CA2157033C - Device for lacquering or coating of plates or disks - Google Patents
Device for lacquering or coating of plates or disks Download PDFInfo
- Publication number
- CA2157033C CA2157033C CA002157033A CA2157033A CA2157033C CA 2157033 C CA2157033 C CA 2157033C CA 002157033 A CA002157033 A CA 002157033A CA 2157033 A CA2157033 A CA 2157033A CA 2157033 C CA2157033 C CA 2157033C
- Authority
- CA
- Canada
- Prior art keywords
- capillary gap
- capillary
- gap
- coating
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000576 coating method Methods 0.000 title claims abstract description 68
- 239000011248 coating agent Substances 0.000 title claims abstract description 52
- 239000007788 liquid Substances 0.000 claims abstract description 29
- 230000000694 effects Effects 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims description 25
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 claims description 4
- 230000003247 decreasing effect Effects 0.000 claims description 2
- 238000000151 deposition Methods 0.000 claims description 2
- 238000011144 upstream manufacturing Methods 0.000 claims 1
- 239000004922 lacquer Substances 0.000 description 16
- 239000010410 layer Substances 0.000 description 7
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 230000036621 balding Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000005499 meniscus Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/105—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material by capillary action, e.g. using wicks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/02—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material to surfaces by single means not covered by groups B05C1/00 - B05C7/00, whether or not also using other means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
- B05C9/12—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed after the application
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/003—Apparatus
- C23C2/0034—Details related to elements immersed in bath
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/003—Apparatus
- C23C2/0035—Means for continuously moving substrate through, into or out of the bath
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/006—Pattern or selective deposits
- C23C2/0062—Pattern or selective deposits without pre-treatment of the material to be coated, e.g. using masking elements such as casings, shields, fixtures or blocking elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0254—Coating heads with slot-shaped outlet
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Coating Apparatus (AREA)
- Road Signs Or Road Markings (AREA)
- Finishing Walls (AREA)
Abstract
In a device for lacquering or coating plates (17) or disks via a capillary slot (24) that is filled with a liquid coating medium, the plate (17) to be coated is advanced across with the surface to be coated facing downwardly so that due to the capillary effect a thin layer is deposited on the plate (17).
Description
n DEVICE FOR LACQUERING OR COATING
OF PLATES OR DISKS
The present invention relates to a device for lacquering or coating of thin elements, particularly plates or disks with an open channel and in particular with an open channel that is narrowed to a capillary, especially for coating glass plates for LCD production.
In the field of thin layer technology, especially for the production of LCD monitors, masks for semi-conductor manufacture, semi-conductor or ceramic substrates etc., the following problem is often encountered: Rectangular or round plates must be provided with a uniform layer of lacquer or other initially liquid media such as color filters or special protective layers.
It is therefore an object of the present invention to improve the known lacquering and coating devices and methods and to simplify their constructive design.
According to one aspect of the present invention, there is provided a device for lacquering or coating a thin flat part, comprising:
- an upwardly facing capillary gap for coating a downwardly facing surface of the thin flat part with a coating of a liquid coating medium contained in said capillary gap; and - a linear transport device for placing said thin flat part above said capillary gap in such a way that said thin flat part is at a predetermined distance of less than 0,2 mm above said capillary gap to prevent contact between i mechanical parts of said capillary gap and said thin flat part during coating process, and for advancing said downwardly facing surface above said capillary gap and at said predetermined distance such that a thin layer of said liquid coating medium is deposited on said downwardly facing surface by capillary and adhesion effects.
According to another aspect of the present invention, there is provided a method for lacquering or coating a thin element with a coating medium, comprising step of:
- providing a capillary gap having an upper end and a lower end, - supplying said lower end with said coating medium, - attaching an uncoated thin element to a holding device with the surface to be coated facing downwardly;
- linearly advancing said surface to be coated across the upper end of said capillary gap in order to deposit a thin layer of said coating medium on said surface by capillary and adhesion effects, without allowing said thin element to come into physical contact with the upper end of said capillary gap, a distance of less than 0,2 mm being maintained during a coating process between the upper end of said capillary gap and said surface to be coated.
By the expression "placing" or "means for placing" one should understand the fact that either the holding device supporting the thin element is displaceable towards the capillary slot or the holding device is stationary and it is the capillary slot which is displaced towards and under the surface to be coated of the thin element.
OF PLATES OR DISKS
The present invention relates to a device for lacquering or coating of thin elements, particularly plates or disks with an open channel and in particular with an open channel that is narrowed to a capillary, especially for coating glass plates for LCD production.
In the field of thin layer technology, especially for the production of LCD monitors, masks for semi-conductor manufacture, semi-conductor or ceramic substrates etc., the following problem is often encountered: Rectangular or round plates must be provided with a uniform layer of lacquer or other initially liquid media such as color filters or special protective layers.
It is therefore an object of the present invention to improve the known lacquering and coating devices and methods and to simplify their constructive design.
