CA2053751A1 - Water-soluble soldering paste - Google Patents
Water-soluble soldering pasteInfo
- Publication number
- CA2053751A1 CA2053751A1 CA2053751A CA2053751A CA2053751A1 CA 2053751 A1 CA2053751 A1 CA 2053751A1 CA 2053751 A CA2053751 A CA 2053751A CA 2053751 A CA2053751 A CA 2053751A CA 2053751 A1 CA2053751 A1 CA 2053751A1
- Authority
- CA
- Canada
- Prior art keywords
- water
- paste
- soldering paste
- soluble soldering
- flux base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 title abstract 2
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 abstract 3
- 230000004907 flux Effects 0.000 abstract 2
- 229910000679 solder Inorganic materials 0.000 abstract 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 2
- 229920002261 Corn starch Polymers 0.000 abstract 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 abstract 1
- 125000002843 carboxylic acid group Chemical group 0.000 abstract 1
- 239000008120 corn starch Substances 0.000 abstract 1
- 239000000839 emulsion Substances 0.000 abstract 1
- 239000002932 luster Substances 0.000 abstract 1
- 230000009972 noncorrosive effect Effects 0.000 abstract 1
- 231100000252 nontoxic Toxicity 0.000 abstract 1
- 230000003000 nontoxic effect Effects 0.000 abstract 1
- 150000007524 organic acids Chemical class 0.000 abstract 1
- 239000002562 thickening agent Substances 0.000 abstract 1
- 230000009974 thixotropic effect Effects 0.000 abstract 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A non-toxic, non-corrosive water-soluble soldering paste comprises at least about 80 wt% of particulate solder and the balance a thixotropic flux base having a viscosity of at least about 200,000 cp. The flux base comprises (a) a botanical oil, (b) an aqueous emulsion of a thickening agent, such as corn starch or an ethoxylated linear alcohol in water, and (c) an organic acid having at least two carboxylic acid groups, such as citric acid. The paste of the invention produces solder joints of high metallic luster and excellent quality. Clean-up of paste residues is accomplished using only water.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US60720090A | 1990-10-31 | 1990-10-31 | |
| US608,041 | 1990-10-31 | ||
| US607,200 | 1990-10-31 | ||
| US07/608,041 US5141568A (en) | 1990-05-15 | 1990-10-31 | Water-soluble soldering paste |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2053751A1 true CA2053751A1 (en) | 1992-05-01 |
| CA2053751C CA2053751C (en) | 1999-12-07 |
Family
ID=27085452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA 2053751 Expired - Fee Related CA2053751C (en) | 1990-10-31 | 1991-10-18 | Water-soluble soldering paste |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH0741434B2 (en) |
| CA (1) | CA2053751C (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101934437A (en) * | 2010-09-30 | 2011-01-05 | 常州市亚太微电子材料有限公司 | Unleaded solder paste and preparation method thereof |
| JP6592350B2 (en) * | 2014-12-26 | 2019-10-16 | 積水化学工業株式会社 | Anisotropic conductive material, connection structure, and manufacturing method of connection structure |
| JP7668512B2 (en) * | 2019-05-15 | 2025-04-25 | 株式会社弘輝 | Flux and solder paste |
-
1991
- 1991-10-18 CA CA 2053751 patent/CA2053751C/en not_active Expired - Fee Related
- 1991-10-31 JP JP28678391A patent/JPH0741434B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04262891A (en) | 1992-09-18 |
| JPH0741434B2 (en) | 1995-05-10 |
| CA2053751C (en) | 1999-12-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEER | Examination request | ||
| MKLA | Lapsed |