CA1189016A - Methode d'electrodeposition du palladium et de ses alliages - Google Patents

Methode d'electrodeposition du palladium et de ses alliages

Info

Publication number
CA1189016A
CA1189016A CA000397244A CA397244A CA1189016A CA 1189016 A CA1189016 A CA 1189016A CA 000397244 A CA000397244 A CA 000397244A CA 397244 A CA397244 A CA 397244A CA 1189016 A CA1189016 A CA 1189016A
Authority
CA
Canada
Prior art keywords
palladium
diaminopropane
electroplating
plating
aliphatic polyamine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000397244A
Other languages
English (en)
Inventor
Harvey S. Trop
Joseph A. Abys
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Application granted granted Critical
Publication of CA1189016A publication Critical patent/CA1189016A/fr
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C25D3/52—Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
CA000397244A 1981-02-27 1982-02-26 Methode d'electrodeposition du palladium et de ses alliages Expired CA1189016A (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US23915181A 1981-02-27 1981-02-27
US239,151 1994-05-05

Publications (1)

Publication Number Publication Date
CA1189016A true CA1189016A (fr) 1985-06-18

Family

ID=22900832

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000397244A Expired CA1189016A (fr) 1981-02-27 1982-02-26 Methode d'electrodeposition du palladium et de ses alliages

Country Status (7)

Country Link
EP (2) EP0073236B1 (fr)
JP (1) JPS58500289A (fr)
CA (1) CA1189016A (fr)
DE (1) DE3266736D1 (fr)
GB (1) GB2112018B (fr)
HK (1) HK48088A (fr)
WO (1) WO1982002908A1 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4478692A (en) * 1982-12-22 1984-10-23 Learonal, Inc. Electrodeposition of palladium-silver alloys
US4741818A (en) * 1985-12-12 1988-05-03 Learonal, Inc. Alkaline baths and methods for electrodeposition of palladium and palladium alloys
DE4444232C1 (de) * 1994-07-21 1996-05-09 Heraeus Gmbh W C Bad zum galvanischen Abscheiden von Palladium-Silber-Legierungen
EP0693579B1 (fr) * 1994-07-21 1997-08-27 W.C. Heraeus GmbH Bain pour le dépÔt électrolytique d'alliages Palladium-Argent
DE4431847C5 (de) * 1994-09-07 2011-01-27 Atotech Deutschland Gmbh Substrat mit bondfähiger Beschichtung
FR2807450B1 (fr) * 2000-04-06 2002-07-05 Engelhard Clal Sas Bain electrolytique destine au depot electrochimique du palladium ou de ses alliages
TWI354716B (en) * 2007-04-13 2011-12-21 Green Hydrotec Inc Palladium-containing plating solution and its uses
US8900436B2 (en) * 2008-05-07 2014-12-02 Umicore Galvanotechnik Gmbh Pd and Pd-Ni electrolyte baths
JP2012241260A (ja) * 2011-05-23 2012-12-10 Kanto Gakuin 電解パラジウム−リン合金めっき液、めっき被膜及びめっき製品
DE102018126174B3 (de) * 2018-10-22 2019-08-29 Umicore Galvanotechnik Gmbh Thermisch stabile Silberlegierungsschichten, Verfahren zur Abscheidung und Verwendung

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2452308A (en) * 1946-02-28 1948-10-26 George C Lambros Process of plating palladium and plating bath therefor
CH534215A (fr) * 1971-09-06 1973-02-28 Oxy Metal Finishing Europ S A Bain électrolytique pour l'électrodéposition d'alliages d'or et une utilisation de celui-ci
DE2360834C3 (de) * 1973-12-06 1978-05-18 Inovan-Stroebe Kg, 7534 Birkenfeld Bad und Verfahren zum galvanischen Abscheiden von Palladiumschichten
DE2506467C2 (de) * 1975-02-07 1986-07-17 Schering AG, 1000 Berlin und 4709 Bergkamen Bad und Verfahren zur galvanischen Abscheidung von Palladium-Nickel-Legierungen
US4066517A (en) * 1976-03-11 1978-01-03 Oxy Metal Industries Corporation Electrodeposition of palladium
DE2939920C2 (de) * 1979-10-02 1982-09-23 W.C. Heraeus Gmbh, 6450 Hanau Verwendung eines Amins in einem Bad zum galvanischen Abscheiden von Palladium
US4278514A (en) * 1980-02-12 1981-07-14 Technic, Inc. Bright palladium electrodeposition solution

Also Published As

Publication number Publication date
HK48088A (en) 1988-07-08
DE3266736D1 (en) 1985-11-14
GB2112018B (en) 1984-08-15
WO1982002908A1 (fr) 1982-09-02
EP0073236A4 (fr) 1983-01-14
GB2112018A (en) 1983-07-13
EP0059452B1 (fr) 1985-10-09
JPH0219197B2 (fr) 1990-04-27
JPS58500289A (ja) 1983-02-24
EP0073236B1 (fr) 1985-10-09
EP0059452A2 (fr) 1982-09-08
EP0059452A3 (en) 1982-11-10
EP0073236A1 (fr) 1983-03-09

Similar Documents

Publication Publication Date Title
US4911798A (en) Palladium alloy plating process
US4486274A (en) Palladium plating prodedure
US4427502A (en) Platinum and platinum alloy electroplating baths and processes
US4478691A (en) Silver plating procedure
EP0358375B1 (fr) Bain de dépÔt de platine ou d'un alliage de platine
US4673472A (en) Method and electroplating solution for deposition of palladium or alloys thereof
US4789437A (en) Pulse electroplating process
US4715935A (en) Palladium and palladium alloy plating
CA1189016A (fr) Methode d'electrodeposition du palladium et de ses alliages
EP0415631B1 (fr) Dépôt électrolytique d'un film de palladium
US6743346B2 (en) Electrolytic solution for electrochemical deposit of palladium or its alloys
US20040195107A1 (en) Electrolytic solution for electrochemical deposition gold and its alloys
US3637474A (en) Electrodeposition of palladium
US3544435A (en) Electrodeposition of palladium
US4478692A (en) Electrodeposition of palladium-silver alloys
US4297177A (en) Method and composition for electrodepositing palladium/nickel alloys
US4377450A (en) Palladium electroplating procedure
GB2089374A (en) Electrodeposition of palladium and palladium alloys
US4468296A (en) Process for electroplating palladium
EP0225422A1 (fr) Bains alcalins et procédés pour le dépôt électrolytique de palladium et alliages de palladium
US4465563A (en) Electrodeposition of palladium-silver alloys
US4454010A (en) Palladium plating procedure
US4297179A (en) Palladium electroplating bath and process
EP0198355A1 (fr) Bain de dépôt électrolytique et son application
US4778574A (en) Amine-containing bath for electroplating palladium

Legal Events

Date Code Title Description
MKEX Expiry