ATE276641T1 - Schaltungsplatte mit seitlichen verbindungen - Google Patents
Schaltungsplatte mit seitlichen verbindungenInfo
- Publication number
- ATE276641T1 ATE276641T1 AT00300036T AT00300036T ATE276641T1 AT E276641 T1 ATE276641 T1 AT E276641T1 AT 00300036 T AT00300036 T AT 00300036T AT 00300036 T AT00300036 T AT 00300036T AT E276641 T1 ATE276641 T1 AT E276641T1
- Authority
- AT
- Austria
- Prior art keywords
- traces
- contact
- circuit board
- contacts
- trace
- Prior art date
Links
- 230000013011 mating Effects 0.000 abstract 3
- 239000004020 conductor Substances 0.000 abstract 1
- 230000007797 corrosion Effects 0.000 abstract 1
- 238000005260 corrosion Methods 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 230000003647 oxidation Effects 0.000 abstract 1
- 238000007254 oxidation reaction Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0314—Elastomeric connector or conductor, e.g. rubber with metallic filler
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0397—Tab
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the printed circuit board [PCB] or at the walls of large holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11499799P | 1999-01-06 | 1999-01-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE276641T1 true ATE276641T1 (de) | 2004-10-15 |
Family
ID=22358721
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT00300036T ATE276641T1 (de) | 1999-01-06 | 2000-01-06 | Schaltungsplatte mit seitlichen verbindungen |
Country Status (6)
Country | Link |
---|---|
US (1) | US6345989B1 (de) |
EP (1) | EP1026930B1 (de) |
JP (1) | JP4414534B2 (de) |
AT (1) | ATE276641T1 (de) |
CA (1) | CA2293956C (de) |
DE (1) | DE60013659T2 (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7473102B2 (en) * | 2006-03-31 | 2009-01-06 | International Business Machines Corporation | Space transforming land grid array interposers |
US8572841B2 (en) | 2008-03-19 | 2013-11-05 | Harris Corporation | Printed wiring board assembly and related methods |
US8044861B2 (en) * | 2008-06-30 | 2011-10-25 | Harris Corporation | Electronic device with edge surface antenna elements and related methods |
US8485831B2 (en) * | 2011-01-06 | 2013-07-16 | International Business Machines Corporation | Tall mezzanine connector |
US10321564B2 (en) | 2017-11-09 | 2019-06-11 | International Business Machines Corporation | Solder assembly of pins to the peripheral end face of a printed circuit board |
US10398025B2 (en) * | 2017-11-09 | 2019-08-27 | International Business Machines Corporation | Peripheral end face attachment of exposed copper layers of a first printed circuit board to the surface of a second printed circuit board by surface mount assembly |
US11128072B1 (en) | 2020-07-22 | 2021-09-21 | TE Connectivity Services Gmbh | Electrical connector assembly having variable height contacts |
US11509080B2 (en) | 2020-07-22 | 2022-11-22 | Te Connectivity Solutions Gmbh | Electrical connector assembly having hybrid conductive polymer contacts |
US11509084B2 (en) | 2020-07-24 | 2022-11-22 | Te Connectivity Solutions Gmbh | Electrical connector assembly having hybrid conductive polymer contacts |
CN114079183A (zh) * | 2020-08-12 | 2022-02-22 | 庆鼎精密电子(淮安)有限公司 | 板对板连接结构及其制备方法 |
US11552418B2 (en) * | 2020-09-28 | 2023-01-10 | Rockwell Automation Asia Pacific Business Centre Pte. Ltd. | Systems and methods of providing redundant card edge connection |
CN113097765B (zh) * | 2021-03-08 | 2023-10-31 | 深圳星河创意科技开发有限公司 | 一种可旋转的收纳型插脚插座 |
US11894629B2 (en) | 2021-03-09 | 2024-02-06 | Tyco Electronics Japan G.K. | Electrical interconnect with conductive polymer contacts having tips with different shapes and sizes |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3398232A (en) * | 1965-10-19 | 1968-08-20 | Amp Inc | Circuit board with interconnected signal conductors and interconnected shielding conductors |
NL7003475A (de) * | 1969-03-28 | 1970-09-30 | ||
US4037898A (en) * | 1972-08-28 | 1977-07-26 | Beckman Instruments, Inc. | Snap-in electrical terminals |
US4044888A (en) * | 1975-10-23 | 1977-08-30 | Schachter Herbert I | Prefabricated contacts for printed circuit card connectors |
FI84948C (fi) * | 1989-04-12 | 1992-02-10 | Nokia Mobira Oy | Ytkontaktdon foer radiofrekventa signaler. |
US5051099A (en) * | 1990-01-10 | 1991-09-24 | Amp Incorporated | High speed card edge connector |
US5270903A (en) * | 1990-09-10 | 1993-12-14 | Codex Corporation | Printed circuit board manufacturing method accommodates wave soldering and press fitting of components |
EP0582881B1 (de) | 1992-07-27 | 1997-12-29 | Murata Manufacturing Co., Ltd. | Elektronisches Vielschichtbauteil, Verfahren zur dessen Herstellung und Verfahren zur Messung seiner Charakteristiken |
JP2500462B2 (ja) * | 1993-07-22 | 1996-05-29 | 日本電気株式会社 | 検査用コネクタおよびその製造方法 |
JP3400051B2 (ja) * | 1993-11-10 | 2003-04-28 | ザ ウィタカー コーポレーション | 異方性導電膜、その製造方法及びそれを使用するコネクタ |
US5473510A (en) * | 1994-03-25 | 1995-12-05 | Convex Computer Corporation | Land grid array package/circuit board assemblies and methods for constructing the same |
US5629839A (en) * | 1995-09-12 | 1997-05-13 | Allen-Bradley Company, Inc. | Module interconnect adapter for reduced parasitic inductance |
US6042390A (en) * | 1995-12-01 | 2000-03-28 | Asante Technologies, Inc. | Network hub interconnection component |
US5819401A (en) * | 1996-06-06 | 1998-10-13 | Texas Instruments Incorporated | Metal constrained circuit board side to side interconnection technique |
US5880011A (en) | 1996-06-19 | 1999-03-09 | Pacific Trinetics Corporation | Method and apparatus for manufacturing pre-terminated chips |
US5761050A (en) * | 1996-08-23 | 1998-06-02 | Cts Corporation | Deformable pin connector for multiple PC boards |
GB9711181D0 (en) * | 1997-05-31 | 1997-07-23 | Ncr Int Inc | Electrical lead and financial terminal including the lead |
-
2000
- 2000-01-04 US US09/477,102 patent/US6345989B1/en not_active Expired - Lifetime
- 2000-01-05 CA CA002293956A patent/CA2293956C/en not_active Expired - Fee Related
- 2000-01-06 EP EP00300036A patent/EP1026930B1/de not_active Expired - Lifetime
- 2000-01-06 AT AT00300036T patent/ATE276641T1/de not_active IP Right Cessation
- 2000-01-06 DE DE60013659T patent/DE60013659T2/de not_active Expired - Lifetime
- 2000-01-06 JP JP2000000776A patent/JP4414534B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CA2293956A1 (en) | 2000-07-06 |
JP2001068185A (ja) | 2001-03-16 |
DE60013659D1 (de) | 2004-10-21 |
DE60013659T2 (de) | 2005-09-29 |
JP4414534B2 (ja) | 2010-02-10 |
EP1026930B1 (de) | 2004-09-15 |
EP1026930A1 (de) | 2000-08-09 |
CA2293956C (en) | 2003-09-16 |
US6345989B1 (en) | 2002-02-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |