SU1718496A1 - Paste for soldering copper and its alloys - Google Patents

Paste for soldering copper and its alloys

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Publication number
SU1718496A1
SU1718496A1 SU4775005/08A SU4775005A SU1718496A1 SU 1718496 A1 SU1718496 A1 SU 1718496A1 SU 4775005/08 A SU4775005/08 A SU 4775005/08A SU 4775005 A SU4775005 A SU 4775005A SU 1718496 A1 SU1718496 A1 SU 1718496A1
Authority
SU
USSR - Soviet Union
Prior art keywords
solder
alloys
paste
soldering copper
tbl
Prior art date
Application number
SU4775005/08A
Other languages
Russian (ru)
Inventor
Е.И. Чулков
Ю.И. Пекин
Л.И. Байчер
В.Б. Челышев
И.М. Хурин
В.С. Рындин
Original Assignee
Научно-исследовательский институт авиационной технологии и организации производства
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Научно-исследовательский институт авиационной технологии и организации производства filed Critical Научно-исследовательский институт авиационной технологии и организации производства
Priority to SU4775005/08A priority Critical patent/SU1718496A1/en
Application granted granted Critical
Publication of SU1718496A1 publication Critical patent/SU1718496A1/en

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Abstract

FIELD: mechanical engineering; different branches of industry. SUBSTANCE: soldering paste contains the following components, mass %: copper phosphide solder 60-69; potassium permanganate 1-30; binder 0.5-1.5; the rest - solvent (butyl acetate). EFFECT: reduced labour input, improved quality of soldered joints owing to removing of oxide films from connected surfaces and solder. 3 tbl
SU4775005/08A 1989-12-28 1989-12-28 Paste for soldering copper and its alloys SU1718496A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SU4775005/08A SU1718496A1 (en) 1989-12-28 1989-12-28 Paste for soldering copper and its alloys

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SU4775005/08A SU1718496A1 (en) 1989-12-28 1989-12-28 Paste for soldering copper and its alloys

Publications (1)

Publication Number Publication Date
SU1718496A1 true SU1718496A1 (en) 1997-08-20

Family

ID=60532408

Family Applications (1)

Application Number Title Priority Date Filing Date
SU4775005/08A SU1718496A1 (en) 1989-12-28 1989-12-28 Paste for soldering copper and its alloys

Country Status (1)

Country Link
SU (1) SU1718496A1 (en)

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