CA2128947A1 - Methode pour introduire un microcircuit dans une carte intelligente ou une carte a puce et carte comportant un microcircuit incorpore avec cette methode - Google Patents

Methode pour introduire un microcircuit dans une carte intelligente ou une carte a puce et carte comportant un microcircuit incorpore avec cette methode

Info

Publication number
CA2128947A1
CA2128947A1 CA 2128947 CA2128947A CA2128947A1 CA 2128947 A1 CA2128947 A1 CA 2128947A1 CA 2128947 CA2128947 CA 2128947 CA 2128947 A CA2128947 A CA 2128947A CA 2128947 A1 CA2128947 A1 CA 2128947A1
Authority
CA
Canada
Prior art keywords
microcircuit
card
area
stage
process according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA 2128947
Other languages
English (en)
Inventor
Jean-Noel Audoux
Michel Gaumet
Michel Gouiller
Alain Larchevesque
Benoit Thevenot
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Solaic SA
Original Assignee
Solaic SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Solaic SA filed Critical Solaic SA
Priority to CA 2128947 priority Critical patent/CA2128947A1/fr
Publication of CA2128947A1 publication Critical patent/CA2128947A1/fr
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/818—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the cooling constructional aspects, or by the thermal or electrical insulating or conducting constructional aspects of the welding jaws or of the clamps ; comprising means for compensating for the thermal expansion of the welding jaws or of the clamps
    • B29C66/8181—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the cooling constructional aspects, or by the thermal or electrical insulating or conducting constructional aspects of the welding jaws or of the clamps ; comprising means for compensating for the thermal expansion of the welding jaws or of the clamps characterised by the cooling constructional aspects
    • B29C66/81811—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the cooling constructional aspects, or by the thermal or electrical insulating or conducting constructional aspects of the welding jaws or of the clamps ; comprising means for compensating for the thermal expansion of the welding jaws or of the clamps characterised by the cooling constructional aspects of the welding jaws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Credit Cards Or The Like (AREA)
CA 2128947 1994-07-27 1994-07-27 Methode pour introduire un microcircuit dans une carte intelligente ou une carte a puce et carte comportant un microcircuit incorpore avec cette methode Abandoned CA2128947A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CA 2128947 CA2128947A1 (fr) 1994-07-27 1994-07-27 Methode pour introduire un microcircuit dans une carte intelligente ou une carte a puce et carte comportant un microcircuit incorpore avec cette methode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA 2128947 CA2128947A1 (fr) 1994-07-27 1994-07-27 Methode pour introduire un microcircuit dans une carte intelligente ou une carte a puce et carte comportant un microcircuit incorpore avec cette methode

Publications (1)

Publication Number Publication Date
CA2128947A1 true CA2128947A1 (fr) 1996-01-28

Family

ID=4154070

Family Applications (1)

Application Number Title Priority Date Filing Date
CA 2128947 Abandoned CA2128947A1 (fr) 1994-07-27 1994-07-27 Methode pour introduire un microcircuit dans une carte intelligente ou une carte a puce et carte comportant un microcircuit incorpore avec cette methode

Country Status (1)

Country Link
CA (1) CA2128947A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004070769A2 (fr) * 2003-02-05 2004-08-19 Infineon Technologies Ag Procede de fabrication d'une decoupe de microplaquette par un procede thermique et de pression a l'aide d'un materiau thermoplastique
WO2007075352A3 (fr) * 2005-12-21 2007-10-11 Avery Dennison Corp Dispositif electrique et techniques de fabrication de gaufrage de film
US8695207B2 (en) 2008-06-02 2014-04-15 Nxp B.V. Method for manufacturing an electronic device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004070769A2 (fr) * 2003-02-05 2004-08-19 Infineon Technologies Ag Procede de fabrication d'une decoupe de microplaquette par un procede thermique et de pression a l'aide d'un materiau thermoplastique
WO2004070769A3 (fr) * 2003-02-05 2005-02-24 Infineon Technologies Ag Procede de fabrication d'une decoupe de microplaquette par un procede thermique et de pression a l'aide d'un materiau thermoplastique
WO2007075352A3 (fr) * 2005-12-21 2007-10-11 Avery Dennison Corp Dispositif electrique et techniques de fabrication de gaufrage de film
US8067253B2 (en) 2005-12-21 2011-11-29 Avery Dennison Corporation Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film
EP2323079A3 (fr) * 2005-12-21 2013-05-22 Avery Dennison Corporation Techniques de fabrication d'un dispositif electrique
US8695207B2 (en) 2008-06-02 2014-04-15 Nxp B.V. Method for manufacturing an electronic device

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Legal Events

Date Code Title Description
FZDE Dead