CA2146304A1 - Non-corrosion photoresist stripping composition - Google Patents

Non-corrosion photoresist stripping composition

Info

Publication number
CA2146304A1
CA2146304A1 CA002146304A CA2146304A CA2146304A1 CA 2146304 A1 CA2146304 A1 CA 2146304A1 CA 002146304 A CA002146304 A CA 002146304A CA 2146304 A CA2146304 A CA 2146304A CA 2146304 A1 CA2146304 A1 CA 2146304A1
Authority
CA
Canada
Prior art keywords
group
stripper
weight
stripper composition
hydrogen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002146304A
Other languages
English (en)
French (fr)
Inventor
Kenji Honda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OCG Microelectronic Materials Inc
Original Assignee
OCG Microelectronic Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OCG Microelectronic Materials Inc filed Critical OCG Microelectronic Materials Inc
Publication of CA2146304A1 publication Critical patent/CA2146304A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Detergent Compositions (AREA)
CA002146304A 1994-04-18 1995-04-04 Non-corrosion photoresist stripping composition Abandoned CA2146304A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US228,775 1994-04-18
US08/228,775 US5472830A (en) 1994-04-18 1994-04-18 Non-corrosion photoresist stripping composition

Publications (1)

Publication Number Publication Date
CA2146304A1 true CA2146304A1 (en) 1995-10-19

Family

ID=22858538

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002146304A Abandoned CA2146304A1 (en) 1994-04-18 1995-04-04 Non-corrosion photoresist stripping composition

Country Status (5)

Country Link
US (1) US5472830A (ja)
EP (1) EP0678788A3 (ja)
JP (1) JP2914646B2 (ja)
KR (1) KR950033702A (ja)
CA (1) CA2146304A1 (ja)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5597678A (en) * 1994-04-18 1997-01-28 Ocg Microelectronic Materials, Inc. Non-corrosive photoresist stripper composition
US5561105A (en) * 1995-05-08 1996-10-01 Ocg Microelectronic Materials, Inc. Chelating reagent containing photoresist stripper composition
US5507978A (en) * 1995-05-08 1996-04-16 Ocg Microelectronic Materials, Inc. Novolak containing photoresist stripper composition
US5612304A (en) * 1995-07-07 1997-03-18 Olin Microelectronic Chemicals, Inc. Redox reagent-containing post-etch residue cleaning composition
US5648324A (en) * 1996-01-23 1997-07-15 Ocg Microelectronic Materials, Inc. Photoresist stripping composition
US5665688A (en) * 1996-01-23 1997-09-09 Olin Microelectronics Chemicals, Inc. Photoresist stripping composition
US5817610A (en) * 1996-09-06 1998-10-06 Olin Microelectronic Chemicals, Inc. Non-corrosive cleaning composition for removing plasma etching residues
US6030932A (en) 1996-09-06 2000-02-29 Olin Microelectronic Chemicals Cleaning composition and method for removing residues
US5780406A (en) * 1996-09-06 1998-07-14 Honda; Kenji Non-corrosive cleaning composition for removing plasma etching residues
US5759973A (en) * 1996-09-06 1998-06-02 Olin Microelectronic Chemicals, Inc. Photoresist stripping and cleaning compositions
FR2756837B1 (fr) * 1996-12-06 1999-01-15 Atochem Elf Sa Composition decapante pour peintures, vernis ou laques
DE69613476T2 (de) * 1996-12-09 2002-04-18 Imec Inter Uni Micro Electr Metallspülungsverfahren mit kontrollierter Metallmikrokorrosionsreduktion
US5798323A (en) * 1997-05-05 1998-08-25 Olin Microelectronic Chemicals, Inc. Non-corrosive stripping and cleaning composition
US6268323B1 (en) 1997-05-05 2001-07-31 Arch Specialty Chemicals, Inc. Non-corrosive stripping and cleaning composition
US6033993A (en) * 1997-09-23 2000-03-07 Olin Microelectronic Chemicals, Inc. Process for removing residues from a semiconductor substrate
US6130195A (en) * 1997-11-03 2000-10-10 Kyzen Corporation Cleaning compositions and methods for cleaning using cyclic ethers and alkoxy methyl butanols
US5962197A (en) * 1998-03-27 1999-10-05 Analyze Inc. Alkaline organic photoresist stripper
US6878213B1 (en) 1998-12-07 2005-04-12 Scp Global Technologies, Inc. Process and system for rinsing of semiconductor substrates
KR100286860B1 (ko) * 1998-12-31 2001-07-12 주식회사 동진쎄미켐 포토레지스트 리무버 조성물
US6413923B2 (en) 1999-11-15 2002-07-02 Arch Specialty Chemicals, Inc. Non-corrosive cleaning composition for removing plasma etching residues
US6455479B1 (en) 2000-08-03 2002-09-24 Shipley Company, L.L.C. Stripping composition
TWI275903B (en) * 2001-03-13 2007-03-11 Nagase Chemtex Corp A composition for stripping photo resist
CN1261826C (zh) * 2002-01-11 2006-06-28 Az电子材料（日本）株式会社 一种用于正性或负性光刻胶的清洗剂组合物
NI200300043A (es) 2002-03-28 2003-11-05 Warner Lambert Co AMINOACIDOS CON AFINIDAD POR LA PROTEINA a2DELTA.
US7166419B2 (en) * 2002-09-26 2007-01-23 Air Products And Chemicals, Inc. Compositions substrate for removing etching residue and use thereof
BRPI0414819A (pt) 2003-09-25 2006-11-14 Warner Lambert Co pró-fármacos de aminoácidos com afinidade para a proteìna alfa2delta
JP4782200B2 (ja) * 2005-08-13 2011-09-28 テクノ セミケム シーオー．， エルティーディー． 半導体製造用感光性樹脂除去剤組成物
KR100793241B1 (ko) * 2006-06-19 2008-01-10 삼성전자주식회사 실리콘 고분자 및 포토레지스트 제거용 조성물, 이를이용한 막 제거 방법 및 패턴 형성 방법
WO2010073887A1 (ja) * 2008-12-25 2010-07-01 ナガセケムテックス株式会社 フォトレジスト剥離剤組成物、積層金属配線基板のフォトレジスト剥離方法及び製造方法
JP6112446B2 (ja) * 2012-10-31 2017-04-12 パナソニックＩｐマネジメント株式会社 フォトレジスト剥離液組成物
CN110441997B (zh) * 2019-08-19 2023-02-24 江阴江化微电子材料股份有限公司 一种改进的环保水系光刻胶剥离液

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4306933A (en) * 1980-02-11 1981-12-22 Chemline Industries Tin/tin-lead stripping solutions
JPS56115368A (en) * 1980-02-15 1981-09-10 San Ei Chem Ind Ltd Releasing agent of photosensitive polymer
US4455364A (en) * 1981-11-14 1984-06-19 Konishiroku Photo Industry Co., Ltd. Process for forming metallic image, composite material for the same
DE3501675A1 (de) * 1985-01-19 1986-07-24 Merck Patent Gmbh, 6100 Darmstadt Mittel und verfahren zur entfernung von fotoresist- und stripperresten von halbleitersubstraten
US4617251A (en) * 1985-04-11 1986-10-14 Olin Hunt Specialty Products, Inc. Stripping composition and method of using the same
JPH0721638B2 (ja) * 1986-07-18 1995-03-08 東京応化工業株式会社 基板の処理方法
US4770713A (en) * 1986-12-10 1988-09-13 Advanced Chemical Technologies, Inc. Stripping compositions containing an alkylamide and an alkanolamine and use thereof
JPS63208043A (ja) * 1987-02-25 1988-08-29 Kanto Kagaku Kk ポジ型フオトレジスト用水溶性剥離液
JP2553872B2 (ja) * 1987-07-21 1996-11-13 東京応化工業株式会社 ホトレジスト用剥離液
US4824763A (en) * 1987-07-30 1989-04-25 Ekc Technology, Inc. Triamine positive photoresist stripping composition and prebaking process
JPH0769619B2 (ja) * 1987-09-25 1995-07-31 旭化成工業株式会社 フオトレジスト剥離剤
DE3828513A1 (de) * 1988-08-23 1990-03-01 Merck Patent Gmbh Abloesemittel fuer fotoresists
US5102777A (en) * 1990-02-01 1992-04-07 Ardrox Inc. Resist stripping
US5279771A (en) * 1990-11-05 1994-01-18 Ekc Technology, Inc. Stripping compositions comprising hydroxylamine and alkanolamine
JPH04305660A (ja) * 1991-04-03 1992-10-28 Sharp Corp 画像形成装置
DE69333877T2 (de) * 1992-07-09 2006-06-14 Ekc Technology Inc Reinigungsmittelzusammensetzung, das einem Redox Aminverbindung enthält
WO1994008276A1 (en) * 1992-09-28 1994-04-14 Ducoa L.P. Photoresist stripping process using n,n-dimethyl-bis(2-hydroxyethyl) quaternary ammonium hydroxide
US5308745A (en) * 1992-11-06 1994-05-03 J. T. Baker Inc. Alkaline-containing photoresist stripping compositions producing reduced metal corrosion with cross-linked or hardened resist resins

Also Published As

Publication number Publication date
US5472830A (en) 1995-12-05
EP0678788A2 (en) 1995-10-25
EP0678788A3 (en) 1997-01-08
KR950033702A (ko) 1995-12-26
JPH07295240A (ja) 1995-11-10
JP2914646B2 (ja) 1999-07-05

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Legal Events

Date Code Title Description
FZDE Discontinued