CA2106872A1 - Module a circuit integre multipuce et sa methode de fabrication - Google Patents

Module a circuit integre multipuce et sa methode de fabrication

Info

Publication number
CA2106872A1
CA2106872A1 CA002106872A CA2106872A CA2106872A1 CA 2106872 A1 CA2106872 A1 CA 2106872A1 CA 002106872 A CA002106872 A CA 002106872A CA 2106872 A CA2106872 A CA 2106872A CA 2106872 A1 CA2106872 A1 CA 2106872A1
Authority
CA
Canada
Prior art keywords
integrated circuit
substrate
chips
encapsulant
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002106872A
Other languages
English (en)
Inventor
Charles W. Eichelberger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Integrated System Assemblies Corp
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2106872A1 publication Critical patent/CA2106872A1/fr
Abandoned legal-status Critical Current

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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30105—Capacitance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
CA002106872A 1991-03-27 1992-03-26 Module a circuit integre multipuce et sa methode de fabrication Abandoned CA2106872A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US67693791A 1991-03-27 1991-03-27
US676,937 1991-03-27

Publications (1)

Publication Number Publication Date
CA2106872A1 true CA2106872A1 (fr) 1992-09-28

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ID=24716632

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CA002106872A Abandoned CA2106872A1 (fr) 1991-03-27 1992-03-26 Module a circuit integre multipuce et sa methode de fabrication

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EP (1) EP0577779A4 (fr)
JP (1) JPH06502744A (fr)
AU (1) AU648417B2 (fr)
CA (1) CA2106872A1 (fr)
WO (1) WO1992017901A1 (fr)

Cited By (1)

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CN110036699A (zh) * 2016-12-07 2019-07-19 凸版印刷株式会社 芯基板、多层配线基板、半导体封装体、半导体组件、覆铜基板、及芯基板的制造方法

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EP0607656A1 (fr) * 1992-10-26 1994-07-27 Texas Instruments Incorporated Dispositif avec couche mince superficielle pour interconnecter des plots de contact d'un dispositif semiconducteur à un cadre conducteur ou un circuit flexible et procédé de fabrication associé
FR2704690B1 (fr) * 1993-04-27 1995-06-23 Thomson Csf Procédé d'encapsulation de pastilles semi-conductrices, dispositif obtenu par ce procédé et application à l'interconnexion de pastilles en trois dimensions.
US5527741A (en) * 1994-10-11 1996-06-18 Martin Marietta Corporation Fabrication and structures of circuit modules with flexible interconnect layers
JP4633868B2 (ja) * 1996-03-12 2011-02-16 エヌエックスピー ビー ヴィ 支持体に接着される基板を有する半導体本体
US6551857B2 (en) 1997-04-04 2003-04-22 Elm Technology Corporation Three dimensional structure integrated circuits
US6429528B1 (en) 1998-02-27 2002-08-06 Micron Technology, Inc. Multichip semiconductor package
FR2818804B1 (fr) * 2000-12-21 2003-10-03 Thomson Csf Procede de realisation d'un module multi-composants enterres et module obtenu par ce procede
US6870276B1 (en) 2001-12-26 2005-03-22 Micron Technology, Inc. Apparatus for supporting microelectronic substrates
AU2003253425C1 (en) * 2002-08-09 2006-06-15 Casio Computer Co., Ltd. Semiconductor device and method of manufacturing the same
DE10240460A1 (de) 2002-08-29 2004-03-11 Infineon Technologies Ag Universelles Halbleitergehäuse mit vorvernetzten Kunststoffeinbettmassen und Verfahren zur Herstellung desselben
DE10240461A1 (de) 2002-08-29 2004-03-11 Infineon Technologies Ag Universelles Gehäuse für ein elektronisches Bauteil mit Halbleiterchip und Verfahren zu seiner Herstellung
JP3918708B2 (ja) * 2002-10-08 2007-05-23 セイコーエプソン株式会社 回路基板及びその製造方法、転写チップ、転写元基板、電気光学装置、電子機器
JP4589170B2 (ja) * 2005-04-28 2010-12-01 新光電気工業株式会社 半導体装置及びその製造方法
RU2680868C1 (ru) * 2018-05-04 2019-02-28 Акционерное общество "Российская корпорация ракетно-космического приборостроения и информационных систем" (АО "Российские космические системы") Герметичный сборочный модуль для монтажа микрорадиоэлектронной аппаратуры, выполненный групповым методом с последующей резкой на модули

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US4860166A (en) * 1983-09-06 1989-08-22 Raytheon Company Integrated circuit termination device
GB2153144A (en) * 1984-01-13 1985-08-14 Standard Telephones Cables Ltd Circuit packaging
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JPS6281745A (ja) * 1985-10-05 1987-04-15 Fujitsu Ltd ウエハ−規模のｌｓｉ半導体装置とその製造方法
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JP2579937B2 (ja) * 1987-04-15 1997-02-12 株式会社東芝 電子回路装置およびその製造方法
JPS63276236A (ja) * 1987-05-08 1988-11-14 Nec Corp 電子部品素片の接続方法
JPS63293965A (ja) * 1987-05-27 1988-11-30 Hitachi Ltd 半導体装置およびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110036699A (zh) * 2016-12-07 2019-07-19 凸版印刷株式会社 芯基板、多层配线基板、半导体封装体、半导体组件、覆铜基板、及芯基板的制造方法

Also Published As

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EP0577779A1 (fr) 1994-01-12
WO1992017901A1 (fr) 1992-10-15
JPH06502744A (ja) 1994-03-24
AU648417B2 (en) 1994-04-21
EP0577779A4 (en) 1994-05-25
AU1874392A (en) 1992-11-02

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