CA1314197C - Process for removing contaminant - Google Patents
Process for removing contaminantInfo
- Publication number
- CA1314197C CA1314197C CA000530786A CA530786A CA1314197C CA 1314197 C CA1314197 C CA 1314197C CA 000530786 A CA000530786 A CA 000530786A CA 530786 A CA530786 A CA 530786A CA 1314197 C CA1314197 C CA 1314197C
- Authority
- CA
- Canada
- Prior art keywords
- holes
- vicinity
- contaminant
- edges
- fluorinated compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000356 contaminant Substances 0.000 title claims abstract description 45
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000005530 etching Methods 0.000 claims abstract description 37
- 150000001875 compounds Chemical class 0.000 claims description 30
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 24
- 239000001301 oxygen Substances 0.000 claims description 24
- 229910052760 oxygen Inorganic materials 0.000 claims description 24
- 239000004593 Epoxy Substances 0.000 claims description 15
- AFYPFACVUDMOHA-UHFFFAOYSA-N chlorotrifluoromethane Chemical compound FC(F)(F)Cl AFYPFACVUDMOHA-UHFFFAOYSA-N 0.000 claims description 4
- WMIYKQLTONQJES-UHFFFAOYSA-N hexafluoroethane Chemical compound FC(F)(F)C(F)(F)F WMIYKQLTONQJES-UHFFFAOYSA-N 0.000 claims description 4
- PXBRQCKWGAHEHS-UHFFFAOYSA-N dichlorodifluoromethane Chemical compound FC(F)(Cl)Cl PXBRQCKWGAHEHS-UHFFFAOYSA-N 0.000 claims description 3
- 235000019404 dichlorodifluoromethane Nutrition 0.000 claims description 3
- GVGCUCJTUSOZKP-UHFFFAOYSA-N nitrogen trifluoride Chemical compound FN(F)F GVGCUCJTUSOZKP-UHFFFAOYSA-N 0.000 claims 2
- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical compound FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 claims 2
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 claims 2
- CYRMSUTZVYGINF-UHFFFAOYSA-N trichlorofluoromethane Chemical compound FC(Cl)(Cl)Cl CYRMSUTZVYGINF-UHFFFAOYSA-N 0.000 claims 2
- 239000000758 substrate Substances 0.000 description 24
- 239000007789 gas Substances 0.000 description 15
- 239000000463 material Substances 0.000 description 12
- 239000000203 mixture Substances 0.000 description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 6
- 238000007747 plating Methods 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- -1 polypropylene Polymers 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 229920002492 poly(sulfone) Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000012783 reinforcing fiber Substances 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 101100108547 Arabidopsis thaliana ALC gene Proteins 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- WNLRTRBMVRJNCN-UHFFFAOYSA-L adipate(2-) Chemical compound [O-]C(=O)CCCCC([O-])=O WNLRTRBMVRJNCN-UHFFFAOYSA-L 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012799 electrically-conductive coating Substances 0.000 description 1
- 238000006735 epoxidation reaction Methods 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010952 in-situ formation Methods 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000010849 ion bombardment Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000011968 lewis acid catalyst Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- IGALFTFNPPBUDN-UHFFFAOYSA-N phenyl-[2,3,4,5-tetrakis(oxiran-2-ylmethyl)phenyl]methanediamine Chemical compound C=1C(CC2OC2)=C(CC2OC2)C(CC2OC2)=C(CC2OC2)C=1C(N)(N)C1=CC=CC=C1 IGALFTFNPPBUDN-UHFFFAOYSA-N 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 239000012260 resinous material Substances 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Drying Of Semiconductors (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US849,247 | 1986-04-08 | ||
| US06/849,247 US4654115A (en) | 1986-04-08 | 1986-04-08 | Process for removing contaminant |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1314197C true CA1314197C (en) | 1993-03-09 |
Family
ID=25305397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000530786A Expired - Fee Related CA1314197C (en) | 1986-04-08 | 1987-02-27 | Process for removing contaminant |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US4654115A (https=) |
| EP (1) | EP0241718B1 (https=) |
| JP (1) | JPS62239593A (https=) |
| CA (1) | CA1314197C (https=) |
| DE (1) | DE3779169D1 (https=) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4797178A (en) * | 1987-05-13 | 1989-01-10 | International Business Machines Corporation | Plasma etch enhancement with large mass inert gas |
| US4810326A (en) * | 1987-08-31 | 1989-03-07 | International Business Machines Corporation | Interlaminate adhesion between polymeric materials and electrolytic copper surfaces |
