CA2105078A1 - Process and arrangements for electroplating or the like of perforated workpieces - Google Patents
Process and arrangements for electroplating or the like of perforated workpiecesInfo
- Publication number
- CA2105078A1 CA2105078A1 CA002105078A CA2105078A CA2105078A1 CA 2105078 A1 CA2105078 A1 CA 2105078A1 CA 002105078 A CA002105078 A CA 002105078A CA 2105078 A CA2105078 A CA 2105078A CA 2105078 A1 CA2105078 A1 CA 2105078A1
- Authority
- CA
- Canada
- Prior art keywords
- anode
- electroplating
- workpiece
- current
- rectifier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000009713 electroplating Methods 0.000 title claims abstract 10
- 238000000034 method Methods 0.000 title claims abstract 8
- 230000000903 blocking effect Effects 0.000 claims description 3
- 230000000737 periodic effect Effects 0.000 claims description 2
- 150000002500 ions Chemical class 0.000 description 2
- 241000331231 Amorphocerini gen. n. 1 DAD-2008 Species 0.000 description 1
- 102100035683 Axin-2 Human genes 0.000 description 1
- 101700047552 Axin-2 Proteins 0.000 description 1
- UOACKFBJUYNSLK-XRKIENNPSA-N Estradiol Cypionate Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H](C4=CC=C(O)C=C4CC3)CC[C@@]21C)C(=O)CCC1CCCC1 UOACKFBJUYNSLK-XRKIENNPSA-N 0.000 description 1
- 244000228957 Ferula foetida Species 0.000 description 1
- 241001481828 Glyptocephalus cynoglossus Species 0.000 description 1
- 241001163743 Perlodes Species 0.000 description 1
- 208000003251 Pruritus Diseases 0.000 description 1
- 235000001537 Ribes X gardonianum Nutrition 0.000 description 1
- 235000001535 Ribes X utile Nutrition 0.000 description 1
- 235000016919 Ribes petraeum Nutrition 0.000 description 1
- 244000281247 Ribes rubrum Species 0.000 description 1
- 235000002355 Ribes spicatum Nutrition 0.000 description 1
- 241000534944 Thia Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- PBAYDYUZOSNJGU-UHFFFAOYSA-N chelidonic acid Natural products OC(=O)C1=CC(=O)C=C(C(O)=O)O1 PBAYDYUZOSNJGU-UHFFFAOYSA-N 0.000 description 1
- 230000002844 continuous effect Effects 0.000 description 1
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 1
- 229920000136 polysorbate Polymers 0.000 description 1
- HLFCZZKCHVSOAP-DAMYXMBDSA-M sodium;(5z)-5-(carbamoylhydrazinylidene)-1-methyl-6-oxo-2,3-dihydroindole-2-sulfonate Chemical compound [Na+].NC(=O)N/N=C/1C(=O)C=C2N(C)C(S([O-])(=O)=O)CC2=C\1 HLFCZZKCHVSOAP-DAMYXMBDSA-M 0.000 description 1
- 125000000446 sulfanediyl group Chemical group *S* 0.000 description 1
- MBYLVOKEDDQJDY-UHFFFAOYSA-N tris(2-aminoethyl)amine Chemical compound NCCN(CCN)CCN MBYLVOKEDDQJDY-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1518—Vertically held PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Medicines That Contain Protein Lipid Enzymes And Other Medicines (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DEP4106333.3 | 1991-02-28 | ||
| DE19914106333 DE4106333C1 (enExample) | 1991-02-28 | 1991-02-28 | |
| PCT/DE1992/000162 WO1992015726A1 (de) | 1991-02-28 | 1992-02-26 | Verfahren zum galvanisieren oder dergleichen von mit lochungen versehenen werkstücken, sowie anordnungen zur durchführung dieses verfahrens |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA2105078A1 true CA2105078A1 (en) | 1992-08-29 |
Family
ID=6426109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA002105078A Abandoned CA2105078A1 (en) | 1991-02-28 | 1992-02-26 | Process and arrangements for electroplating or the like of perforated workpieces |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0573511A1 (enExample) |
| CA (1) | CA2105078A1 (enExample) |
| DE (1) | DE4106333C1 (enExample) |
| WO (1) | WO1992015726A1 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4324330C2 (de) * | 1992-08-01 | 1994-11-17 | Atotech Deutschland Gmbh | Verfahren zum elektrolytischen Behandeln von insbesondere flachem Behandlungsgut, sowie Anordnung, insbesondere zur Durchführung dieses Verfahrens |
| DE19633796B4 (de) * | 1996-08-22 | 2012-02-02 | Hans Höllmüller Maschinenbau GmbH | Vorrichtung zum Galvanisieren von elektronischen Leiterplatten |
| DE10122276B4 (de) * | 2001-05-08 | 2008-05-21 | Multek Multilayer Technology Gmbh & Co Kg | Verfahren zum Beschichten von Lochwänden in Leiterplatten mit einem elektrisch leitenden Material |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1815925A1 (de) * | 1968-12-20 | 1970-06-25 | Telefunken Patent | Verfahren zum Verstaerken des Metallbelags auf einer Isolierstoffplatte |
| GB2181743A (en) * | 1985-07-16 | 1987-04-29 | Kay Kazuo | Metal plating of through holes in printed circuit boards |
| US4678545A (en) * | 1986-06-12 | 1987-07-07 | Galik George M | Printed circuit board fine line plating |
| DE3741459C1 (de) * | 1987-12-08 | 1989-04-13 | Blasberg Oberflaechentech | Verfahren zur Herstellung durchkontaktierter Leiterplatten |
| US4871435A (en) * | 1988-10-14 | 1989-10-03 | Charles Denofrio | Electroplating apparatus |
-
1991
- 1991-02-28 DE DE19914106333 patent/DE4106333C1/de not_active Expired - Lifetime
-
1992
- 1992-02-26 EP EP19920905629 patent/EP0573511A1/de not_active Ceased
- 1992-02-26 WO PCT/DE1992/000162 patent/WO1992015726A1/de not_active Ceased
- 1992-02-26 CA CA002105078A patent/CA2105078A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| DE4106333C1 (enExample) | 1992-07-16 |
| EP0573511A1 (de) | 1993-12-15 |
| WO1992015726A1 (de) | 1992-09-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FZDE | Discontinued |