CA2125994C - Field control and stability enhancement in multi-layer 3-dimensional structures - Google Patents

Field control and stability enhancement in multi-layer 3-dimensional structures

Info

Publication number
CA2125994C
CA2125994C CA002125994A CA2125994A CA2125994C CA 2125994 C CA2125994 C CA 2125994C CA 002125994 A CA002125994 A CA 002125994A CA 2125994 A CA2125994 A CA 2125994A CA 2125994 C CA2125994 C CA 2125994C
Authority
CA
Canada
Prior art keywords
layers
dielectric
field control
multilayer circuit
circuit structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CA002125994A
Other languages
English (en)
French (fr)
Other versions
CA2125994A1 (en
Inventor
Robert F. Mcclanahan
Robert D. Washburn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Hughes Aircraft Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hughes Aircraft Co filed Critical Hughes Aircraft Co
Publication of CA2125994A1 publication Critical patent/CA2125994A1/en
Application granted granted Critical
Publication of CA2125994C publication Critical patent/CA2125994C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5383—Multilayer substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CA002125994A 1992-09-24 1993-09-21 Field control and stability enhancement in multi-layer 3-dimensional structures Expired - Fee Related CA2125994C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/951,504 US5396397A (en) 1992-09-24 1992-09-24 Field control and stability enhancement in multi-layer, 3-dimensional structures
US951,504 1992-09-24

Publications (2)

Publication Number Publication Date
CA2125994A1 CA2125994A1 (en) 1994-03-31
CA2125994C true CA2125994C (en) 1997-08-12

Family

ID=25491760

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002125994A Expired - Fee Related CA2125994C (en) 1992-09-24 1993-09-21 Field control and stability enhancement in multi-layer 3-dimensional structures

Country Status (10)

