CA1132718A - Automation system - Google Patents

Automation system

Info

Publication number
CA1132718A
CA1132718A CA330,500A CA330500A CA1132718A CA 1132718 A CA1132718 A CA 1132718A CA 330500 A CA330500 A CA 330500A CA 1132718 A CA1132718 A CA 1132718A
Authority
CA
Canada
Prior art keywords
fixture
segment
film
cycle
loading
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA330,500A
Other languages
English (en)
French (fr)
Inventor
Max Avalon
John L. Kowalski
Kenneth B. Tippetts
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bull HN Information Systems Inc
Original Assignee
Honeywell Information Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Information Systems Inc filed Critical Honeywell Information Systems Inc
Application granted granted Critical
Publication of CA1132718A publication Critical patent/CA1132718A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/453—Leadframes comprising flexible metallic tapes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5136—Separate tool stations for selective or successive operation on work
    • Y10T29/5137—Separate tool stations for selective or successive operation on work including assembling or disassembling station
    • Y10T29/5142—Separate tool stations for selective or successive operation on work including assembling or disassembling station and means to sever work from supply
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5191—Assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Wire Bonding (AREA)
  • Advancing Webs (AREA)
  • Collation Of Sheets And Webs (AREA)
CA330,500A 1978-07-03 1979-06-25 Automation system Expired CA1132718A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US921,638 1978-07-03
US05/921,638 US4227289A (en) 1978-07-03 1978-07-03 Automation system for mounting film segments into fixtures

Publications (1)

Publication Number Publication Date
CA1132718A true CA1132718A (en) 1982-09-28

Family

ID=25445722

Family Applications (1)

Application Number Title Priority Date Filing Date
CA330,500A Expired CA1132718A (en) 1978-07-03 1979-06-25 Automation system

Country Status (4)

Country Link
US (1) US4227289A (enExample)
JP (1) JPS5511399A (enExample)
AU (1) AU520813B2 (enExample)
CA (1) CA1132718A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5993449A (ja) * 1982-11-18 1984-05-29 Konishiroku Photo Ind Co Ltd フイルムマウント装置
JP2609014B2 (ja) * 1990-07-17 1997-05-14 三菱電機株式会社 半導体装置の製造方法及び製造装置
US5276954A (en) * 1992-06-11 1994-01-11 Pakon, Inc. Slide mounter
CN109849105A (zh) * 2018-11-16 2019-06-07 惠科股份有限公司 覆晶薄膜冲切装置、显示装置组装设备及其组装系统

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3274665A (en) * 1964-10-06 1966-09-27 Ibm Mechanical chip posting mechanism
US4079489A (en) * 1976-12-30 1978-03-21 Honeywell Information Systems Inc. Placement machine

Also Published As

Publication number Publication date
US4227289A (en) 1980-10-14
JPS5511399A (en) 1980-01-26
AU520813B2 (en) 1982-02-25
AU4821379A (en) 1980-01-10
JPS6246978B2 (enExample) 1987-10-06

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