DE3779169D1 - Verfahren zum entfernen von verunreinigenden stoffen aus bohrungen. - Google Patents

Verfahren zum entfernen von verunreinigenden stoffen aus bohrungen.

Info

Publication number
DE3779169D1
DE3779169D1 DE8787103635T DE3779169T DE3779169D1 DE 3779169 D1 DE3779169 D1 DE 3779169D1 DE 8787103635 T DE8787103635 T DE 8787103635T DE 3779169 T DE3779169 T DE 3779169T DE 3779169 D1 DE3779169 D1 DE 3779169D1
Authority
DE
Germany
Prior art keywords
pollutantous
substances
holes
removing pollutantous
pollutantous substances
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE8787103635T
Other languages
German (de)
English (en)
Inventor
Frank Daniel Egitto
Francis Emmi
Walter Eugene Mlynko
Robin Anne Susko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3779169D1 publication Critical patent/DE3779169D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Drying Of Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
DE8787103635T 1986-04-08 1987-03-13 Verfahren zum entfernen von verunreinigenden stoffen aus bohrungen. Expired - Lifetime DE3779169D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/849,247 US4654115A (en) 1986-04-08 1986-04-08 Process for removing contaminant

Publications (1)

Publication Number Publication Date
DE3779169D1 true DE3779169D1 (de) 1992-06-25

Family

ID=25305397

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787103635T Expired - Lifetime DE3779169D1 (de) 1986-04-08 1987-03-13 Verfahren zum entfernen von verunreinigenden stoffen aus bohrungen.

Country Status (5)

Country Link
US (1) US4654115A (https=)
EP (1) EP0241718B1 (https=)
JP (1) JPS62239593A (https=)
CA (1) CA1314197C (https=)
DE (1) DE3779169D1 (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4797178A (en) * 1987-05-13 1989-01-10 International Business Machines Corporation Plasma etch enhancement with large mass inert gas
US4810326A (en) * 1987-08-31 1989-03-07 International Business Machines Corporation Interlaminate adhesion between polymeric materials and electrolytic copper surfaces
US4787957A (en) * 1987-09-25 1988-11-29 Air Products And Chemicals, Inc. Desmear and etchback using NF3 /O2 gas mixtures
US4853081A (en) * 1987-10-30 1989-08-01 Ibm Corporation Process for removing contaminant
US4913789A (en) * 1988-04-18 1990-04-03 Aung David K Sputter etching and coating process
JPH02234492A (ja) * 1989-03-07 1990-09-17 Fujitsu Ltd プリント基板の製造方法
US5487810A (en) * 1992-03-26 1996-01-30 Bayer Ag Process for pretreating surfaces of plastic items
DE4410613C1 (de) * 1994-03-26 1995-03-30 Urenco Deutschland Gmbh Vorrichtung zum Abtragen von Schichten einer Oberfläche mittels Laserstrahlung
IL119246A (en) * 1996-09-12 2000-10-31 Oramir Semiconductor Ltd Laser removal of foreign materials from surfaces
US5783482A (en) * 1997-09-12 1998-07-21 Taiwan Semiconductor Manufacturing Company, Ltd. Method to prevent oxide peeling induced by sog etchback on the wafer edge
US6303509B1 (en) 1999-10-29 2001-10-16 Taiwan Semiconductor Manufacturing Company Method to calibrate the wafer transfer for oxide etcher (with clamp)
US7194803B2 (en) * 2001-07-05 2007-03-27 Flowserve Management Company Seal ring and method of forming micro-topography ring surfaces with a laser
JP4409134B2 (ja) * 2001-10-09 2010-02-03 パナソニック株式会社 実装システム
US7367114B2 (en) * 2002-08-26 2008-05-06 Littelfuse, Inc. Method for plasma etching to manufacture electrical devices having circuit protection
US7618895B2 (en) * 2004-12-06 2009-11-17 Asahi Glass Company, Limited Method for etching doughnut-type glass substrates
CN116321740B (zh) * 2023-03-16 2024-05-31 福莱盈电子股份有限公司 一种双面铜产品通孔的加工方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4328081A (en) * 1980-02-25 1982-05-04 Micro-Plate, Inc. Plasma desmearing apparatus and method
US4351697A (en) * 1982-01-04 1982-09-28 Western Electric Company, Inc. Printed wiring boards
US4582564A (en) * 1982-01-04 1986-04-15 At&T Technologies, Inc. Method of providing an adherent metal coating on an epoxy surface
US4496420A (en) * 1984-04-06 1985-01-29 Bmc Industries, Inc. Process for plasma desmear etching of printed circuit boards and apparatus used therein
US4599134A (en) * 1985-06-10 1986-07-08 Ibm Corporation Plasma etching with tracer

Also Published As

Publication number Publication date
JPS62239593A (ja) 1987-10-20
JPH0415635B2 (https=) 1992-03-18
EP0241718B1 (en) 1992-05-20
US4654115A (en) 1987-03-31
EP0241718A2 (en) 1987-10-21
EP0241718A3 (en) 1989-10-18
CA1314197C (en) 1993-03-09

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Legal Events

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8330 Complete disclaimer