Country Link
US (1) US5396397A (US20110009641A1-20110113-C00185.png)
EP (1) EP0613608B1 (US20110009641A1-20110113-C00185.png)
JP (1) JPH07501909A (US20110009641A1-20110113-C00185.png)
CA (1) CA2125994C (US20110009641A1-20110113-C00185.png)
DE (1) DE69309652T2 (US20110009641A1-20110113-C00185.png)
DK (1) DK0613608T3 (US20110009641A1-20110113-C00185.png)
ES (1) ES2101345T3 (US20110009641A1-20110113-C00185.png)
GR (1) GR3023705T3 (US20110009641A1-20110113-C00185.png)
MX (1) MX9305884A (US20110009641A1-20110113-C00185.png)
WO (1) WO1994007347A1 (US20110009641A1-20110113-C00185.png)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5780375A (en) * 1993-10-19 1998-07-14 E. I. Du Pont De Nemours And Company Thick film composition for modifying the electrical properties of a dielectric layer
US5590017A (en) * 1995-04-03 1996-12-31 Aluminum Company Of America Alumina multilayer wiring substrate provided with high dielectric material layer
US5886597A (en) * 1997-03-28 1999-03-23 Virginia Tech Intellectual Properties, Inc. Circuit structure including RF/wideband resonant vias
US7336468B2 (en) 1997-04-08 2008-02-26 X2Y Attenuators, Llc Arrangement for energy conditioning
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
US7321485B2 (en) 1997-04-08 2008-01-22 X2Y Attenuators, Llc Arrangement for energy conditioning
US5929729A (en) * 1997-10-24 1999-07-27 Com Dev Limited Printed lumped element stripline circuit ground-signal-ground structure
JP2000124612A (ja) * 1998-01-19 2000-04-28 Toshiba Corp 配線基板とその製造方法、その配線基板を具える電気機器
JP3119630B2 (ja) * 1998-09-18 2000-12-25 日本電気株式会社 半導体チップモジュール用多層回路基板およびその製造方法
KR20000034924A (ko) * 1998-11-17 2000-06-26 제닌 엠. 데이비스 저온 동시소성 다층세라믹내 수동 전자소자들
US6288906B1 (en) * 1998-12-18 2001-09-11 Intel Corporation Multiple layer printed circuit board having power planes on outer layers
CN1339199A (zh) * 1999-02-03 2002-03-06 西门子公司 集成的天线耦合元件
US6205032B1 (en) * 1999-03-16 2001-03-20 Cts Corporation Low temperature co-fired ceramic with improved registration
US6429383B1 (en) * 1999-04-14 2002-08-06 Intel Corporation Apparatus and method for improving circuit board solder
US6492600B1 (en) * 1999-06-28 2002-12-10 International Business Machines Corporation Laminate having plated microvia interconnects and method for forming the same
US6395996B1 (en) * 2000-05-16 2002-05-28 Silicon Integrated Systems Corporation Multi-layered substrate with a built-in capacitor design
JP2002111222A (ja) * 2000-10-02 2002-04-12 Matsushita Electric Ind Co Ltd 多層基板
DE10063437A1 (de) * 2000-12-20 2002-07-11 Bosch Gmbh Robert Antennenanordnung
JP3586435B2 (ja) * 2001-03-30 2004-11-10 ユーディナデバイス株式会社 高周波半導体装置
JP3781178B2 (ja) * 2001-03-30 2006-05-31 ユーディナデバイス株式会社 高周波半導体装置の多層配線構造
JP3818864B2 (ja) * 2001-03-30 2006-09-06 ユーディナデバイス株式会社 高周波半導体装置
US6900992B2 (en) * 2001-09-18 2005-05-31 Intel Corporation Printed circuit board routing and power delivery for high frequency integrated circuits
US6963493B2 (en) * 2001-11-08 2005-11-08 Avx Corporation Multilayer electronic devices with via components
JP3792635B2 (ja) * 2001-12-14 2006-07-05 富士通株式会社 電子装置
JP2003204209A (ja) * 2002-01-07 2003-07-18 Kyocera Corp 高周波用配線基板
US6711029B2 (en) * 2002-05-21 2004-03-23 Cts Corporation Low temperature co-fired ceramic with improved shrinkage control
US7349225B1 (en) * 2002-10-22 2008-03-25 Odyssian Technology, Llc Multifunctional composite sandwich element with embedded electronics
US7265300B2 (en) * 2003-03-21 2007-09-04 Commscope Solutions Properties, Llc Next high frequency improvement using hybrid substrates of two materials with different dielectric constant frequency slopes
US8569142B2 (en) * 2003-11-28 2013-10-29 Blackberry Limited Multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same
US7342181B2 (en) * 2004-03-12 2008-03-11 Commscope Inc. Of North Carolina Maximizing capacitance per unit area while minimizing signal transmission delay in PCB
US6908809B1 (en) * 2004-04-02 2005-06-21 Harris Corporation Embedded capacitors using conductor filled vias
US7980900B2 (en) * 2004-05-14 2011-07-19 Commscope, Inc. Of North Carolina Next high frequency improvement by using frequency dependent effective capacitance
US7190594B2 (en) * 2004-05-14 2007-03-13 Commscope Solutions Properties, Llc Next high frequency improvement by using frequency dependent effective capacitance
US7175724B2 (en) * 2004-11-22 2007-02-13 E. I. Du Pont De Nemours And Company Process for the constrained sintering of a pseudo-symmetrically configured low temperature cofired ceramic structure
US7067026B2 (en) * 2004-11-22 2006-06-27 E. I. Du Pont De Nemours And Company Process for the constrained sintering of a pseudo-symmetrically configured low temperature cofired ceramic structure
US20060213686A1 (en) * 2004-12-28 2006-09-28 Shin-Hsien Wu Cut Via Structure For And Manufacturing Method Of Connecting Separate Conductors
JP2008537843A (ja) 2005-03-01 2008-09-25 エックストゥーワイ アテニュエイターズ，エルエルシー 内部で重なり合った調整器
JP4907281B2 (ja) * 2006-09-26 2012-03-28 日東電工株式会社 フレキシブル配線回路基板
US7742276B2 (en) * 2007-03-30 2010-06-22 Industrial Technology Research Institute Wiring structure of laminated capacitors
JP5012899B2 (ja) * 2007-07-26 2012-08-29 株式会社村田製作所 多層セラミック基板およびその製造方法
US8047879B2 (en) * 2009-01-26 2011-11-01 Commscope, Inc. Of North Carolina Printed wiring boards and communication connectors having series inductor-capacitor crosstalk compensation circuits that share a common inductor
KR101038234B1 (ko) * 2009-02-24 2011-06-01 삼성전기주식회사 전자기 밴드갭 구조를 이용한 ｅｍｉ 노이즈 저감 기판
JP5397539B2 (ja) * 2010-03-31 2014-01-22 株式会社村田製作所 多層セラミック基板およびその製造方法
US20130052433A1 (en) * 2011-08-29 2013-02-28 E I Du Pont De Nemours And Company Compositions for low k, low temperature co-fired composite (ltcc) tapes and low shrinkage, multi-layer ltcc structures formed therefrom
WO2018009269A1 (en) 2016-07-06 2018-01-11 Lumileds Llc Printed circuit board for integrated led driver
CN206451500U (zh) * 2017-02-06 2017-08-29 京东方科技集团股份有限公司 显示装置控制单元和显示装置
CN115483033A (zh) * 2022-09-02 2022-12-16 深圳聚源新材科技有限公司 电容器、电路板及电路板埋容工艺

