CA2248807C - Droplet deposition apparatus - Google Patents
Droplet deposition apparatus Download PDFInfo
- Publication number
- CA2248807C CA2248807C CA002248807A CA2248807A CA2248807C CA 2248807 C CA2248807 C CA 2248807C CA 002248807 A CA002248807 A CA 002248807A CA 2248807 A CA2248807 A CA 2248807A CA 2248807 C CA2248807 C CA 2248807C
- Authority
- CA
- Canada
- Prior art keywords
- channel
- channels
- side walls
- piezo
- open
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000008021 deposition Effects 0.000 title claims description 60
- 239000000463 material Substances 0.000 claims abstract description 59
- 239000002305 electric material Substances 0.000 claims abstract description 57
- 238000000151 deposition Methods 0.000 claims description 86
- 238000000034 method Methods 0.000 claims description 29
- 239000007772 electrode material Substances 0.000 claims description 19
- 239000012530 fluid Substances 0.000 claims description 17
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 238000004891 communication Methods 0.000 claims description 6
- 230000005684 electric field Effects 0.000 claims description 6
- 238000006073 displacement reaction Methods 0.000 claims description 5
- 230000000694 effects Effects 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- 230000000873 masking effect Effects 0.000 claims description 4
- 238000010276 construction Methods 0.000 description 18
- 239000003990 capacitor Substances 0.000 description 7
- 239000003989 dielectric material Substances 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 229910017083 AlN Inorganic materials 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- -1 nitrogen ions Chemical class 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14209—Structure of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
- B41J2/1609—Production of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/046—Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14387—Front shooter
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB9608373.8 | 1996-04-23 | ||
| GBGB9608373.8A GB9608373D0 (en) | 1996-04-23 | 1996-04-23 | Droplet deposition apparatus |
| GBGB9624408.2A GB9624408D0 (en) | 1996-11-23 | 1996-11-23 | Droplet deposition apparatus |
| GB9624408.2 | 1996-11-23 | ||
| PCT/GB1997/001083 WO1997039897A1 (en) | 1996-04-23 | 1997-04-18 | Droplet deposition apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2248807A1 CA2248807A1 (en) | 1997-10-30 |
| CA2248807C true CA2248807C (en) | 2006-01-03 |
Family
ID=26309190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002248807A Expired - Fee Related CA2248807C (en) | 1996-04-23 | 1997-04-18 | Droplet deposition apparatus |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US6286943B1 (enExample) |
| EP (1) | EP0901415B1 (enExample) |
| JP (1) | JP3177897B2 (enExample) |
| CN (1) | CN1191936C (enExample) |
| CA (1) | CA2248807C (enExample) |
| DE (1) | DE69714251T2 (enExample) |
| IN (1) | IN191904B (enExample) |
| RU (1) | RU2165853C2 (enExample) |
| WO (1) | WO1997039897A1 (enExample) |
Families Citing this family (65)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB9622177D0 (en) | 1996-10-24 | 1996-12-18 | Xaar Ltd | Passivation of ink jet print heads |
| US6606011B2 (en) | 1998-04-07 | 2003-08-12 | X2Y Attenuators, Llc | Energy conditioning circuit assembly |
| US7110227B2 (en) | 1997-04-08 | 2006-09-19 | X2Y Attenuators, Llc | Universial energy conditioning interposer with circuit architecture |
