CA2031716A1 - Microtritement au laser, le dispositif correspondant - Google Patents

Microtritement au laser, le dispositif correspondant

Info

Publication number
CA2031716A1
CA2031716A1 CA2031716A CA2031716A CA2031716A1 CA 2031716 A1 CA2031716 A1 CA 2031716A1 CA 2031716 A CA2031716 A CA 2031716A CA 2031716 A CA2031716 A CA 2031716A CA 2031716 A1 CA2031716 A1 CA 2031716A1
Authority
CA
Canada
Prior art keywords
device therefor
processing
microprocessing
implosion
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CA2031716A
Other languages
English (en)
Other versions
CA2031716C (fr
Inventor
Hiroaki Misawa
Keiji Sasaki
Masanori Koshioka
Noboru Kitamura
Hiroshi Masuhara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Science and Technology Agency
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1318258A external-priority patent/JPH03180170A/ja
Priority claimed from JP2078421A external-priority patent/JP2765746B2/ja
Application filed by Individual filed Critical Individual
Publication of CA2031716A1 publication Critical patent/CA2031716A1/fr
Application granted granted Critical
Publication of CA2031716C publication Critical patent/CA2031716C/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece
    • B23K26/032Observing, e.g. monitoring, the workpiece using optical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J13/00Colloid chemistry, e.g. the production of colloidal materials or their solutions, not otherwise provided for; Making microcapsules or microballoons
    • B01J13/02Making microcapsules or microballoons
    • B01J13/20After-treatment of capsule walls, e.g. hardening
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J19/00Chemical, physical or physico-chemical processes in general; Their relevant apparatus
    • B01J19/08Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
    • B01J19/12Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor employing electromagnetic waves
    • B01J19/121Coherent waves, e.g. laser beams
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/60Preliminary treatment
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/631Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited using photolysis and investigating photolysed fragments

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Biochemistry (AREA)
  • Dispersion Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Immobilizing And Processing Of Enzymes And Microorganisms (AREA)
  • Drying Of Semiconductors (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
CA002031716A 1989-12-07 1990-12-06 Microtritement au laser, le dispositif correspondant Expired - Lifetime CA2031716C (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP318258/1989 1989-12-07
JP1318258A JPH03180170A (ja) 1989-12-07 1989-12-07 顕微マイクロ微粒子修飾・加工装置とその方法
JP318259/1989 1989-12-07
JP31825989 1989-12-07
JP78421/1990 1990-03-27
JP2078421A JP2765746B2 (ja) 1990-03-27 1990-03-27 微細修飾・加工方法

Publications (2)

Publication Number Publication Date
CA2031716A1 true CA2031716A1 (fr) 1991-06-08
CA2031716C CA2031716C (fr) 1996-06-18

Family

ID=27302709

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002031716A Expired - Lifetime CA2031716C (fr) 1989-12-07 1990-12-06 Microtritement au laser, le dispositif correspondant

Country Status (4)

Country Link
US (2) US5283417A (fr)
EP (1) EP0437043B1 (fr)
CA (1) CA2031716C (fr)
DE (1) DE69033509T2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113140953A (zh) * 2021-03-31 2021-07-20 深圳市欧凌镭射科技有限公司 一种激光信号的控制方法、装置、激光器及可读存储介质