According to one aspect of the present invention, there is provided a device for lacquering or coating a thin flat part, comprising:
- an upwardly facing capillary gap for coating a downwardly facing surface of the thin flat part with a coating of a liquid coating medium contained in said capillary gap; and - a linear transport device for placing said thin flat part above said capillary gap in such a way that said thin flat part is at a predetermined distance of less than 0,2 mm above said capillary gap to prevent contact between i mechanical parts of said capillary gap and said thin flat part during coating process, and for advancing said downwardly facing surface above said capillary gap and at said predetermined distance such that a thin layer of said liquid coating medium is deposited on said downwardly facing surface by capillary and adhesion effects.
According to another aspect of the present invention, there is provided a method for lacquering or coating a thin element with a coating medium, comprising step of:
- providing a capillary gap having an upper end and a lower end, - supplying said lower end with said coating medium, - attaching an uncoated thin element to a holding device with the surface to be coated facing downwardly;
- linearly advancing said surface to be coated across the upper end of said capillary gap in order to deposit a thin layer of said coating medium on said surface by capillary and adhesion effects, without allowing said thin element to come into physical contact with the upper end of said capillary gap, a distance of less than 0,2 mm being maintained during a coating process between the upper end of said capillary gap and said surface to be coated.
By the expression "placing" or "means for placing" one should understand the fact that either the holding device supporting the thin element is displaceable towards the capillary slot or the holding device is stationary and it is the capillary slot which is displaced towards and under the surface to be coated of the thin element.
i According to another aspect of the present invention, there is also a method for lacquering or coating a thin plate, said method comprising the steps of:
a) providing a channel and filling said channel with a liquid coating medium;
b) arranging in said channel two elements at a distance from each other for forming therebetween a predetermined gap so that said predetermined gap can be supplied with said liquid coating medium from said channel;
c) advancing said plate towards said predetermined gap with a surface to be coated facing downwardly;
d) decreasing said distance between said two elements to reduce said predetermined gap into a capillary gap and to press an amount of the liquid coating medium out of said capillary gap;
e) linearly moving said plate across the capillary gap for depositing a film of the liquid coating medium on the plate by a capillary effect and by adhesion;
f) enlarging said distance between said two elements to increase said capillary gap into said predetermined gap in order to cancel the capillary effect and preserve the liquid coating medium; and g) repeating the steps c) through f).
In a preferred embodiment, it is possible to place the surface to be coated accross the upper end of said capillory slot by maintaining the holding device and therefore the thin element stationary and displacing the capillary slot under it. In such situation, the means for placing the thin element above said capillary slot comprises means for displacing said capillary slot below said thin element which is maintained stationary.
a) providing a channel and filling said channel with a liquid coating medium;
b) arranging in said channel two elements at a distance from each other for forming therebetween a predetermined gap so that said predetermined gap can be supplied with said liquid coating medium from said channel;
c) advancing said plate towards said predetermined gap with a surface to be coated facing downwardly;
d) decreasing said distance between said two elements to reduce said predetermined gap into a capillary gap and to press an amount of the liquid coating medium out of said capillary gap;
e) linearly moving said plate across the capillary gap for depositing a film of the liquid coating medium on the plate by a capillary effect and by adhesion;
f) enlarging said distance between said two elements to increase said capillary gap into said predetermined gap in order to cancel the capillary effect and preserve the liquid coating medium; and g) repeating the steps c) through f).
In a preferred embodiment, it is possible to place the surface to be coated accross the upper end of said capillory slot by maintaining the holding device and therefore the thin element stationary and displacing the capillary slot under it. In such situation, the means for placing the thin element above said capillary slot comprises means for displacing said capillary slot below said thin element which is maintained stationary.
n According to the present invention, there is also provided use of the devices and the methods of the present invention in the manufacture of LCD monitors, of masks for semi-conductors and semi-conductor substrates and ceramic substrates.
The preferred embodiments are explained below in general terms.
The thin element, for example a plate, with the surface to be lacquered facing downwardly is guided across the channel that is designed such that it acts as a capillary and thus supplies 3a 2157Q~~
the liquid coating medium or lacquer automatically and with an especially uniform velocity. The capillary effect is achieved by providing a narrow slot which preferably is less than 0.5 mm wide. Due to -the capillary effect, the lacquer or other liquid coating medium advances automatically upwardly with a constant velocity ag<~inst the force of gravity in the slot and exits at the channel surface. Above the slot the stream of lacquer contacts as a narrow line the plate surface to be coated and is deposited thereon.
It is advantageous to generate the capillary by providing two 2151C1:~3 vertically extending ithin plates that are immersed in the open channel filled with a liquid coating medium, whereby the distance between them can be adjusted in an infinitely variable manner. Thus, between the two plates over the entire length of the channel a slot with a width that corresponds mast suitably to the desired capillary effect can be formed. Accordingly, the capillary geometry can be adjusted to the various types of plates to be coated.
It is especially advantageous to guide the plate to be lacquered or coated with a uniform and low velocity at a very small distance, for e:~ample, less than 0.2 mm, across the upper end of the capillary slot. Accordingly, the lacquer, after exiting from the upper end of the capillary contacts directly the plate surface. Due to an adhesion effect, the lacquer is attached to the plane surface and is carried away from the channel surface with the plate. The result is that the following lacquer, in addition to its upward movement due to the capillary effect, is pulled from the channel and, as a function of the velocity of the plate, is deposited in a defined layer thickness on the plate. Due to the adhesion effect of the lacquer at the plate surface there is also no risk that the lacquE~r after exiting from the capillary slot could flow laterally, resulting in a decrease of the uniformness of the layer thickness.
It is expedient and advantageous to open the capillary slot between the plates after each lacquering process to between 2 mm and 3 mm. This prevents the automatic upward movement of the lacquer, which is. undesirable between lacquering processes.
It has been shown that during longer residence within the capillary slot the lacquer changes its properties. Such changes are disadvantageous for the lacquering process. However, when the capillary slot :is widened to between 2 mm and 3 mm, the lacquer remains unchanged.
The preferred embodiments are explained below in general terms.
The thin element, for example a plate, with the surface to be lacquered facing downwardly is guided across the channel that is designed such that it acts as a capillary and thus supplies 3a 2157Q~~
the liquid coating medium or lacquer automatically and with an especially uniform velocity. The capillary effect is achieved by providing a narrow slot which preferably is less than 0.5 mm wide. Due to -the capillary effect, the lacquer or other liquid coating medium advances automatically upwardly with a constant velocity ag<~inst the force of gravity in the slot and exits at the channel surface. Above the slot the stream of lacquer contacts as a narrow line the plate surface to be coated and is deposited thereon.
It is advantageous to generate the capillary by providing two 2151C1:~3 vertically extending ithin plates that are immersed in the open channel filled with a liquid coating medium, whereby the distance between them can be adjusted in an infinitely variable manner. Thus, between the two plates over the entire length of the channel a slot with a width that corresponds mast suitably to the desired capillary effect can be formed. Accordingly, the capillary geometry can be adjusted to the various types of plates to be coated.
It is especially advantageous to guide the plate to be lacquered or coated with a uniform and low velocity at a very small distance, for e:~ample, less than 0.2 mm, across the upper end of the capillary slot. Accordingly, the lacquer, after exiting from the upper end of the capillary contacts directly the plate surface. Due to an adhesion effect, the lacquer is attached to the plane surface and is carried away from the channel surface with the plate. The result is that the following lacquer, in addition to its upward movement due to the capillary effect, is pulled from the channel and, as a function of the velocity of the plate, is deposited in a defined layer thickness on the plate. Due to the adhesion effect of the lacquer at the plate surface there is also no risk that the lacquE~r after exiting from the capillary slot could flow laterally, resulting in a decrease of the uniformness of the layer thickness.
It is expedient and advantageous to open the capillary slot between the plates after each lacquering process to between 2 mm and 3 mm. This prevents the automatic upward movement of the lacquer, which is. undesirable between lacquering processes.
It has been shown that during longer residence within the capillary slot the lacquer changes its properties. Such changes are disadvantageous for the lacquering process. However, when the capillary slot :is widened to between 2 mm and 3 mm, the lacquer remains unchanged.
2~5~U3~
Expediently and advantageously, the slot between the plates is narrowed directly before starting the lacquering process to reach the capillary width. Accordingly, the lacquer located between the plates :is in a first step pressed mechanically upwardly until it exits from the channel and contacts the plate surface waiting to 1'oe coated. Thus, the coating process is started, which is sulbsequently commenced due to the capillary effect within the slot that is now of a capillary width, the movement of the plate, and the adhesion effect, as described to above.
According to another preferred embodiment of the present invention, it is no longer necessary to feed the plates with a leading corner and at a small upward angle to the horizontal across the lacquering channel. Furthermore, it is no longer required that a liquid meniscus forms above the channel so that a lacquer supply via a compensation tank becomes obsolete.
Further details and advantageous embodiments of the invention 20 may be taken from examples presented in the following and represented in the drawings, which examples are not to be understood as a limiitation of the invention. In the drawings:
Fig. 1 shows a side view of the inventive design of a lacquering and coating device; and Fig. 2 shows a cross-section of the channel with capillary slot according to Fig. 1 at the beginning of a coating process.
30 Fig. 1 shows a first embodiment of an inventive coating device 10. A channel 12 as well as supports 13 and 14 for a linear transport device 15 are connected to a frame 11. The movable portion of the linear transport device 15 is facing downwardly: To it a rotatable holding device 16 for a plate 17 to be coated is connected. The plate 17 is, for example, a glass plate to be coated with lacquer for manufacturing ~157U33 subsequently a mask or an LCD monitor. The plate 17 is attached to the holding device 16, for example, by a vacuum suction effect. For this purpose, the holding device 16 is provided with corresponding non-represented vacuum bores.
