JP4414534B2 - 回路板相互接続装置 - Google Patents

回路板相互接続装置 Download PDF

Info

Publication number
JP4414534B2
JP4414534B2 JP2000000776A JP2000000776A JP4414534B2 JP 4414534 B2 JP4414534 B2 JP 4414534B2 JP 2000000776 A JP2000000776 A JP 2000000776A JP 2000000776 A JP2000000776 A JP 2000000776A JP 4414534 B2 JP4414534 B2 JP 4414534B2
Authority
JP
Japan
Prior art keywords
circuit board
contact
interconnect device
trace
traces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000000776A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001068185A5 (enExample
JP2001068185A (ja
Inventor
ダブリュ．メイソン ジェフリイ
ペトロセリ ウィリアム
Original Assignee
タイコ エレクトロニクス ロジスティックス エージー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by タイコ エレクトロニクス ロジスティックス エージー filed Critical タイコ エレクトロニクス ロジスティックス エージー
Publication of JP2001068185A publication Critical patent/JP2001068185A/ja
Publication of JP2001068185A5 publication Critical patent/JP2001068185A5/ja
Application granted granted Critical
Publication of JP4414534B2 publication Critical patent/JP4414534B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0314—Elastomeric connector or conductor, e.g. rubber with metallic filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the printed circuit board [PCB] or at the walls of large holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
JP2000000776A 1999-01-06 2000-01-06 回路板相互接続装置 Expired - Fee Related JP4414534B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11499799P 1999-01-06 1999-01-06
US60/114997 1999-01-06

Publications (3)

Publication Number Publication Date
JP2001068185A JP2001068185A (ja) 2001-03-16
JP2001068185A5 JP2001068185A5 (enExample) 2007-02-15
JP4414534B2 true JP4414534B2 (ja) 2010-02-10

Family

ID=22358721

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000000776A Expired - Fee Related JP4414534B2 (ja) 1999-01-06 2000-01-06 回路板相互接続装置

Country Status (6)

Country Link
US (1) US6345989B1 (enExample)
EP (1) EP1026930B1 (enExample)
JP (1) JP4414534B2 (enExample)
AT (1) ATE276641T1 (enExample)
CA (1) CA2293956C (enExample)
DE (1) DE60013659T2 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7473102B2 (en) * 2006-03-31 2009-01-06 International Business Machines Corporation Space transforming land grid array interposers
US8572841B2 (en) 2008-03-19 2013-11-05 Harris Corporation Printed wiring board assembly and related methods
US8044861B2 (en) * 2008-06-30 2011-10-25 Harris Corporation Electronic device with edge surface antenna elements and related methods
US8485831B2 (en) * 2011-01-06 2013-07-16 International Business Machines Corporation Tall mezzanine connector
US10398025B2 (en) * 2017-11-09 2019-08-27 International Business Machines Corporation Peripheral end face attachment of exposed copper layers of a first printed circuit board to the surface of a second printed circuit board by surface mount assembly
US10321564B2 (en) 2017-11-09 2019-06-11 International Business Machines Corporation Solder assembly of pins to the peripheral end face of a printed circuit board
CN111740288B (zh) * 2020-06-06 2025-11-25 深圳国氢新能源科技有限公司 汽车配电盒的供电电路板
US11128072B1 (en) 2020-07-22 2021-09-21 TE Connectivity Services Gmbh Electrical connector assembly having variable height contacts
US11509080B2 (en) 2020-07-22 2022-11-22 Te Connectivity Solutions Gmbh Electrical connector assembly having hybrid conductive polymer contacts
US11509084B2 (en) 2020-07-24 2022-11-22 Te Connectivity Solutions Gmbh Electrical connector assembly having hybrid conductive polymer contacts
CN114079183B (zh) * 2020-08-12 2025-02-14 庆鼎精密电子（淮安）有限公司 板对板连接结构及其制备方法
US11552418B2 (en) * 2020-09-28 2023-01-10 Rockwell Automation Asia Pacific Business Centre Pte. Ltd. Systems and methods of providing redundant card edge connection
CN113097765B (zh) * 2021-03-08 2023-10-31 深圳星河创意科技开发有限公司 一种可旋转的收纳型插脚插座
US11894629B2 (en) 2021-03-09 2024-02-06 Tyco Electronics Japan G.K. Electrical interconnect with conductive polymer contacts having tips with different shapes and sizes

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3398232A (en) * 1965-10-19 1968-08-20 Amp Inc Circuit board with interconnected signal conductors and interconnected shielding conductors
NL7003475A (enExample) * 1969-03-28 1970-09-30
US4037898A (en) * 1972-08-28 1977-07-26 Beckman Instruments, Inc. Snap-in electrical terminals
US4044888A (en) * 1975-10-23 1977-08-30 Schachter Herbert I Prefabricated contacts for printed circuit card connectors
FI84948C (fi) * 1989-04-12 1992-02-10 Nokia Mobira Oy Ytkontaktdon foer radiofrekventa signaler.
US5051099A (en) * 1990-01-10 1991-09-24 Amp Incorporated High speed card edge connector
US5270903A (en) * 1990-09-10 1993-12-14 Codex Corporation Printed circuit board manufacturing method accommodates wave soldering and press fitting of components
SG48955A1 (en) 1992-07-27 1998-05-18 Murata Manufacturing Co Multilayer electronic component method of manufacturing the same and method of measuring characteristics thereof
JP2500462B2 (ja) * 1993-07-22 1996-05-29 日本電気株式会社 検査用コネクタおよびその製造方法
JP3400051B2 (ja) * 1993-11-10 2003-04-28 ザ ウィタカー コーポレーション 異方性導電膜、その製造方法及びそれを使用するコネクタ
US5473510A (en) * 1994-03-25 1995-12-05 Convex Computer Corporation Land grid array package/circuit board assemblies and methods for constructing the same
US5629839A (en) * 1995-09-12 1997-05-13 Allen-Bradley Company, Inc. Module interconnect adapter for reduced parasitic inductance
US6042390A (en) * 1995-12-01 2000-03-28 Asante Technologies, Inc. Network hub interconnection component
US5819401A (en) * 1996-06-06 1998-10-13 Texas Instruments Incorporated Metal constrained circuit board side to side interconnection technique
US5880011A (en) 1996-06-19 1999-03-09 Pacific Trinetics Corporation Method and apparatus for manufacturing pre-terminated chips
US5761050A (en) * 1996-08-23 1998-06-02 Cts Corporation Deformable pin connector for multiple PC boards
GB9711181D0 (en) * 1997-05-31 1997-07-23 Ncr Int Inc Electrical lead and financial terminal including the lead

Also Published As

Publication number Publication date
CA2293956A1 (en) 2000-07-06
EP1026930A1 (en) 2000-08-09
DE60013659T2 (de) 2005-09-29
JP2001068185A (ja) 2001-03-16
DE60013659D1 (de) 2004-10-21
CA2293956C (en) 2003-09-16
US6345989B1 (en) 2002-02-12
ATE276641T1 (de) 2004-10-15
EP1026930B1 (en) 2004-09-15

Similar Documents

Publication Publication Date Title
CN212342862U (zh) 电连接器、印刷电路板和导电构件
US8144482B2 (en) Circuit board device, wiring board interconnection method, and circuit board module device
CN107535044B (zh) 用于高速、高密度电连接器的配套背板
CN109076700B (zh) 用于高速、高密度电连接器的背板占板区
US6814619B1 (en) High speed, high density electrical connector and connector assembly
JP4414534B2 (ja) 回路板相互接続装置
US7544096B2 (en) Differential electrical connector assembly
CN1182630C (zh) 包括一个支撑平行电路板的外壳的电连接器
US5228864A (en) Connectors with ground structure
US7508681B2 (en) Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization attenuation and impedance mismatch characteristics
US6644979B2 (en) Backplane structure capable of being mounted with two interface cards
US6780059B1 (en) High speed, high density electrical connector
JPH04233179A (ja) コネクタ・アセンブリ
US20110189892A1 (en) Male connector, female connector, and connector
JP2003272774A (ja) Ｆｐｃケーブル用コネクタ
JP2017103223A (ja) リジッド−フレックス回路コネクタ
US4834660A (en) Flexible zero insertion force interconnector between circuit boards
CN110891369B (zh) 低成本高速印刷电路板的连接器
WO2021037068A1 (zh) 一种连接器及电子设备
US11664615B2 (en) Circuit board having terminal, and circuit board assembly
JP3321035B2 (ja) 電気コネクタ
JP2001068907A (ja) Ｆｐｃケーブルおよびｆｐｃケーブル用コネクタ
TWI899985B (zh) 低成本高速印刷電路板之連接器
CN111602472B (zh) 用于高速、高密度电连接器的背板占板区
JPH10340762A (ja) フレキシブルプリント配線の接続装置及び接続方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20061222

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20061222

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090401

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090701

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20091026

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20091120

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121127

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20131127

Year of fee payment: 4

LAPS Cancellation because of no payment of annual fees