| US4787957A (en) * | 1987-09-25 | 1988-11-29 | Air Products And Chemicals, Inc. | Desmear and etchback using NF3 /O2 gas mixtures |
| US4853081A (en) * | 1987-10-30 | 1989-08-01 | Ibm Corporation | Process for removing contaminant |
| US4913789A (en) * | 1988-04-18 | 1990-04-03 | Aung David K | Sputter etching and coating process |
| JPH02234492A (ja) * | 1989-03-07 | 1990-09-17 | Fujitsu Ltd | プリント基板の製造方法 |
| US5487810A (en) * | 1992-03-26 | 1996-01-30 | Bayer Ag | Process for pretreating surfaces of plastic items |
| DE4410613C1 (de) * | 1994-03-26 | 1995-03-30 | Urenco Deutschland Gmbh | Vorrichtung zum Abtragen von Schichten einer Oberfläche mittels Laserstrahlung |
| IL119246A (en) * | 1996-09-12 | 2000-10-31 | Oramir Semiconductor Ltd | Laser removal of foreign materials from surfaces |
| US5783482A (en) * | 1997-09-12 | 1998-07-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method to prevent oxide peeling induced by sog etchback on the wafer edge |
| US6303509B1 (en) | 1999-10-29 | 2001-10-16 | Taiwan Semiconductor Manufacturing Company | Method to calibrate the wafer transfer for oxide etcher (with clamp) |
| US7194803B2 (en) * | 2001-07-05 | 2007-03-27 | Flowserve Management Company | Seal ring and method of forming micro-topography ring surfaces with a laser |
| JP4409134B2 (ja) * | 2001-10-09 | 2010-02-03 | パナソニック株式会社 | 実装システム |
| US7367114B2 (en) * | 2002-08-26 | 2008-05-06 | Littelfuse, Inc. | Method for plasma etching to manufacture electrical devices having circuit protection |
| US7618895B2 (en) * | 2004-12-06 | 2009-11-17 | Asahi Glass Company, Limited | Method for etching doughnut-type glass substrates |
| CN116321740B (zh) * | 2023-03-16 | 2024-05-31 | 福莱盈电子股份有限公司 | 一种双面铜产品通孔的加工方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4328081A (en) * | 1980-02-25 | 1982-05-04 | Micro-Plate, Inc. | Plasma desmearing apparatus and method |
| US4351697A (en) * | 1982-01-04 | 1982-09-28 | Western Electric Company, Inc. | Printed wiring boards |
| US4582564A (en) * | 1982-01-04 | 1986-04-15 | At&T Technologies, Inc. | Method of providing an adherent metal coating on an epoxy surface |
| US4496420A (en) * | 1984-04-06 | 1985-01-29 | Bmc Industries, Inc. | Process for plasma desmear etching of printed circuit boards and apparatus used therein |
| US4599134A (en) * | 1985-06-10 | 1986-07-08 | Ibm Corporation | Plasma etching with tracer |
-
1986
- 1986-04-08 US US06/849,247 patent/US4654115A/en not_active Expired - Fee Related
-
1987
- 1987-02-20 JP JP62035952A patent/JPS62239593A/ja active Granted
- 1987-02-27 CA CA000530786A patent/CA1314197C/en not_active Expired - Fee Related
- 1987-03-13 DE DE8787103635T patent/DE3779169D1/de not_active Expired - Lifetime
- 1987-03-13 EP EP87103635A patent/EP0241718B1/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| DE3779169D1 (de) | 1992-06-25 |
| JPS62239593A (ja) | 1987-10-20 |
| JPH0415635B2 (https=) | 1992-03-18 |
| EP0241718B1 (en) | 1992-05-20 |
| US4654115A (en) | 1987-03-31 |
| EP0241718A2 (en) | 1987-10-21 |
| EP0241718A3 (en) | 1989-10-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA1314197C (en) | Process for removing contaminant | |
| US5685070A (en) | Method of making printed circuit board | |
| EP0893474B1 (en) | Epoxy resin composition and a process for manufacturing a multilayer printed-wiring board using it | |
| US4810326A (en) | Interlaminate adhesion between polymeric materials and electrolytic copper surfaces | |
| KR19980042705A (ko) | 라미네이트용 프리프레그 및 이를 사용하여 프린트된 배선판을제조하는 방법 | |
| CA2419805A1 (en) | Manufacturing fire retardant circuit boards without the use of fire retardant resin additives | |
| EP0313855A2 (en) | Process for removing contaminant | |
| CA1336273C (en) | Desmear and etchback of printed circuit boards using an nf_/o_ plasma gas mixture | |
| GB2120600A (en) | Metal-clad laminate | |
| KR102459414B1 (ko) | 인쇄회로기판 및 이의 제조방법 | |
| JP3326448B2 (ja) | 接着剤層を有する銅箔 | |
| US5221418A (en) | Method for improving the surface insulation resistance of printed circuits | |
| JPH06244528A (ja) | プリント配線基板の製造方法 | |
| JPH0732544A (ja) | 紙基材銅張積層板およびその製造方法 | |
| JPS60214594A (ja) | 印刷配線板の製造方法 | |
| JP3415186B2 (ja) | プリント配線基板の製造方法 | |
| TWI728774B (zh) | 電路板結構的製造方法 | |
| JPH09232756A (ja) | 多層プリント配線板の製造方法 | |
| US7022464B2 (en) | Integral plated resistor and method for the manufacture of printed circuit boards comprising the same | |
| JP3410137B2 (ja) | プリント配線基板の製造方法 | |
| JP3227874B2 (ja) | 積層板の製造方法 | |
| JP2002088626A (ja) | 積層板用ガラス繊維不織布及びコンポジット積層板 | |
| JPS61234589A (ja) | 微細回路基板の製造方法 | |
| JPS58181638A (ja) | 金属張板及びその製造方法 | |
| JPH0784513B2 (ja) | 硬化プリプレグ及び硬化プリプレグ用エポキシ樹脂組成物 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKLA | Lapsed |