| US6603646B2 (en) * | 1997-04-08 | 2003-08-05 | X2Y Attenuators, Llc | Multi-functional energy conditioner |
| US7110235B2 (en) | 1997-04-08 | 2006-09-19 | Xzy Altenuators, Llc | Arrangement for energy conditioning |
| US6894884B2 (en) | 1997-04-08 | 2005-05-17 | Xzy Attenuators, Llc | Offset pathway arrangements for energy conditioning |
| US7274549B2 (en) | 2000-12-15 | 2007-09-25 | X2Y Attenuators, Llc | Energy pathway arrangements for energy conditioning |
| US9054094B2 (en) | 1997-04-08 | 2015-06-09 | X2Y Attenuators, Llc | Energy conditioning circuit arrangement for integrated circuit |
| US20030161086A1 (en) | 2000-07-18 | 2003-08-28 | X2Y Attenuators, Llc | Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
| US7042703B2 (en) | 2000-03-22 | 2006-05-09 | X2Y Attenuators, Llc | Energy conditioning structure |
| US6650525B2 (en) | 1997-04-08 | 2003-11-18 | X2Y Attenuators, Llc | Component carrier |
| US7301748B2 (en) | 1997-04-08 | 2007-11-27 | Anthony Anthony A | Universal energy conditioning interposer with circuit architecture |
| US6018448A (en) | 1997-04-08 | 2000-01-25 | X2Y Attenuators, L.L.C. | Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
| US7321485B2 (en) | 1997-04-08 | 2008-01-22 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
| US7336467B2 (en) | 2000-10-17 | 2008-02-26 | X2Y Attenuators, Llc | Energy pathway arrangement |
| US7336468B2 (en) | 1997-04-08 | 2008-02-26 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
| US7106570B2 (en) | 1997-04-08 | 2006-09-12 | Xzy Altenuators, Llc | Pathway arrangement |
| US7427816B2 (en) | 1998-04-07 | 2008-09-23 | X2Y Attenuators, Llc | Component carrier |
| JP2003526195A (ja) | 1998-04-07 | 2003-09-02 | エクストゥーワイ、アテニュエイタズ、エル、エル、シー | 部品キャリア |
| US7113383B2 (en) | 2000-04-28 | 2006-09-26 | X2Y Attenuators, Llc | Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning |
| EP1312148A4 (en) | 2000-08-15 | 2009-06-03 | X2Y Attenuators Llc | ELECTRODES SYSTEM FOR CIRCUIT ENERGY CONDITIONING |
| AU2001287943A1 (en) | 2000-09-26 | 2002-04-08 | Xaar Technology Limited | Droplet deposition apparatus |
| IL155402A0 (en) * | 2000-10-17 | 2003-11-23 | X2Y Attenuators Llc | Amalgam of shielding and shielded energy pathways and other elements for single or multiple circuitries with common reference node |
| US7193831B2 (en) * | 2000-10-17 | 2007-03-20 | X2Y Attenuators, Llc | Energy pathway arrangement |
| US7895530B2 (en) | 2000-11-09 | 2011-02-22 | Change Tools, Inc. | User definable interface system, method, support tools, and computer program product |
| US6863149B2 (en) * | 2000-12-12 | 2005-03-08 | Japan Science And Technology Corporation | Steering mechanism of electric car |
| US6864620B2 (en) * | 2000-12-22 | 2005-03-08 | Ngk Insulators, Ltd. | Matrix type actuator |
| JP2003246058A (ja) | 2002-02-27 | 2003-09-02 | Sharp Corp | インクジェットヘッド |
| US6844960B2 (en) * | 2002-09-24 | 2005-01-18 | Eastman Kodak Company | Microelectromechanical device with continuously variable displacement |
| JP4473532B2 (ja) * | 2002-10-10 | 2010-06-02 | 日本碍子株式会社 | 圧電/電歪デバイス及び製造方法 |
| US6957884B2 (en) * | 2002-12-27 | 2005-10-25 | Kinberly-Clark Worldwide, Inc. | High-speed inkjet printing for vibrant and crockfast graphics on web materials or end-products |
| US7180718B2 (en) * | 2003-01-31 | 2007-02-20 | X2Y Attenuators, Llc | Shielded energy conditioner |
| EP1629582A2 (en) | 2003-05-29 | 2006-03-01 | X2Y Attenuators, L.L.C. | Connector related structures including an energy conditioner |
| JP2006528868A (ja) | 2003-07-21 | 2006-12-21 | エックストゥーワイ アテニュエイターズ,エルエルシー | フィルタ組立体 |
| US8251471B2 (en) * | 2003-08-18 | 2012-08-28 | Fujifilm Dimatix, Inc. | Individual jet voltage trimming circuitry |
| JP4878111B2 (ja) * | 2003-10-30 | 2012-02-15 | 日本碍子株式会社 | セル駆動型圧電/電歪アクチュエータ及びその製造方法 |
| EP1698033A4 (en) | 2003-12-22 | 2010-07-21 | X2Y Attenuators Llc | INTERNAL SHIELDED ENERGY PREPARATION |
| US20050270312A1 (en) * | 2004-06-03 | 2005-12-08 | Molecular Imprints, Inc. | Fluid dispensing and drop-on-demand dispensing for nano-scale manufacturing |
| US20070228593A1 (en) * | 2006-04-03 | 2007-10-04 | Molecular Imprints, Inc. | Residual Layer Thickness Measurement and Correction |
| JP4274555B2 (ja) * | 2004-07-16 | 2009-06-10 | キヤノン株式会社 | 液体吐出素子基板の製造方法および液体吐出素子の製造方法 |
| US7911625B2 (en) * | 2004-10-15 | 2011-03-22 | Fujifilm Dimatrix, Inc. | Printing system software architecture |
| US7722147B2 (en) * | 2004-10-15 | 2010-05-25 | Fujifilm Dimatix, Inc. | Printing system architecture |
| US8068245B2 (en) * | 2004-10-15 | 2011-11-29 | Fujifilm Dimatix, Inc. | Printing device communication protocol |
| US8085428B2 (en) | 2004-10-15 | 2011-12-27 | Fujifilm Dimatix, Inc. | Print systems and techniques |
| US7907298B2 (en) * | 2004-10-15 | 2011-03-15 | Fujifilm Dimatix, Inc. | Data pump for printing |
| US8199342B2 (en) * | 2004-10-29 | 2012-06-12 | Fujifilm Dimatix, Inc. | Tailoring image data packets to properties of print heads |
| US7234788B2 (en) * | 2004-11-03 | 2007-06-26 | Dimatix, Inc. | Individual voltage trimming with waveforms |
| US7556327B2 (en) * | 2004-11-05 | 2009-07-07 | Fujifilm Dimatix, Inc. | Charge leakage prevention for inkjet printing |
| US7811505B2 (en) * | 2004-12-07 | 2010-10-12 | Molecular Imprints, Inc. | Method for fast filling of templates for imprint lithography using on template dispense |
| GB2439861A (en) | 2005-03-01 | 2008-01-09 | X2Y Attenuators Llc | Internally overlapped conditioners |
| WO2006093831A2 (en) | 2005-03-01 | 2006-09-08 | X2Y Attenuators, Llc | Energy conditioner with tied through electrodes |
| WO2006099297A2 (en) | 2005-03-14 | 2006-09-21 | X2Y Attenuators, Llc | Conditioner with coplanar conductors |
| EP1991996A1 (en) | 2006-03-07 | 2008-11-19 | X2Y Attenuators, L.L.C. | Energy conditioner structures |
| JP5123532B2 (ja) * | 2007-01-30 | 2013-01-23 | 太陽誘電株式会社 | マイクロカンチレバー |
| CA2688245C (en) | 2007-06-15 | 2012-12-18 | Silverbrook Research Pty Ltd | Method of forming connection between electrode and actuator in an inkjet nozzle assembly |
| JP5112889B2 (ja) * | 2008-01-11 | 2013-01-09 | エスアイアイ・プリンテック株式会社 | インクジェットヘッドチップ、インクジェットヘッドチップの製造方法、インクジェットヘッド、及びインクジェット記録装置 |
| JP2010158864A (ja) * | 2009-01-09 | 2010-07-22 | Sii Printek Inc | 液体噴射ヘッドチップ及びその製造方法、並びに液体噴射ヘッド及び液体噴射記録装置 |
| JP5633200B2 (ja) * | 2010-06-08 | 2014-12-03 | 株式会社リコー | 圧電アクチュエータ、液体吐出ヘッド及び画像形成装置 |
| JP6121708B2 (ja) * | 2012-12-19 | 2017-04-26 | エスアイアイ・プリンテック株式会社 | 液体噴射ヘッド、液体噴射ヘッドの製造方法および液体噴射装置 |
| JP6314062B2 (ja) * | 2014-08-28 | 2018-04-18 | セイコーインスツル株式会社 | 液体噴射ヘッドの製造方法及び液体噴射装置 |
| JP6371639B2 (ja) * | 2014-08-28 | 2018-08-08 | セイコーインスツル株式会社 | 液体噴射ヘッド及び液体噴射装置 |
| JP6393180B2 (ja) * | 2014-12-16 | 2018-09-19 | エスアイアイ・プリンテック株式会社 | 液体噴射ヘッド、液体噴射装置及び液体噴射ヘッドの製造方法 |
