CA1129969A - Dual wavelength optical annealing of materials - Google Patents
Dual wavelength optical annealing of materialsInfo
- Publication number
- CA1129969A CA1129969A CA340,333A CA340333A CA1129969A CA 1129969 A CA1129969 A CA 1129969A CA 340333 A CA340333 A CA 340333A CA 1129969 A CA1129969 A CA 1129969A
- Authority
- CA
- Canada
- Prior art keywords
- pulse
- molten
- wavelength
- light
- radiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 title abstract description 47
- 238000000137 annealing Methods 0.000 title abstract description 22
- 230000003287 optical effect Effects 0.000 title abstract description 7
- 230000009977 dual effect Effects 0.000 title abstract description 4
- 230000005855 radiation Effects 0.000 claims abstract description 22
- 239000007787 solid Substances 0.000 claims abstract description 13
- 230000008018 melting Effects 0.000 claims abstract description 9
- 238000002844 melting Methods 0.000 claims abstract description 9
- 238000010438 heat treatment Methods 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 36
- 230000008569 process Effects 0.000 claims description 29
- 230000005670 electromagnetic radiation Effects 0.000 claims description 3
- 239000012071 phase Substances 0.000 abstract description 13
- 239000007790 solid phase Substances 0.000 abstract description 13
- 239000000758 substrate Substances 0.000 description 36
- 239000004065 semiconductor Substances 0.000 description 33
- 239000013078 crystal Substances 0.000 description 21
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 14
- 229910052710 silicon Inorganic materials 0.000 description 14
- 239000010703 silicon Substances 0.000 description 14
- 238000001228 spectrum Methods 0.000 description 8
- 230000000977 initiatory effect Effects 0.000 description 7
- 238000005224 laser annealing Methods 0.000 description 7
- 239000000155 melt Substances 0.000 description 7
- 238000002310 reflectometry Methods 0.000 description 7
- 238000010521 absorption reaction Methods 0.000 description 6
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical group [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 6
- 230000002123 temporal effect Effects 0.000 description 4
- 239000000470 constituent Substances 0.000 description 3
- 230000001419 dependent effect Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000007943 implant Substances 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000005468 ion implantation Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- 229910052785 arsenic Inorganic materials 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 238000002513 implantation Methods 0.000 description 2
- 238000009877 rendering Methods 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- HFGHRUCCKVYFKL-UHFFFAOYSA-N 4-ethoxy-2-piperazin-1-yl-7-pyridin-4-yl-5h-pyrimido[5,4-b]indole Chemical compound C1=C2NC=3C(OCC)=NC(N4CCNCC4)=NC=3C2=CC=C1C1=CC=NC=C1 HFGHRUCCKVYFKL-UHFFFAOYSA-N 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005465 channeling Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005274 electronic transitions Effects 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000012768 molten material Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000001579 optical reflectometry Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000005001 rutherford backscattering spectroscopy Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B13/00—Single-crystal growth by zone-melting; Refining by zone-melting
- C30B13/16—Heating of the molten zone
- C30B13/22—Heating of the molten zone by irradiation or electric discharge
- C30B13/24—Heating of the molten zone by irradiation or electric discharge using electromagnetic waves
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Electromagnetism (AREA)
- Organic Chemistry (AREA)
- High Energy & Nuclear Physics (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Toxicology (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
- Recrystallisation Techniques (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US96419378A | 1978-11-28 | 1978-11-28 | |
US964,193 | 1978-11-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
CA1129969A true CA1129969A (en) | 1982-08-17 |
Family
ID=25508237
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA340,333A Expired CA1129969A (en) | 1978-11-28 | 1979-11-21 | Dual wavelength optical annealing of materials |
Country Status (7)
Country | Link |
---|---|
JP (1) | JPS55500964A (enrdf_load_stackoverflow) |
CA (1) | CA1129969A (enrdf_load_stackoverflow) |
FR (1) | FR2443138A1 (enrdf_load_stackoverflow) |
GB (1) | GB2056769B (enrdf_load_stackoverflow) |
IT (1) | IT1127616B (enrdf_load_stackoverflow) |
NL (1) | NL7920170A (enrdf_load_stackoverflow) |
WO (1) | WO1980001121A1 (enrdf_load_stackoverflow) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8546805B2 (en) | 2012-01-27 | 2013-10-01 | Ultratech, Inc. | Two-beam laser annealing with improved temperature performance |
US8865603B2 (en) | 2012-06-11 | 2014-10-21 | Ultratech, Inc. | Laser annealing systems and methods with ultra-short dwell times |
US9558973B2 (en) | 2012-06-11 | 2017-01-31 | Ultratech, Inc. | Laser annealing systems and methods with ultra-short dwell times |
US10083843B2 (en) | 2014-12-17 | 2018-09-25 | Ultratech, Inc. | Laser annealing systems and methods with ultra-short dwell times |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4542037A (en) * | 1980-04-28 | 1985-09-17 | Fairchild Camera And Instrument Corporation | Laser induced flow of glass bonded materials |