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US6544825B1 (en) * 1992-12-26 2003-04-08 Semiconductor Energy Laboratory Co., Ltd. Method of fabricating a MIS transistor
DE4300698A1 (de) * 1993-01-13 1994-07-14 Raimund Schuetze Vorrichtung und Verfahren zur Handhabung, Bearbeitung und Beobachtung kleiner Teilchen, insbesondere biologischer Teilchen
US5469255A (en) * 1993-01-28 1995-11-21 Kamada; Kenji Method and apparatus for spectrometric measurement of particulate surfaces
JP3355021B2 (ja) * 1994-03-26 2002-12-09 科学技術振興事業団 マイクロメモリおよびマイクロセンサ
DE4415381A1 (de) * 1994-05-02 1995-11-09 Nis Ingenieurgesellschaft Mbh Lasergestütztes Verfahren zur Bestimmung von Edelmetallkonzentrationen in Metallen
WO1998014816A1 (fr) * 1996-10-02 1998-04-09 Cell Robotics Inc. Microscope a fenetre pour laser
US6046429A (en) * 1997-06-12 2000-04-04 International Business Machines Corporation Laser repair process for printed wiring boards
CA2322212C (fr) * 1998-03-04 2009-05-12 The Board Of Regents, The University Of Texas System Appareillage et procedes de deformation par laser de particules dielectriques
US6335201B1 (en) * 1998-03-06 2002-01-01 The Regents Of The University Of California Method and apparatus for detecting enzymatic activity using molecules that change electrophoretic mobility
US6156576A (en) * 1998-03-06 2000-12-05 The Regents Of The University Of California Fast controllable laser lysis of cells for analysis
US5972667A (en) * 1998-05-19 1999-10-26 Cell Robotics, Inc. Method and apparatus for activating a thermo-enzyme reaction with electromagnetic energy
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US6881687B1 (en) 1999-10-29 2005-04-19 Paul P. Castrucci Method for laser cleaning of a substrate surface using a solid sacrificial film
WO2002009483A1 (fr) * 2000-07-26 2002-01-31 The Regents Of The University Of California Manipulation de cellules vivantes et d'objets inorganiques au moyen de reseaux optiques de micro-faisceaux
US20020123112A1 (en) * 2000-11-13 2002-09-05 Genoptix Methods for increasing detection sensitivity in optical dielectric sorting systems
US6936811B2 (en) * 2000-11-13 2005-08-30 Genoptix, Inc. Method for separating micro-particles
US6784420B2 (en) * 2000-11-13 2004-08-31 Genoptix, Inc. Method of separating particles using an optical gradient
US6833542B2 (en) * 2000-11-13 2004-12-21 Genoptix, Inc. Method for sorting particles
US6744038B2 (en) 2000-11-13 2004-06-01 Genoptix, Inc. Methods of separating particles using an optical gradient
US20020160470A1 (en) * 2000-11-13 2002-10-31 Genoptix Methods and apparatus for generating and utilizing linear moving optical gradients
US20030007894A1 (en) * 2001-04-27 2003-01-09 Genoptix Methods and apparatus for use of optical forces for identification, characterization and/or sorting of particles
US6778724B2 (en) * 2000-11-28 2004-08-17 The Regents Of The University Of California Optical switching and sorting of biological samples and microparticles transported in a micro-fluidic device, including integrated bio-chip devices
US20030194755A1 (en) * 2001-04-27 2003-10-16 Genoptix, Inc. Early detection of apoptotic events and apoptosis using optophoretic analysis
US20040009540A1 (en) * 2001-04-27 2004-01-15 Genoptix, Inc Detection and evaluation of cancer cells using optophoretic analysis
US20030211461A1 (en) * 2002-05-01 2003-11-13 Genoptix, Inc Optophoretic detection of durgs exhibiting inhibitory effect on Bcr-Abl positive tumor cells
US20040033539A1 (en) * 2002-05-01 2004-02-19 Genoptix, Inc Method of using optical interrogation to determine a biological property of a cell or population of cells
US20050155956A1 (en) * 2002-08-30 2005-07-21 Sumitomo Heavy Industries, Ltd. Laser processing method and processing device
US20040053209A1 (en) * 2002-09-12 2004-03-18 Genoptix, Inc Detection and evaluation of topoisomerase inhibitors using optophoretic analysis
US20040067167A1 (en) * 2002-10-08 2004-04-08 Genoptix, Inc. Methods and apparatus for optophoretic diagnosis of cells and particles
US20040121474A1 (en) * 2002-12-19 2004-06-24 Genoptix, Inc Detection and evaluation of chemically-mediated and ligand-mediated t-cell activation using optophoretic analysis
US20040121307A1 (en) * 2002-12-19 2004-06-24 Genoptix, Inc Early detection of cellular differentiation using optophoresis
CA2536360C (fr) * 2003-08-28 2013-08-06 Celula, Inc. Procedes et appareil pour le tri de cellules mettant en oeuvre un commutateur optique dans un reseau de canaux microfluidiques
US7001672B2 (en) * 2003-12-03 2006-02-21 Medicine Lodge, Inc. Laser based metal deposition of implant structures
US7666522B2 (en) * 2003-12-03 2010-02-23 IMDS, Inc. Laser based metal deposition (LBMD) of implant structures
US20050212694A1 (en) * 2004-03-26 2005-09-29 Chun-Ta Chen Data distribution method and system
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US7951412B2 (en) 2006-06-07 2011-05-31 Medicinelodge Inc. Laser based metal deposition (LBMD) of antimicrobials to implant surfaces
DE102006034990A1 (de) * 2006-07-28 2008-01-31 P.A.L.M. Microlaser Technologies Gmbh Verfahren und Vorrichtung zum Bearbeiten von biologischen Objekten
US8537356B2 (en) * 2008-02-28 2013-09-17 Lehigh University Opto-fluidic nanoparticle detection apparatus
TWI549386B (zh) 2010-04-13 2016-09-11 康寧吉伯特公司 具有防止進入及改良接地之同軸連接器
US8888526B2 (en) 2010-08-10 2014-11-18 Corning Gilbert, Inc. Coaxial cable connector with radio frequency interference and grounding shield
US20130072057A1 (en) 2011-09-15 2013-03-21 Donald Andrew Burris Coaxial cable connector with integral radio frequency interference and grounding shield
US9287659B2 (en) 2012-10-16 2016-03-15 Corning Optical Communications Rf Llc Coaxial cable connector with integral RFI protection
US10290958B2 (en) 2013-04-29 2019-05-14 Corning Optical Communications Rf Llc Coaxial cable connector with integral RFI protection and biasing ring
CN105284015B (zh) 2013-05-20 2019-03-08 康宁光电通信Rf有限责任公司 具有整体rfi保护的同轴电缆连接器
US9548572B2 (en) 2014-11-03 2017-01-17 Corning Optical Communications LLC Coaxial cable connector having a coupler and a post with a contacting portion and a shoulder
US10033122B2 (en) 2015-02-20 2018-07-24 Corning Optical Communications Rf Llc Cable or conduit connector with jacket retention feature
US10211547B2 (en) 2015-09-03 2019-02-19 Corning Optical Communications Rf Llc Coaxial cable connector
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113140953A (zh) * 2021-03-31 2021-07-20 深圳市欧凌镭射科技有限公司 一种激光信号的控制方法、装置、激光器及可读存储介质

Also Published As

Publication number Publication date
US5393957A (en) 1995-02-28
EP0437043A3 (en) 1991-09-04
EP0437043A2 (fr) 1991-07-17
DE69033509T2 (de) 2000-12-14
CA2031716C (fr) 1996-06-18
US5283417A (en) 1994-02-01
EP0437043B1 (fr) 2000-04-19
DE69033509D1 (de) 2000-05-25

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Legal Events

Date Code Title Description
EEER Examination request
MKLA Lapsed
MKEC Expiry (correction)

Effective date: 20121202