| JP6983504B2 (ja) * | 2016-01-08 | 2021-12-17 | キヤノン株式会社 | 液体吐出ヘッド及び液体吐出装置 |
| US10029473B2 (en) * | 2016-01-08 | 2018-07-24 | Canon Kabushiki Kaisha | Liquid discharge head and recording apparatus |
| JP2023035586A (ja) * | 2021-09-01 | 2023-03-13 | エスアイアイ・プリンテック株式会社 | ヘッドチップ、液体噴射ヘッド、液体噴射記録装置及びヘッドチップの製造方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL281145A (enExample) * | 1961-05-08 | |||
| JPS63137158A (ja) * | 1986-11-27 | 1988-06-09 | Nissin Electric Co Ltd | アルミ薄膜の作製方法 |
| JPS6473069A (en) * | 1987-09-10 | 1989-03-17 | Nissin Electric Co Ltd | Production of aluminum nitride film |
| ATE118404T1 (de) * | 1988-05-13 | 1995-03-15 | Xaar Ltd | Multiplexstromkreis. |
| GB8824014D0 (en) * | 1988-10-13 | 1988-11-23 | Am Int | High density multi-channel array electrically pulsed droplet deposition apparatus |
| SU1635896A3 (ru) * | 1989-03-23 | 1991-03-15 | К.П.Зыбин, С.Н.Максимовский и Г.А.Радуцкий | Струйна печатающа головка и способ ее изготовлени |
| US5053245A (en) * | 1989-10-26 | 1991-10-01 | Sanyo Electric Co., Ltd. | Method of improving the quality of an edge surface of a cutting device |
| JP2744535B2 (ja) * | 1991-07-08 | 1998-04-28 | 株式会社テック | インクジェットプリンタヘッドの製造方法 |
| US5406319A (en) | 1991-08-16 | 1995-04-11 | Compaq Computer Corporation | Enhanced U type ink jet printheads |
| JP3097298B2 (ja) * | 1992-04-17 | 2000-10-10 | ブラザー工業株式会社 | 液滴噴射装置およびその製造方法 |
| WO1994001284A1 (fr) * | 1992-07-03 | 1994-01-20 | Citizen Watch Co., Ltd. | Tete a jet d'encre |
| JP3052692B2 (ja) * | 1993-09-30 | 2000-06-19 | ブラザー工業株式会社 | 印字ヘッド及びその製造方法 |
| JP3120638B2 (ja) * | 1993-10-01 | 2000-12-25 | ブラザー工業株式会社 | インク噴射装置 |
| JPH07132591A (ja) | 1993-11-10 | 1995-05-23 | Brother Ind Ltd | 印字ヘッド |
| JP3043936B2 (ja) | 1994-02-08 | 2000-05-22 | シャープ株式会社 | インクジェットヘッド |
| JPH07304169A (ja) * | 1994-05-12 | 1995-11-21 | Brother Ind Ltd | 液滴噴射装置 |
| JP3166530B2 (ja) * | 1995-01-30 | 2001-05-14 | ブラザー工業株式会社 | インク噴射装置 |
| JPH09207331A (ja) | 1996-02-07 | 1997-08-12 | Matsushita Electric Ind Co Ltd | インクジェット記録ヘッド |
-
1997
- 1997-04-18 WO PCT/GB1997/001083 patent/WO1997039897A1/en not_active Ceased
- 1997-04-18 DE DE69714251T patent/DE69714251T2/de not_active Expired - Lifetime
- 1997-04-18 EP EP97917361A patent/EP0901415B1/en not_active Expired - Lifetime
- 1997-04-18 RU RU98121014/12A patent/RU2165853C2/ru active
- 1997-04-18 CN CN97194074.6A patent/CN1191936C/zh not_active Expired - Fee Related
- 1997-04-18 JP JP53782897A patent/JP3177897B2/ja not_active Expired - Fee Related
- 1997-04-18 CA CA002248807A patent/CA2248807C/en not_active Expired - Fee Related
- 1997-04-22 IN IN700CA1997 patent/IN191904B/en unknown
-
1998
- 1998-09-14 US US09/152,571 patent/US6286943B1/en not_active Expired - Lifetime
-
2001
- 2001-09-07 US US09/949,333 patent/US6618943B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CA2248807A1 (en) | 1997-10-30 |
| DE69714251D1 (de) | 2002-08-29 |
| RU2165853C2 (ru) | 2001-04-27 |
| CN1191936C (zh) | 2005-03-09 |
| JPH11506402A (ja) | 1999-06-08 |
| EP0901415A1 (en) | 1999-03-17 |
| JP3177897B2 (ja) | 2001-06-18 |
| WO1997039897A1 (en) | 1997-10-30 |
| IN191904B (enExample) | 2004-01-17 |
| EP0901415B1 (en) | 2002-07-24 |
| US6286943B1 (en) | 2001-09-11 |
| US6618943B2 (en) | 2003-09-16 |
| US20020005880A1 (en) | 2002-01-17 |
| CN1216502A (zh) | 1999-05-12 |
| DE69714251T2 (de) | 2003-03-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| MKLA | Lapsed |
Effective date: 20160418 |