CA2253242C - Composition de resine thermodurcissable photopolymerisable - Google Patents

Composition de resine thermodurcissable photopolymerisable Download PDF

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Publication number
CA2253242C
CA2253242C CA002253242A CA2253242A CA2253242C CA 2253242 C CA2253242 C CA 2253242C CA 002253242 A CA002253242 A CA 002253242A CA 2253242 A CA2253242 A CA 2253242A CA 2253242 C CA2253242 C CA 2253242C
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CA
Canada
Prior art keywords
parts
resin
unsaturated
acid
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA002253242A
Other languages
English (en)
Other versions
CA2253242A1 (fr
Inventor
Yasuharu Nojima
Toyoyuki Ido
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huntsman Advanced Materials Switzerland GmbH
Original Assignee
Vantico GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP16923696A external-priority patent/JP3254572B2/ja
Application filed by Vantico GmbH filed Critical Vantico GmbH
Publication of CA2253242A1 publication Critical patent/CA2253242A1/fr
Application granted granted Critical
Publication of CA2253242C publication Critical patent/CA2253242C/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Epoxy Resins (AREA)

Abstract

Composition de résine thermodurcissable et photopolymérisable composée (A) d'un mélange composé (a) d'une résine durcissable par application de rayons d'énergie active et obtenue par réaction d'une résine copolymère insaturée monobasique acide avec un composé insaturé contenant un groupe époxy cycloaliphatique ou par réaction d'un groupe époxy cycloaliphatique contenant une résine copolymère avec un composé insaturé contenant un groupe acide et (b) d'un prépolymère photosensible obtenu par estérification d'un composé époxy de type novolaque avec acide carboxylique alpha - beta -insaturé puis par réaction avec de l'anhydride polybasique acide (et dans une des versions par réaction additionnelle avec un isocyanate insaturé).
CA002253242A 1996-06-28 1997-06-17 Composition de resine thermodurcissable photopolymerisable Expired - Fee Related CA2253242C (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP8/169236 1996-06-28
JP16923696A JP3254572B2 (ja) 1996-06-28 1996-06-28 光重合性熱硬化性樹脂組成物
PCT/EP1997/003141 WO1998000759A1 (fr) 1996-06-28 1997-06-17 Composition de resine thermodurcissable photopolymerisable

Publications (2)

Publication Number Publication Date
CA2253242A1 CA2253242A1 (fr) 1998-01-08
CA2253242C true CA2253242C (fr) 2007-06-05

Family

ID=38137614

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002253242A Expired - Fee Related CA2253242C (fr) 1996-06-28 1997-06-17 Composition de resine thermodurcissable photopolymerisable

Country Status (1)

Country Link
CA (1) CA2253242C (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111116833B (zh) * 2019-12-30 2022-05-17 先临三维科技股份有限公司 一种3d打印用树脂组合物、抗氧阻聚树脂、3d打印制品及制备方法
CN114525500B (zh) * 2021-12-28 2023-05-05 南通威斯派尔半导体技术有限公司 一种覆铜陶瓷基板局部镀银方法
CN116328739A (zh) * 2023-02-22 2023-06-27 东洋和光净化材料(江苏)有限公司 一种疏水型voc吸附剂及其生产方法
CN116180273A (zh) * 2023-03-07 2023-05-30 东莞市博斯蒂新材料有限公司 一种感光丝线及其制备方法
CN116954022B (zh) * 2023-07-31 2024-02-06 广东诚展科技股份有限公司 一种芯片载板感光阻焊干膜及其形成方法

Also Published As

Publication number Publication date
CA2253242A1 (fr) 1998-01-08

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