Within the context of the invention it is also possible to use other holding devices that are known to a person skilled in the art.
The channel 12 is shown in cross-section in Fig. 1 and in an enlarged view in Fig. 2. The cavity 18 of the open channel 12 is partially filled with lacquer. Two thin plates 19 and 20 are immersed from above in the lacquer filling. The plate 19 is fixedly connected at the location 33 to the upper edge of the channel 12. It is not displaceable. On the ather hand, the plate 20 is connected to a linear displacement unit 22 by means of a suitable device. Via this displacement unit 22, the plate 2o can be moved back and forth in the direction of the arrow 23. Accordingly, the width of the slot 24 between the plates 19 and 20 can be adjusted in an infinitely variable manner especially to a spacing between the plates that results in a slot 24 with capillary action that is less than 0.5 mm wide.
For achieving optimal lacquering or coating results, the corresponding liquid coating medium sho~.ild preferably have a certain temperature and should preferably be very clean.
Accordingly, it is supplied from a supply tank 28 via a temperature control unit 29 and a filter 30 to the channel 12.
Conveying can be achieved by generating a pressure (gas cushion) within the ;supply tank 28 or by providing a suitable arrangement of the supply tank 28 so that the liquid is conveyed by the geodetical height difference to the channel 12.
However, other suitable solutions for liquid conveyance are known to a person sk:i.lled in the art.
For a fully automatE~d version of the coating device, at the location indicated at 31 an automated loading device and at the -e.215 7 0 3 3 location 32 an automated unloading devic,~ are provided. The loading device 31 rf~moves a plate l7 to be coated fram a magazine connected at a certain location and conveys the plate to the plate holding dlevice 16. The unloading device 32 removes the plate 17 from the holding device 16 and loads it into another magazine connected at a certain location.
Mode of opefation of the lacquering and coating device l0 l0 In a first step, the plate 17 is automatically or manually connected to the holding device 16. By rotating the holding device 16, its position can still be corrected. The holding device 16, at this time, is located at the location indicated at 31 in Fig. 1. After the plate 17 has been correctly positioned at the holding device 16, the linear transport device 15 is set in motion in the direction of arrow 26; i.e., in direction toward the open channel 12.
Plate 17 is thus advanced from one side to the upper edge of 20 the slot 24. As soon as the leading edge 25 of the plate l7 is positioned directly above the slot 24, the~plate 20 within the channel 12 is advanced toward the plate 19 such that a suitable capillary width is provided between the plates. Due to the narrowing of the capi:Llary slot 24, a small amount of liquid is I
forced out at the upper side of the capillary slot 24 against the leading edge of t:he surface to be coated of the plate 17.
Thus, the coating process has begun. The plate 17 is now advanced further at a uniform velocity by the linear transport device 15 in the direction of arrow 26. Due to adhesion, a thin 30 liquid layer is deposited on the plate surface. The required liquid flow is supplied by the capillary action of the capillary slot 24. ~' It is possible to support the plate on a balding device 16, and to move the capillary slot 24 relative to the holding device so that the step of coating is performed with said holding device being stationary and the capillary slot being moved across the plate.
The coating process .i.s terminated as soon as the rear edge 27 of the plate 17 has passed the capillary slot 24. The two plates 19 and 20 are now moved apart to a distance of 2 to 3 mm for the aforementioned reasons until the next coating process is to be performed. The coated plate 17 is advanced to the location indicated at 32 where it may be automatically or l0 manually removed from the holding device 16.
Expediently and advantageously, the slot between the plates is narrowed directly before starting the lacquering process to reach the capillary width. Accordingly, the lacquer located between the plates :is in a first step pressed mechanically upwardly until it exits from the channel and contacts the plate surface waiting to 1'oe coated. Thus, the coating process is started, which is sulbsequently commenced due to the capillary effect within the slot that is now of a capillary width, the movement of the plate, and the adhesion effect, as described to above.
According to another preferred embodiment of the present invention, it is no longer necessary to feed the plates with a leading corner and at a small upward angle to the horizontal across the lacquering channel. Furthermore, it is no longer required that a liquid meniscus forms above the channel so that a lacquer supply via a compensation tank becomes obsolete.
Further details and advantageous embodiments of the invention 20 may be taken from examples presented in the following and represented in the drawings, which examples are not to be understood as a limiitation of the invention. In the drawings:
Fig. 1 shows a side view of the inventive design of a lacquering and coating device; and Fig. 2 shows a cross-section of the channel with capillary slot according to Fig. 1 at the beginning of a coating process.
