CA2253242C - Composition de resine thermodurcissable photopolymerisable - Google Patents
Composition de resine thermodurcissable photopolymerisable Download PDFInfo
- Publication number
- CA2253242C CA2253242C CA002253242A CA2253242A CA2253242C CA 2253242 C CA2253242 C CA 2253242C CA 002253242 A CA002253242 A CA 002253242A CA 2253242 A CA2253242 A CA 2253242A CA 2253242 C CA2253242 C CA 2253242C
- Authority
- CA
- Canada
- Prior art keywords
- parts
- resin
- unsaturated
- acid
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Epoxy Resins (AREA)
Abstract
Composition de résine thermodurcissable et photopolymérisable composée (A) d'un mélange composé (a) d'une résine durcissable par application de rayons d'énergie active et obtenue par réaction d'une résine copolymère insaturée monobasique acide avec un composé insaturé contenant un groupe époxy cycloaliphatique ou par réaction d'un groupe époxy cycloaliphatique contenant une résine copolymère avec un composé insaturé contenant un groupe acide et (b) d'un prépolymère photosensible obtenu par estérification d'un composé époxy de type novolaque avec acide carboxylique alpha - beta -insaturé puis par réaction avec de l'anhydride polybasique acide (et dans une des versions par réaction additionnelle avec un isocyanate insaturé).
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8/169236 | 1996-06-28 | ||
JP16923696A JP3254572B2 (ja) | 1996-06-28 | 1996-06-28 | 光重合性熱硬化性樹脂組成物 |
PCT/EP1997/003141 WO1998000759A1 (fr) | 1996-06-28 | 1997-06-17 | Composition de resine thermodurcissable photopolymerisable |
Publications (2)
Publication Number | Publication Date |
---|---|
CA2253242A1 CA2253242A1 (fr) | 1998-01-08 |
CA2253242C true CA2253242C (fr) | 2007-06-05 |
Family
ID=38137614
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA002253242A Expired - Fee Related CA2253242C (fr) | 1996-06-28 | 1997-06-17 | Composition de resine thermodurcissable photopolymerisable |
Country Status (1)
Country | Link |
---|---|
CA (1) | CA2253242C (fr) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111116833B (zh) * | 2019-12-30 | 2022-05-17 | 先临三维科技股份有限公司 | 一种3d打印用树脂组合物、抗氧阻聚树脂、3d打印制品及制备方法 |
CN114525500B (zh) * | 2021-12-28 | 2023-05-05 | 南通威斯派尔半导体技术有限公司 | 一种覆铜陶瓷基板局部镀银方法 |
CN116328739A (zh) * | 2023-02-22 | 2023-06-27 | 东洋和光净化材料(江苏)有限公司 | 一种疏水型voc吸附剂及其生产方法 |
CN116180273A (zh) * | 2023-03-07 | 2023-05-30 | 东莞市博斯蒂新材料有限公司 | 一种感光丝线及其制备方法 |
CN116954022B (zh) * | 2023-07-31 | 2024-02-06 | 广东诚展科技股份有限公司 | 一种芯片载板感光阻焊干膜及其形成方法 |
-
1997
- 1997-06-17 CA CA002253242A patent/CA2253242C/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CA2253242A1 (fr) | 1998-01-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EEER | Examination request | ||
MKLA | Lapsed |
Effective date: 20140617 |