CA1149275A - Continuous process for preparing reinforced resin laminates - Google Patents

Continuous process for preparing reinforced resin laminates

Info

Publication number
CA1149275A
CA1149275A CA000348430A CA348430A CA1149275A CA 1149275 A CA1149275 A CA 1149275A CA 000348430 A CA000348430 A CA 000348430A CA 348430 A CA348430 A CA 348430A CA 1149275 A CA1149275 A CA 1149275A
Authority
CA
Canada
Prior art keywords
process according
resin
substrate
sheets
impregnated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA000348430A
Other languages
English (en)
French (fr)
Inventor
Masana Gotou
Minoru Isshiki
Shoji Uozumi
Masayuki Ohizumi
Yasuo Fushiki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanegafuchi Chemical Industry Co Ltd
Original Assignee
Kanegafuchi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanegafuchi Chemical Industry Co Ltd filed Critical Kanegafuchi Chemical Industry Co Ltd
Application granted granted Critical
Publication of CA1149275A publication Critical patent/CA1149275A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/08—Impregnating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Reinforced Plastic Materials (AREA)
CA000348430A 1979-03-26 1980-03-26 Continuous process for preparing reinforced resin laminates Expired CA1149275A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP3580579A JPS55126418A (en) 1979-03-26 1979-03-26 Method and apparatus for continuous preparation of laminated material
JP35805/1979 1979-03-26

Publications (1)

Publication Number Publication Date
CA1149275A true CA1149275A (en) 1983-07-05

Family

ID=12452130

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000348430A Expired CA1149275A (en) 1979-03-26 1980-03-26 Continuous process for preparing reinforced resin laminates

Country Status (3)

Country Link
US (1) US4662973A (enExample)
JP (1) JPS55126418A (enExample)
CA (1) CA1149275A (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5698136A (en) * 1980-01-08 1981-08-07 Kanegafuchi Chem Ind Co Ltd Continuous manufacture of laminated substance
JPS6030049Y2 (ja) * 1980-12-29 1985-09-10 鐘淵化学工業株式会社 積層板の連続製造装置
JPS6040256A (ja) * 1983-08-13 1985-03-02 松下電工株式会社 基材への樹脂の含浸方法
JPS6061261A (ja) * 1983-09-14 1985-04-09 松下電工株式会社 積層板の製法
JPS62178325A (ja) * 1986-01-31 1987-08-05 Toshiba Chem Corp 積層板の製造方法
US4659425A (en) * 1986-02-03 1987-04-21 Ibm Corporation Continuous process for the manufacture of printed circuit boards
US4803022A (en) * 1987-05-06 1989-02-07 Glasteel Industrial Laminates, Inc. Method of continuously bonding and curing a zinc-coated metal-clad polyester-epoxy-glass fiber laminate
US4916260A (en) * 1988-10-11 1990-04-10 International Business Machines Corporation Circuit member for use in multilayered printed circuit board assembly and method of making same
DE3838271A1 (de) * 1988-11-11 1990-05-17 Krupp Maschinentechnik Verfahren zur herstellung von mattenstreifen aus breiteren klebrigen, mit deckfolien belegten werkstoffbahnen und vorrichtung zur durchfuehrung des verfahrens
JPH02161740A (ja) * 1988-12-15 1990-06-21 Chisso Corp キャリヤーテープの製造方法
JPH0397550A (ja) * 1989-09-12 1991-04-23 Matsushita Electric Works Ltd 積層板の製造方法
JPH06166029A (ja) * 1992-11-30 1994-06-14 Tonen Corp プリプレグの製造方法
US5571608A (en) * 1994-07-15 1996-11-05 Dell Usa, L.P. Apparatus and method of making laminate an embedded conductive layer
US5718789A (en) * 1995-06-07 1998-02-17 The Dexter Corporation Method for making a debossed conductive film composite
US5655291A (en) * 1995-06-26 1997-08-12 Ford Motor Company Forming rigid circuit board
TW389780B (en) * 1995-09-13 2000-05-11 Hitachi Chemical Co Ltd Prepreg for printed circuit board
JPH106440A (ja) * 1996-06-19 1998-01-13 Toray Dow Corning Silicone Co Ltd シリコーンゲル成形物と剥離性フィルムからなる複合成形体およびその製造方法
US7747332B2 (en) 2000-05-08 2010-06-29 International Rehabilitative Sciences, Inc. Electrical stimulation combined with a biologic to increase osteogenesis
US6393328B1 (en) 2000-05-08 2002-05-21 International Rehabilitative Sciences, Inc. Multi-functional portable electro-medical device
US20060104005A1 (en) * 2004-11-15 2006-05-18 Heat Company Limited Pad for reducing/removing static electricity from air, gas, liquid forms and liquid fuel molecules
US20160001541A1 (en) * 2014-07-03 2016-01-07 Wacker Chemical Corporation Preparation of Multilayer Structural Composites Prepared Using Consolidation Liners Of High Parting Force