30 Fig. 1 shows a first embodiment of an inventive coating device 10. A channel 12 as well as supports 13 and 14 for a linear transport device 15 are connected to a frame 11. The movable portion of the linear transport device 15 is facing downwardly: To it a rotatable holding device 16 for a plate 17 to be coated is connected. The plate 17 is, for example, a glass plate to be coated with lacquer for manufacturing ~157U33 subsequently a mask or an LCD monitor. The plate 17 is attached to the holding device 16, for example, by a vacuum suction effect. For this purpose, the holding device 16 is provided with corresponding non-represented vacuum bores.
Within the context of the invention it is also possible to use other holding devices that are known to a person skilled in the art.
The channel 12 is shown in cross-section in Fig. 1 and in an enlarged view in Fig. 2. The cavity 18 of the open channel 12 is partially filled with lacquer. Two thin plates 19 and 20 are immersed from above in the lacquer filling. The plate 19 is fixedly connected at the location 33 to the upper edge of the channel 12. It is not displaceable. On the ather hand, the plate 20 is connected to a linear displacement unit 22 by means of a suitable device. Via this displacement unit 22, the plate 2o can be moved back and forth in the direction of the arrow 23. Accordingly, the width of the slot 24 between the plates 19 and 20 can be adjusted in an infinitely variable manner especially to a spacing between the plates that results in a slot 24 with capillary action that is less than 0.5 mm wide.
For achieving optimal lacquering or coating results, the corresponding liquid coating medium sho~.ild preferably have a certain temperature and should preferably be very clean.
Accordingly, it is supplied from a supply tank 28 via a temperature control unit 29 and a filter 30 to the channel 12.
Conveying can be achieved by generating a pressure (gas cushion) within the ;supply tank 28 or by providing a suitable arrangement of the supply tank 28 so that the liquid is conveyed by the geodetical height difference to the channel 12.
However, other suitable solutions for liquid conveyance are known to a person sk:i.lled in the art.
For a fully automatE~d version of the coating device, at the location indicated at 31 an automated loading device and at the -e.215 7 0 3 3 location 32 an automated unloading devic,~ are provided. The loading device 31 rf~moves a plate l7 to be coated fram a magazine connected at a certain location and conveys the plate to the plate holding dlevice 16. The unloading device 32 removes the plate 17 from the holding device 16 and loads it into another magazine connected at a certain location.
Mode of opefation of the lacquering and coating device l0 l0 In a first step, the plate 17 is automatically or manually connected to the holding device 16. By rotating the holding device 16, its position can still be corrected. The holding device 16, at this time, is located at the location indicated at 31 in Fig. 1. After the plate 17 has been correctly positioned at the holding device 16, the linear transport device 15 is set in motion in the direction of arrow 26; i.e., in direction toward the open channel 12.
Plate 17 is thus advanced from one side to the upper edge of 20 the slot 24. As soon as the leading edge 25 of the plate l7 is positioned directly above the slot 24, the~plate 20 within the channel 12 is advanced toward the plate 19 such that a suitable capillary width is provided between the plates. Due to the narrowing of the capi:Llary slot 24, a small amount of liquid is I
forced out at the upper side of the capillary slot 24 against the leading edge of t:he surface to be coated of the plate 17.
Thus, the coating process has begun. The plate 17 is now advanced further at a uniform velocity by the linear transport device 15 in the direction of arrow 26. Due to adhesion, a thin 30 liquid layer is deposited on the plate surface. The required liquid flow is supplied by the capillary action of the capillary slot 24. ~' It is possible to support the plate on a balding device 16, and to move the capillary slot 24 relative to the holding device so that the step of coating is performed with said holding device being stationary and the capillary slot being moved across the plate.
The coating process .i.s terminated as soon as the rear edge 27 of the plate 17 has passed the capillary slot 24. The two plates 19 and 20 are now moved apart to a distance of 2 to 3 mm for the aforementioned reasons until the next coating process is to be performed. The coated plate 17 is advanced to the location indicated at 32 where it may be automatically or l0 manually removed from the holding device 16.
Claims (30)
1. A device for lacquering or coating a thin flat part, comprising:
- an upwardly facing capillary gap for coating a downwardly facing surface of the thin flat part with a coating of a liquid coating medium contained in said capillary gap; and - a linear transport device for placing said thin flat part above said capillary gap in such a way that said thin flat part is at a predetermined distance of less than 0,2 mm above said capillary gap to prevent contact between mechanical parts of said capillary gap and said thin flat part during coating process, and for advancing said downwardly facing surface above said capillary gap and at said predetermined distance such that a thin layer of said liquid coating medium is deposited on said downwardly facing surface by capillary and adhesion effects.
- an upwardly facing capillary gap for coating a downwardly facing surface of the thin flat part with a coating of a liquid coating medium contained in said capillary gap; and - a linear transport device for placing said thin flat part above said capillary gap in such a way that said thin flat part is at a predetermined distance of less than 0,2 mm above said capillary gap to prevent contact between mechanical parts of said capillary gap and said thin flat part during coating process, and for advancing said downwardly facing surface above said capillary gap and at said predetermined distance such that a thin layer of said liquid coating medium is deposited on said downwardly facing surface by capillary and adhesion effects.
