CA1217684A - Swell-soldering apparatus - Google Patents
Swell-soldering apparatusInfo
- Publication number
- CA1217684A CA1217684A CA000438075A CA438075A CA1217684A CA 1217684 A CA1217684 A CA 1217684A CA 000438075 A CA000438075 A CA 000438075A CA 438075 A CA438075 A CA 438075A CA 1217684 A CA1217684 A CA 1217684A
- Authority
- CA
- Canada
- Prior art keywords
- soldering
- pressure chamber
- pressure
- chamber
- swell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 69
- 238000007789 sealing Methods 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 4
- 208000036366 Sensation of pressure Diseases 0.000 claims 2
- 239000002184 metal Substances 0.000 abstract description 13
- 229910052751 metal Inorganic materials 0.000 abstract description 13
- 238000000034 method Methods 0.000 abstract 1
- 238000005192 partition Methods 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 3
- 208000018459 dissociative disease Diseases 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 101710200331 Cytochrome b-245 chaperone 1 Proteins 0.000 description 1
- 102100037186 Cytochrome b-245 chaperone 1 Human genes 0.000 description 1
- 101710119396 Cytochrome b-245 chaperone 1 homolog Proteins 0.000 description 1
- 241001505295 Eros Species 0.000 description 1
- ULGZDMOVFRHVEP-RWJQBGPGSA-N Erythromycin Chemical compound O([C@@H]1[C@@H](C)C(=O)O[C@@H]([C@@]([C@H](O)[C@@H](C)C(=O)[C@H](C)C[C@@](C)(O)[C@H](O[C@H]2[C@@H]([C@H](C[C@@H](C)O2)N(C)C)O)[C@H]1C)(C)O)CC)[C@H]1C[C@@](C)(OC)[C@@H](O)[C@H](C)O1 ULGZDMOVFRHVEP-RWJQBGPGSA-N 0.000 description 1
- 241000282320 Panthera leo Species 0.000 description 1
- 206010038743 Restlessness Diseases 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/018—Unsoldering; Removal of melted solder or other residues
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Molten Solder (AREA)
- Coating With Molten Metal (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3236493A DE3236493C1 (de) | 1982-09-30 | 1982-09-30 | Schwalloetgeraet |
| DEP3236493.8 | 1982-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1217684A true CA1217684A (en) | 1987-02-10 |
Family
ID=6174739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA000438075A Expired CA1217684A (en) | 1982-09-30 | 1983-09-30 | Swell-soldering apparatus |
Country Status (8)
| Country | Link |
|---|---|
| EP (1) | EP0105832B1 (cg-RX-API-DMAC7.html) |
| JP (1) | JPS59147772A (cg-RX-API-DMAC7.html) |
| KR (1) | KR840006434A (cg-RX-API-DMAC7.html) |
| AT (1) | ATE16687T1 (cg-RX-API-DMAC7.html) |
| AU (1) | AU560540B2 (cg-RX-API-DMAC7.html) |
| CA (1) | CA1217684A (cg-RX-API-DMAC7.html) |
| DE (2) | DE3236493C1 (cg-RX-API-DMAC7.html) |
| IL (1) | IL69899A (cg-RX-API-DMAC7.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63224865A (ja) * | 1986-12-11 | 1988-09-19 | ペイス インコーポレイテッド | 半田付けおよび／または半田外し装置 |
| JP7786140B2 (ja) * | 2021-11-15 | 2025-12-16 | 富士フイルムビジネスイノベーション株式会社 | ノズル、はんだ付け装置及び基板装置の製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3198414A (en) * | 1963-07-30 | 1965-08-03 | Electrovert Mfg Co Ltd | Molten solder bath with uniformly dispersed additive |
-
1982
- 1982-09-30 DE DE3236493A patent/DE3236493C1/de not_active Expired
-
1983
- 1983-09-27 EP EP83730090A patent/EP0105832B1/de not_active Expired
- 1983-09-27 AT AT83730090T patent/ATE16687T1/de active
- 1983-09-27 DE DE8383730090T patent/DE3361354D1/de not_active Expired
- 1983-09-28 AU AU19681/83A patent/AU560540B2/en not_active Ceased
- 1983-09-30 CA CA000438075A patent/CA1217684A/en not_active Expired
- 1983-09-30 KR KR1019830004710A patent/KR840006434A/ko not_active Ceased
- 1983-09-30 JP JP58180928A patent/JPS59147772A/ja active Granted
- 1983-10-04 IL IL69899A patent/IL69899A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| IL69899A (en) | 1985-12-31 |
| EP0105832A1 (de) | 1984-04-18 |
| DE3236493C1 (de) | 1983-11-03 |
| AU560540B2 (en) | 1987-04-09 |
| EP0105832B1 (de) | 1985-11-27 |
| DE3361354D1 (en) | 1986-01-09 |
| ATE16687T1 (de) | 1985-12-15 |
| JPS59147772A (ja) | 1984-08-24 |
| JPS6343196B2 (cg-RX-API-DMAC7.html) | 1988-08-29 |
| AU1968183A (en) | 1984-04-05 |
| KR840006434A (ko) | 1984-11-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8328069B2 (en) | Device and method for selective soldering | |
| US4921156A (en) | Soldering apparatus | |
| US6655574B2 (en) | Apparatus for selective soldering | |
| US6145733A (en) | Process for soldering electronic components to a printed circuit board | |
| ZA981020B (en) | Liquid purification apparatus | |
| CA1217684A (en) | Swell-soldering apparatus | |
| US20100243718A1 (en) | Selective soldering apparatus with jet wave solder jet and nitrogen preheat | |
| CN102582230A (zh) | 自动加锡机 | |
| CA1227111A (en) | Process and apparatus for etching printed circuit boards | |
| EP1047520B1 (en) | Apparatus and method for inerting a wave soldering installation | |
| GB2371006B (en) | Nozzle for soldering apparatus | |
| JPH0145752B2 (cg-RX-API-DMAC7.html) | ||
| CN108325920B (zh) | 一种直立pcb板自动清洗装置 | |
| CN115156173A (zh) | 一种自动浸泡设备 | |
| ES2189113T3 (es) | Reactor metalurgico de tratamiento bajo fusion reducida de un metal liquido. | |
| CN217911867U (zh) | 一种自动浸泡设备 | |
| SU1530362A1 (ru) | Устройство дл лужени обливом радиаторных трубок | |
| JPH1116868A5 (cg-RX-API-DMAC7.html) | ||
| DE4243384C2 (de) | Vorrichtung zum Auslöten von elektrischen Bauelementen | |
| JP2573366B2 (ja) | ポイント半田付け装置 | |
| KR910000993Y1 (ko) | 전기 기판 납땜용 후락스 도포장치 | |
| EP1381487A1 (en) | Appliance for improved inertizing during wave soldering | |
| KR20090028932A (ko) | 납 재생장치 | |
| JPH0145754B2 (cg-RX-API-DMAC7.html) | ||
| KR19980068859A (ko) | 전기소자 함침장치 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |