CA2293956C - Circuit board side interconnect - Google Patents

Circuit board side interconnect Download PDF

Info

Publication number
CA2293956C
CA2293956C CA002293956A CA2293956A CA2293956C CA 2293956 C CA2293956 C CA 2293956C CA 002293956 A CA002293956 A CA 002293956A CA 2293956 A CA2293956 A CA 2293956A CA 2293956 C CA2293956 C CA 2293956C
Authority
CA
Canada
Prior art keywords
circuit board
traces
contact
interconnect
plane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA002293956A
Other languages
English (en)
French (fr)
Other versions
CA2293956A1 (en
Inventor
Jeffrey W. Mason
William Petrocelli
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ABB Installation Products International LLC
Original Assignee
Thomas and Betts International LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomas and Betts International LLC filed Critical Thomas and Betts International LLC
Publication of CA2293956A1 publication Critical patent/CA2293956A1/en
Application granted granted Critical
Publication of CA2293956C publication Critical patent/CA2293956C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0314—Elastomeric connector or conductor, e.g. rubber with metallic filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the printed circuit board [PCB] or at the walls of large holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
CA002293956A 1999-01-06 2000-01-05 Circuit board side interconnect Expired - Fee Related CA2293956C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11499799P 1999-01-06 1999-01-06
US60/114,997 1999-01-06

Publications (2)

Publication Number Publication Date
CA2293956A1 CA2293956A1 (en) 2000-07-06
CA2293956C true CA2293956C (en) 2003-09-16

Family

ID=22358721

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002293956A Expired - Fee Related CA2293956C (en) 1999-01-06 2000-01-05 Circuit board side interconnect

Country Status (6)

Country Link
US (1) US6345989B1 (enExample)
EP (1) EP1026930B1 (enExample)
JP (1) JP4414534B2 (enExample)
AT (1) ATE276641T1 (enExample)
CA (1) CA2293956C (enExample)
DE (1) DE60013659T2 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7473102B2 (en) * 2006-03-31 2009-01-06 International Business Machines Corporation Space transforming land grid array interposers
US8572841B2 (en) 2008-03-19 2013-11-05 Harris Corporation Printed wiring board assembly and related methods
US8044861B2 (en) * 2008-06-30 2011-10-25 Harris Corporation Electronic device with edge surface antenna elements and related methods
US8485831B2 (en) * 2011-01-06 2013-07-16 International Business Machines Corporation Tall mezzanine connector
US10398025B2 (en) * 2017-11-09 2019-08-27 International Business Machines Corporation Peripheral end face attachment of exposed copper layers of a first printed circuit board to the surface of a second printed circuit board by surface mount assembly
US10321564B2 (en) 2017-11-09 2019-06-11 International Business Machines Corporation Solder assembly of pins to the peripheral end face of a printed circuit board
CN111740288B (zh) * 2020-06-06 2025-11-25 深圳国氢新能源科技有限公司 汽车配电盒的供电电路板
US11128072B1 (en) 2020-07-22 2021-09-21 TE Connectivity Services Gmbh Electrical connector assembly having variable height contacts
US11509080B2 (en) 2020-07-22 2022-11-22 Te Connectivity Solutions Gmbh Electrical connector assembly having hybrid conductive polymer contacts
US11509084B2 (en) 2020-07-24 2022-11-22 Te Connectivity Solutions Gmbh Electrical connector assembly having hybrid conductive polymer contacts
CN114079183B (zh) * 2020-08-12 2025-02-14 庆鼎精密电子（淮安）有限公司 板对板连接结构及其制备方法
US11552418B2 (en) * 2020-09-28 2023-01-10 Rockwell Automation Asia Pacific Business Centre Pte. Ltd. Systems and methods of providing redundant card edge connection
CN113097765B (zh) * 2021-03-08 2023-10-31 深圳星河创意科技开发有限公司 一种可旋转的收纳型插脚插座
US11894629B2 (en) 2021-03-09 2024-02-06 Tyco Electronics Japan G.K. Electrical interconnect with conductive polymer contacts having tips with different shapes and sizes

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3398232A (en) * 1965-10-19 1968-08-20 Amp Inc Circuit board with interconnected signal conductors and interconnected shielding conductors
NL7003475A (enExample) * 1969-03-28 1970-09-30
US4037898A (en) * 1972-08-28 1977-07-26 Beckman Instruments, Inc. Snap-in electrical terminals
US4044888A (en) * 1975-10-23 1977-08-30 Schachter Herbert I Prefabricated contacts for printed circuit card connectors
FI84948C (fi) * 1989-04-12 1992-02-10 Nokia Mobira Oy Ytkontaktdon foer radiofrekventa signaler.
US5051099A (en) * 1990-01-10 1991-09-24 Amp Incorporated High speed card edge connector
US5270903A (en) * 1990-09-10 1993-12-14 Codex Corporation Printed circuit board manufacturing method accommodates wave soldering and press fitting of components
SG48955A1 (en) 1992-07-27 1998-05-18 Murata Manufacturing Co Multilayer electronic component method of manufacturing the same and method of measuring characteristics thereof
JP2500462B2 (ja) * 1993-07-22 1996-05-29 日本電気株式会社 検査用コネクタおよびその製造方法
JP3400051B2 (ja) * 1993-11-10 2003-04-28 ザ ウィタカー コーポレーション 異方性導電膜、その製造方法及びそれを使用するコネクタ
US5473510A (en) * 1994-03-25 1995-12-05 Convex Computer Corporation Land grid array package/circuit board assemblies and methods for constructing the same
US5629839A (en) * 1995-09-12 1997-05-13 Allen-Bradley Company, Inc. Module interconnect adapter for reduced parasitic inductance
US6042390A (en) * 1995-12-01 2000-03-28 Asante Technologies, Inc. Network hub interconnection component
US5819401A (en) * 1996-06-06 1998-10-13 Texas Instruments Incorporated Metal constrained circuit board side to side interconnection technique
US5880011A (en) 1996-06-19 1999-03-09 Pacific Trinetics Corporation Method and apparatus for manufacturing pre-terminated chips
US5761050A (en) * 1996-08-23 1998-06-02 Cts Corporation Deformable pin connector for multiple PC boards
GB9711181D0 (en) * 1997-05-31 1997-07-23 Ncr Int Inc Electrical lead and financial terminal including the lead

Also Published As

Publication number Publication date
CA2293956A1 (en) 2000-07-06
EP1026930A1 (en) 2000-08-09
DE60013659T2 (de) 2005-09-29
JP2001068185A (ja) 2001-03-16
DE60013659D1 (de) 2004-10-21
US6345989B1 (en) 2002-02-12
ATE276641T1 (de) 2004-10-15
EP1026930B1 (en) 2004-09-15
JP4414534B2 (ja) 2010-02-10

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Date Code Title Description
EEER Examination request
MKLA Lapsed

Effective date: 20140107