2. The device according to claim 1, wherein the capillary gap comprises two parallel elements both immersed into the liquid coating medium contained in a channel.
3. The device according to claim 1 or 2, wherein during the coating process the capillary gap has a width which is less than 0,5 mm.
4. The device according to any one of claims 1 to 3, further comprising adjusting means for adjusting the width of the capillary gap during operation of the device.
5. The device according to claim 4, wherein a means is provided for enlargement of the width of the capillary gap after each coating process.
6. The device according to claim 5, wherein said means for the enlargement of the width of the capillary gap provides the enlargement of said width of 2 to 3 mm.
7. The device according to claim 5, wherein mans is provided for reducing the width of the capillary gap immediately before each coating process to thus press a predetermined amount of the liquid coating medium upwardly out of the capillary gap to thereby start the coating process.
8. The device according to claim 1, wherein an automatic loading station and an automatic unloading station are provided.
9. The device according to any one of claims 1 to 8, wherein the linear transport device comprises a holding device for holding the thin flat part.
10. The device according to any one of claims 1 to 9, wherein said thin flat part is a plate.
11. The device according to any one of claims 1 to 9, wherein said thin flat part is a disk.
12. A method for lacquering or coating a thin element with a coating medium, comprising step of:
- providing a capillary gap having an upper end and a lower end, - supplying said lower end with said coating medium, - attaching an uncoated thin element to a holding device with the surface to be coated facing downwardly, - linearly advancing said surface to be coated across the upper end of said capillary gap in order to deposit a thin layer of said coating medium on said surface by capillary and adhesion effects, without allowing said thin element to come into physical contact with the upper end of said capillary gap, a distance of less than 0,2 mm being maintained during a coating process between the upper end of said capillary gap and said surface to be coated.
- providing a capillary gap having an upper end and a lower end, - supplying said lower end with said coating medium, - attaching an uncoated thin element to a holding device with the surface to be coated facing downwardly, - linearly advancing said surface to be coated across the upper end of said capillary gap in order to deposit a thin layer of said coating medium on said surface by capillary and adhesion effects, without allowing said thin element to come into physical contact with the upper end of said capillary gap, a distance of less than 0,2 mm being maintained during a coating process between the upper end of said capillary gap and said surface to be coated.
13. The method according to claim 12, wherein said capillary gap has a width which is increased after overcoming the coating process to decrease the level of said coating medium in the capillary gap.
14. The method according to any one of claims 12 and 13, wherein said capillary gap has a width which is reduced at the beginning of performing the coating process in order to press a predetermined amount of medium upwardly out of the slot to thereby start the coating process.
15. The method according to any one of claims 12 and 13, wherein the coated thin element is unloaded from said holding device which is part of a linear transporting means, when said holding device reaches an unloading station.
16. The device according to any one of claims 1 to 11, wherein said transport device is displaceable towards said capillary slot which is stationary.
17. A method for lacquering or coating a thin plate, said method comprising the steps of:
a) providing a channel and filling said channel with a liquid coating medium;
b) arranging in said channel two elements at a distance from each other for forming therebetween a predetermined gap so that said predetermined gap can be supplied with said liquid coating medium from said channel;
c) advancing said plate towards said predetermined gap with a surface to be coated facing downwardly;
d) decreasing said distance between said two elements to reduce said predetermined gap into a capillary gap and to press an amount of the liquid coating medium out of said capillary gap;
e) linearly moving said plate across the capillary gap for depositing a film of the liquid coating medium on the plate by a capillary effect and by adhesion;
f) enlarging said distance between said two elements to increase said capillary gap into said predetermined gap in order to cancel the capillary effect and preserve the liquid coating medium; and g) repeating the steps c) through f).
a) providing a channel and filling said channel with a liquid coating medium;
b) arranging in said channel two elements at a distance from each other for forming therebetween a predetermined gap so that said predetermined gap can be supplied with said liquid coating medium from said channel;
c) advancing said plate towards said predetermined gap with a surface to be coated facing downwardly;
d) decreasing said distance between said two elements to reduce said predetermined gap into a capillary gap and to press an amount of the liquid coating medium out of said capillary gap;
e) linearly moving said plate across the capillary gap for depositing a film of the liquid coating medium on the plate by a capillary effect and by adhesion;
f) enlarging said distance between said two elements to increase said capillary gap into said predetermined gap in order to cancel the capillary effect and preserve the liquid coating medium; and g) repeating the steps c) through f).
18. The method according to claim 17, further comprising the step of maintaining a selected filling level of the channel.
19. The method according to claim 18, further comprising the steps of:
- supplying said liquid coating medium to said channel from a supply tank via a temperature control unit and a filter.
- supplying said liquid coating medium to said channel from a supply tank via a temperature control unit and a filter.
20. The method according to claim 17, 18 or 19, further comprising the step of arranging in a direction of guiding the plate an automatic loading station upstream of said predetermined gap and an automatic unloading station downstream of said predetermined gap for performing said method in a fully automated manner.