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55130198A (en) * 1979-03-30 1980-10-08 Hitachi Ltd Hybrid integrated circuit board for tuner
US4567542A (en) * 1984-04-23 1986-01-28 Nec Corporation Multilayer ceramic substrate with interlayered capacitor
JPS61147406A (ja) * 1984-12-18 1986-07-05 太陽誘電株式会社 誘電体磁器組成物
GB2197540B (en) * 1986-11-12 1991-04-17 Murata Manufacturing Co A circuit structure.
JPH0614600B2 (ja) * 1988-01-26 1994-02-23 松下電工株式会社 Ｌｃｒ多層板
JPH0682927B2 (ja) * 1988-01-26 1994-10-19 松下電工株式会社 ポリフェニレンオキサイド樹脂系ｌｃｒ多層板
US5089881A (en) * 1988-11-03 1992-02-18 Micro Substrates, Inc. Fine-pitch chip carrier
US4882650A (en) * 1988-12-05 1989-11-21 Sprague Electric Company Magnesium titanate ceramic and dual dielectric substrate using same
JPH02281688A (ja) * 1989-04-21 1990-11-19 Matsushita Electric Works Ltd 多層配線板
JP3033972B2 (ja) * 1989-06-15 2000-04-17 日本特殊陶業株式会社 アルミナ多層配線基板及びその製造方法
US5010641A (en) * 1989-06-30 1991-04-30 Unisys Corp. Method of making multilayer printed circuit board
JPH03187503A (ja) * 1989-12-15 1991-08-15 Matsushita Electric Works Ltd 多層基板
US5055966A (en) * 1990-12-17 1991-10-08 Hughes Aircraft Company Via capacitors within multi-layer, 3 dimensional structures/substrates
US5144526A (en) * 1991-08-05 1992-09-01 Hughes Aircraft Company Low temperature co-fired ceramic structure containing buried capacitors
US5185690A (en) * 1991-10-16 1993-02-09 Miller Mark L High dielectric constant sheet material

Also Published As

Publication number Publication date
EP0613608A1 (en) 1994-09-07
DE69309652T2 (de) 1997-10-30
ES2101345T3 (es) 1997-07-01
JPH07501909A (ja) 1995-02-23
DE69309652D1 (de) 1997-05-15
CA2125994A1 (en) 1994-03-31
MX9305884A (es) 1994-05-31
WO1994007347A1 (en) 1994-03-31
EP0613608B1 (en) 1997-04-09
DK0613608T3 (US20110009641A1-20110113-C00185.png) 1997-05-05
US5396397A (en) 1995-03-07
GR3023705T3 (en) 1997-09-30

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