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2596162A (en) * 1945-03-01 1952-05-13 Marco Chemicals Inc Method of polymerizing fiber-reinforced resinous materials and product
US2517698A (en) * 1945-03-05 1950-08-08 Marco Chemicals Inc Method of polymerizing fiber reinforced resinous materials
US2537311A (en) * 1945-12-22 1951-01-09 Lyon George Albert Method of and apparatus for forming plastic
US2632744A (en) * 1947-01-31 1953-03-24 Libbey Owens Ford Glass Co Preparation of polymerized polyester resin materials of improved strength and water resistance
US2596192A (en) * 1947-05-03 1952-05-13 Dan River Mills Inc Dyeing with pigment coloring matter
US2985615A (en) * 1953-05-23 1961-05-23 Tno Unsaturated polyester reaction products, copolymers thereof, and process of producing same
US2750320A (en) * 1954-03-29 1956-06-12 Swedlow Plastics Company Process for preparing continuous plastic sheets
US3236714A (en) * 1962-10-09 1966-02-22 Rogers Corp Method of and apparatus for producing reinforced sheet material
US3508983A (en) * 1967-04-24 1970-04-28 Schjeldahl Co G T Use of a silane coating to bond copper to plastic in making a printed circuit
US3902951A (en) * 1969-12-28 1975-09-02 Matsushita Electric Works Ltd Copper-clad laminate and production thereof
US3676252A (en) * 1970-04-13 1972-07-11 Rca Corp Method of electrically mounting components in hybrid circuits
JPS5245742B2 (enExample) * 1971-11-06 1977-11-18
US3810816A (en) * 1972-04-06 1974-05-14 Dow Chemical Co Process for making reinforced resin laminates of uniform thickness
JPS5517508B2 (enExample) * 1973-03-05 1980-05-12
JPS555992B2 (enExample) * 1974-05-28 1980-02-12
CH592397A5 (enExample) * 1975-04-30 1977-10-31 Caratsch Hans Peter
US4012267A (en) * 1975-07-10 1977-03-15 Bell Telephone Laboratories, Incorporated Process for producing pultruded clad composites
JPS5230307A (en) * 1975-09-04 1977-03-08 Hitachi Ltd Subscriber relocating method
JPS5245359A (en) * 1975-10-08 1977-04-09 Hitachi Ltd Analog-digital converter
JPS52142769A (en) * 1976-05-25 1977-11-28 Ibigawa Electric Ind Co Ltd Method of continuous production of decorative laminate
JPS5327673A (en) * 1976-08-24 1978-03-15 Hitachi Chem Co Ltd Manufacture of phenolic resin laminates based on paper
US4075236A (en) * 1976-09-30 1978-02-21 Pennwalt Corporation Continuous manufacture of peroxyesters
JPS5388872A (en) * 1977-01-14 1978-08-04 Matsushita Electric Works Ltd Continuous production of laminated plate
JPS543777A (en) * 1977-06-09 1979-01-12 Itoki Kosakusho Transporting stand device with device of automatically delivering article in automatic magazine
DE2722262B2 (de) * 1977-05-17 1979-07-19 Kurt 7218 Trossingen Held Verfahren und Vorrichtung zur kontinuierlichen Herstellung von Laminaten

Also Published As

Publication number Publication date
US4662973A (en) 1987-05-05
JPS55126418A (en) 1980-09-30
JPS626513B2 (enExample) 1987-02-12

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Legal Events

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