21. The method according to any one of claims 12 to 15, wherein said surface to be coated is placed across the upper end of said capillary gap by maintaining the holding device stationary and is coated by displacing said capillary gap under it.
22. The method according to any one of claims 12, 13, 14, 15 and 20, further comprising the steps of:
- supporting the plate on the holding device; and - moving said capillary gap relative to said holding device so that step of coating is performed with said holding device being stationary and said capillary gap being moved across the plate.
- supporting the plate on the holding device; and - moving said capillary gap relative to said holding device so that step of coating is performed with said holding device being stationary and said capillary gap being moved across the plate.
23. The device according to any one of claims 1 to 11, wherein said linear transport device comprises means for displacing said capillary gap below said thin flat part which is maintained stationary.
24. Use of a device according to any one of claims 1 to 11, and 16 for manufacturing LCD monitors.
25. Use of a device according to any one of claims 1 to 11, and 16, for manufacturing masks for semi-conductors.
26. Use of a device according to any one of claims 1 to 11, and 16 for manufacturing semi-conductor substrates and ceramic substrates.
27. Use of a method according to any one of claims 12, 13, 14, 15, 17, 18, 19, 20, 21, and 22 for manufacturing LCD
monitors.
monitors.
28. Use of a method according to any one of claims 12, 13, 14, 15, 17, 18, 19, 20, 21, and 22 for manufacturing masks for semi-conductors.
29. Use of a method according to any one of claims 12, 13, 14, 15, 17, 18, 19, 20, 21, and 22 for manufacturing semi-conductor substrates and ceramic substrates.
30. The method according to any one of the claims 17 to 20, wherein said two elements are parallel.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE9300392 | 1993-05-05 | ||
| DEPCT/DE93/00392 | 1993-05-05 | ||
| PCT/DE1993/000777 WO1994025177A1 (en) | 1993-05-05 | 1993-08-26 | Device for lacquering or coating plates or panels |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2157033A1 CA2157033A1 (en) | 1994-11-10 |
| CA2157033C true CA2157033C (en) | 2003-06-17 |
Family
ID=6888099
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002157033A Expired - Lifetime CA2157033C (en) | 1993-05-05 | 1993-08-26 | Device for lacquering or coating of plates or disks |
Country Status (11)
| Country | Link |
|---|---|
| EP (1) | EP0701487B1 (en) |
| JP (1) | JP2777057B2 (en) |
| KR (1) | KR0153355B1 (en) |
| CN (1) | CN1078108C (en) |
| AT (1) | ATE173657T1 (en) |
| CA (1) | CA2157033C (en) |
| DE (2) | DE4397349D2 (en) |
| FI (1) | FI108522B (en) |
| MY (1) | MY108987A (en) |
| SG (1) | SG52700A1 (en) |
| WO (1) | WO1994025177A1 (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE59509410D1 (en) * | 1994-12-22 | 2001-08-16 | Steag Hamatech Ag | METHOD AND DEVICE FOR LACQUERING OR COATING A SUBSTRATE |
| DE4445985A1 (en) * | 1994-12-22 | 1996-06-27 | Steag Micro Tech Gmbh | Method and device for coating or coating a substrate |
| EP1010473B1 (en) | 1998-12-17 | 2006-07-12 | Guardian Industries Corp. | Device and method for coating a even substrate |
| JP4481688B2 (en) * | 2003-04-10 | 2010-06-16 | Ｈｏｙａ株式会社 | Substrate processing apparatus, coating apparatus, coating method, and photomask manufacturing method |
| JP2005051220A (en) * | 2003-07-17 | 2005-02-24 | Hoya Corp | Method for manufacturing substrate with resist film |
| US7332034B2 (en) | 2003-11-21 | 2008-02-19 | Seiko Epson Corporation | Coating apparatus and coating method using the same |
| DE102004044576B4 (en) * | 2004-09-13 | 2007-09-27 | Schott Ag | Process and apparatus for liquid coating and their use |
| JP5086714B2 (en) * | 2007-07-13 | 2012-11-28 | Ｈｏｙａ株式会社 | Mask blank manufacturing method and photomask manufacturing method |
| CN101834069B (en) * | 2010-04-07 | 2012-06-27 | 燕山大学 | Method for sensitizing semi-conductor double membrane by dye |
| CN103567109B (en) * | 2012-07-26 | 2015-12-16 | 耐落螺丝(昆山)有限公司 | Screw sizer and coating method |
| KR20140069677A (en) * | 2012-11-29 | 2014-06-10 | 삼성디스플레이 주식회사 | Device for printing to substrate and method for printing to substrate |
| WO2017126408A1 (en) * | 2016-01-22 | 2017-07-27 | ショーダテクトロン株式会社 | End face-coating device |
| CN106935534B (en) * | 2017-04-28 | 2019-11-05 | 京东方科技集团股份有限公司 | Packaging system and display panel packaging method |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2046596A (en) * | 1932-01-13 | 1936-07-07 | Patent Button Co | Apparatus for uniformly coating flat surfaces |
| US4370356A (en) * | 1981-05-20 | 1983-01-25 | Integrated Technologies, Inc. | Method of meniscus coating |
| DE3231326A1 (en) * | 1982-08-23 | 1984-02-23 | Siemens AG, 1000 Berlin und 8000 München | DEVICE FOR PRODUCING LARGE-SCALE, BAND-SHAPED SILICON BODIES FOR SOLAR CELLS |
| SU1736626A1 (en) * | 1990-02-14 | 1992-05-30 | Казанский Научно-Исследовательский Технологический И Проектный Институт Химико-Фотографической Промышленности | Extrusion-type spraying arrangement |
-
1993
- 1993-08-26 EP EP93918918A patent/EP0701487B1/en not_active Expired - Lifetime
- 1993-08-26 KR KR1019950704862A patent/KR0153355B1/en not_active IP Right Cessation
- 1993-08-26 SG SG1996008058A patent/SG52700A1/en unknown
- 1993-08-26 AT AT93918918T patent/ATE173657T1/en not_active IP Right Cessation
- 1993-08-26 CA CA002157033A patent/CA2157033C/en not_active Expired - Lifetime
- 1993-08-26 DE DE4397349T patent/DE4397349D2/en not_active Expired - Fee Related
- 1993-08-26 DE DE59309164T patent/DE59309164D1/en not_active Expired - Lifetime
- 1993-08-26 WO PCT/DE1993/000777 patent/WO1994025177A1/en active IP Right Grant
- 1993-11-02 MY MYPI93002286A patent/MY108987A/en unknown
-
1994
- 1994-03-02 CN CN94102023A patent/CN1078108C/en not_active Expired - Lifetime
- 1994-05-02 JP JP6093563A patent/JP2777057B2/en not_active Expired - Fee Related
-
1995
- 1995-11-01 FI FI955214A patent/FI108522B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| EP0701487B1 (en) | 1998-11-25 |
| MY108987A (en) | 1996-11-30 |
| FI108522B (en) | 2002-02-15 |
| EP0701487A1 (en) | 1996-03-20 |
| DE4397349D2 (en) | 1996-11-14 |
| JPH06343908A (en) | 1994-12-20 |
| SG52700A1 (en) | 1998-09-28 |
| CN1078108C (en) | 2002-01-23 |
| FI955214A (en) | 1995-11-01 |
| ATE173657T1 (en) | 1998-12-15 |
| CN1106716A (en) | 1995-08-16 |
| JP2777057B2 (en) | 1998-07-16 |
| CA2157033A1 (en) | 1994-11-10 |
| KR0153355B1 (en) | 1998-11-16 |
| KR960701706A (en) | 1996-03-28 |
| DE59309164D1 (en) | 1999-01-07 |
| FI955214A0 (en) | 1995-11-01 |
| WO1994025177A1 (en) | 1994-11-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA2157033C (en) | Device for lacquering or coating of plates or disks | |
| US5455062A (en) | Capillary device for lacquering or coating plates or disks | |
| CA2183163C (en) | Coating method and coating apparatus | |
| CN101003041B (en) | Application method, applicator and processing procedure | |
| US7169229B2 (en) | Moving head, coating apparatus | |
| US6887132B2 (en) | Slurry distributor for chemical mechanical polishing apparatus and method of using the same | |
| KR101984327B1 (en) | Coating film forming apparatus | |
| US6568447B1 (en) | Cover glass adhering device | |
| JP3048789B2 (en) | Fluid coating device | |
| TW201402223A (en) | Web coating device | |
| JP4516034B2 (en) | Coating method, coating apparatus, and coating program | |
| KR20190124641A (en) | Apparatus for supplying treatment liquid and method of supplying treatment liquid | |
| KR101067143B1 (en) | Coating film forming apparatus and coating film forming method | |
| US5650196A (en) | Device for coating substrates in semiconductor production | |
| JP4403592B2 (en) | Coating apparatus, substrate manufacturing method, and color filter manufacturing apparatus and manufacturing method using the same | |
| KR20020075295A (en) | Substrate coating unit and sabstrate coating method | |
| JP3811740B2 (en) | Coating equipment | |
| JP3267822B2 (en) | Applicator for coating liquid on substrate | |
| JP2018114476A (en) | Apparatus and method for coating | |
| KR950002148Y1 (en) | Roll coating apparatus for forming film of uniform thickness | |
| JP4116705B2 (en) | Coating device | |
| JPH09131559A (en) | Coating device and coating method as well as apparatus for production of color filter and its production | |
| JPH05190439A (en) | Coating apparatus | |
| TW202319125A (en) | Substrate coating apparatus and substrate coating method | |
| JP3108224B2 (en) | Solder coating equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request |