CA2210130C - Dispositif de traitement d'elements plans au moyen d'un jet de plasma - Google Patents

Dispositif de traitement d'elements plans au moyen d'un jet de plasma Download PDF

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Publication number
CA2210130C
CA2210130C CA002210130A CA2210130A CA2210130C CA 2210130 C CA2210130 C CA 2210130C CA 002210130 A CA002210130 A CA 002210130A CA 2210130 A CA2210130 A CA 2210130A CA 2210130 C CA2210130 C CA 2210130C
Authority
CA
Canada
Prior art keywords
wafer
plasma jet
holders
wafers
holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA002210130A
Other languages
English (en)
Other versions
CA2210130A1 (fr
Inventor
Iskander Malikovich Tokmulin
Igor Petrovich Bagry
Boris Mikhailovich Balats
Oleg Vyacheslavovich Sinyagin
Alexei Borisovich Virovets
Vyacheslav Gennadievich Shamshurin
Alexandr Mikhailovich Antropov
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from RU9595100180A external-priority patent/RU2075135C1/ru
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of CA2210130A1 publication Critical patent/CA2210130A1/fr
Application granted granted Critical
Publication of CA2210130C publication Critical patent/CA2210130C/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

Le dispositif selon l'invention s'applique au domaine du traitement au plasma d'éléments plans tels que des plaques, des feuilles et des tranches dans l'ingénierie électrique et électronique. Ce dispositif, qui est conçu pour traiter les éléments plans à l'aide d'un jet de plasma, est constitué des éléments suivants qui sont montés dans une chambre fermée (1): un moyen d'entraînement (12) qui provoque le déplacement angulaire des supports (14) qui sont dotés d'un entraînement rotatif commun (18); un générateur de jet de plasma (10); et, monté à l'extérieur de la chambre fermée (1), un manipulateur (27) et des unités de stockage (28) des éléments (29). L'élément nécessitant le traitement (29) est sélectionné dans le dispositif de stockage par le manipulateur (27) et placé dans le support (14) qui, conjointement avec l'élément (29), passe au-dessus du générateur de jet de plasma (10) utilisé pour le traitement. Le cycle peut être répété autant de fois que nécessaire.
CA002210130A 1995-01-13 1995-04-11 Dispositif de traitement d'elements plans au moyen d'un jet de plasma Expired - Fee Related CA2210130C (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
RU95100180 1995-01-13
RU9595100180A RU2075135C1 (ru) 1995-01-13 1995-01-13 Установка для плазмоструйной обработки пластин
PCT/RU1995/000063 WO1996021943A1 (fr) 1995-01-13 1995-04-11 Dispositif de traitement d'elements plans au moyen d'un jet de plasma

Publications (2)

Publication Number Publication Date
CA2210130A1 CA2210130A1 (fr) 1996-07-18
CA2210130C true CA2210130C (fr) 2007-08-14

Family

ID=38434440

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002210130A Expired - Fee Related CA2210130C (fr) 1995-01-13 1995-04-11 Dispositif de traitement d'elements plans au moyen d'un jet de plasma

Country Status (1)

Country Link
CA (1) CA2210130C (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6402843B1 (en) * 1999-12-07 2002-06-11 Trusi Technologies, Llc Non-contact workpiece holder
US6534921B1 (en) 2000-11-09 2003-03-18 Samsung Electronics Co., Ltd. Method for removing residual metal-containing polymer material and ion implanted photoresist in atmospheric downstream plasma jet system

Also Published As

Publication number Publication date
CA2210130A1 (fr) 1996-07-18

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