Научно-исследовательский институт авиационной технологии и организации производства
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FIELD: mechanical engineering; different branches of industry. SUBSTANCE: soldering paste contains the following components, mass %: copper phosphide solder 60-69; potassium permanganate 1-30; binder 0.5-1.5; the rest - solvent (butyl acetate). EFFECT: reduced labour input, improved quality of soldered joints owing to removing of oxide films from connected surfaces and solder. 3 tbl
SU4775005/08A1989-12-281989-12-28Paste for soldering copper and its alloys
SU1718496A1
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