09 WO PCT/US1998/014099 patent/WO1999002277A1/en not_active Application Discontinuation
- 1998-07-09 EP EP98933245A patent/EP1021255A1/de not_active Withdrawn
- 1998-07-09 CA CA002295676A patent/CA2295676A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| EP1021255A1 (de) | 2000-07-26 |
| WO1999002277A1 (en) | 1999-01-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Discontinued |