CA1174285A (en) * | 1980-04-28 | 1984-09-11 | Michelangelo Delfino | Laser induced flow of integrated circuit structure materials |
US6168744B1 (en) * | 1996-10-08 | 2001-01-02 | Board Of Trustees University Of Arkansas | Process for sequential multi beam laser processing of materials |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3340601A (en) * | 1963-07-17 | 1967-09-12 | United Aircraft Corp | Alloy diffused transistor |
US3492072A (en) * | 1965-04-14 | 1970-01-27 | Westinghouse Electric Corp | Apparatus for producing radiation patterns for forming etchant-resistant patterns and the like |
US3585088A (en) * | 1968-10-18 | 1971-06-15 | Ibm | Methods of producing single crystals on supporting substrates |
US3848104A (en) * | 1973-04-09 | 1974-11-12 | Avco Everett Res Lab Inc | Apparatus for heat treating a surface |
US4151008A (en) * | 1974-11-15 | 1979-04-24 | Spire Corporation | Method involving pulsed light processing of semiconductor devices |
US3940289A (en) * | 1975-02-03 | 1976-02-24 | The United States Of America As Represented By The Secretary Of The Navy | Flash melting method for producing new impurity distributions in solids |
US4059461A (en) * | 1975-12-10 | 1977-11-22 | Massachusetts Institute Of Technology | Method for improving the crystallinity of semiconductor films by laser beam scanning and the products thereof |
US3989778A (en) * | 1975-12-17 | 1976-11-02 | W. R. Grace & Co. | Method of heat sealing thermoplastic sheets together using a split laser beam |
DE2643893C3 (de) * | 1976-09-29 | 1981-01-08 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zur Herstellung einer mit einer Struktur versehenen Schicht auf einem Substrat |
US4087695A (en) * | 1977-01-17 | 1978-05-02 | The United States Of America As Represented By The Secretary Of The Army | Method for producing optical baffling material using pulsed electron beams |
DE2705444A1 (de) * | 1977-02-09 | 1978-08-10 | Siemens Ag | Verfahren zur lokal begrenzten erwaermung eines festkoerpers |
US4154625A (en) * | 1977-11-16 | 1979-05-15 | Bell Telephone Laboratories, Incorporated | Annealing of uncapped compound semiconductor materials by pulsed energy deposition |
US4147563A (en) * | 1978-08-09 | 1979-04-03 | The United States Of America As Represented By The United States Department Of Energy | Method for forming p-n junctions and solar-cells by laser-beam processing |
US4155779A (en) * | 1978-08-21 | 1979-05-22 | Bell Telephone Laboratories, Incorporated | Control techniques for annealing semiconductors |
-
1979
- 1979-11-15 JP JP50010779A patent/JPS55500964A/ja active Pending
- 1979-11-15 NL NL7920170A patent/NL7920170A/nl not_active Application Discontinuation
- 1979-11-15 GB GB8024258A patent/GB2056769B/en not_active Expired
- 1979-11-15 WO PCT/US1979/000978 patent/WO1980001121A1/en unknown
- 1979-11-21 CA CA340,333A patent/CA1129969A/en not_active Expired
- 1979-11-27 FR FR7929145A patent/FR2443138A1/fr active Granted
- 1979-11-27 IT IT27611/79A patent/IT1127616B/it active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8546805B2 (en) | 2012-01-27 | 2013-10-01 | Ultratech, Inc. | Two-beam laser annealing with improved temperature performance |
US8865603B2 (en) | 2012-06-11 | 2014-10-21 | Ultratech, Inc. | Laser annealing systems and methods with ultra-short dwell times |
US9558973B2 (en) | 2012-06-11 | 2017-01-31 | Ultratech, Inc. | Laser annealing systems and methods with ultra-short dwell times |
US10083843B2 (en) | 2014-12-17 | 2018-09-25 | Ultratech, Inc. | Laser annealing systems and methods with ultra-short dwell times |
Also Published As
Publication number | Publication date |
---|---|
IT1127616B (it) | 1986-05-21 |
GB2056769A (en) | 1981-03-18 |
IT7927611A0 (it) | 1979-11-27 |
JPS55500964A (enrdf_load_stackoverflow) | 1980-11-13 |
WO1980001121A1 (en) | 1980-05-29 |
GB2056769B (en) | 1983-03-30 |
NL7920170A (nl) | 1980-09-30 |
FR2443138B1 (enrdf_load_stackoverflow) | 1983-06-17 |
FR2443138A1 (fr) | 1980-06-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4234356A (en) | Dual wavelength optical annealing of materials | |
US4234358A (en) | Patterned epitaxial regrowth using overlapping pulsed irradiation | |
EP0037685B1 (en) | Method of producing a semiconductor device | |
US6051483A (en) | Formation of ultra-shallow semiconductor junction using microwave annealing | |
US4439245A (en) | Electromagnetic radiation annealing of semiconductor material | |
US8765618B2 (en) | Annealing apparatus using two wavelengths of continuous wave laser radiation | |
WO2011065094A1 (ja) | レーザアニール装置およびレーザアニール方法 | |
KR20120089677A (ko) | 펄스열 어닐링 방법을 이용한 얇은 필름을 고체 상 재결정화시키는 방법 | |
US7145104B2 (en) | Silicon layer for uniformizing temperature during photo-annealing | |
FR2532297A1 (fr) | Procede de refonte d'une couche de verre au phosphosilicate, notamment pour le traitement de composants semi-conducteurs | |
CA1129969A (en) | Dual wavelength optical annealing of materials | |
JP2019523986A (ja) | 深い接合の電子装置及びその製造方法 | |
JPS5892228A (ja) | レ−ザ−による半導体素子の欠陥のゲツタリング方法 | |
JP2000349042A (ja) | 半導体素子の製造方法と製造装置 | |
US20210057267A1 (en) | Method of healing an implanted layer comprising a heat treatment prior to recrystallisation by laser annealing | |
Celler et al. | Modification of silicon properties with lasers, electron beams, and incoherent light | |
JP2020533807A (ja) | ターゲット材料を処理する方法 | |
Brown | Laser processing of semiconductors | |
Godbole et al. | Laser annealing of silicon | |
JPS59112617A (ja) | 半導体装置のレ−ザアニ−ル方法 | |
Bertolotti | Laser annealing of semiconductors | |
JPH0147004B2 (enrdf_load_stackoverflow) | ||
JPS61218131A (ja) | 半導体装置の製造方法 | |
Sapriel et al. | Raman vibrational studies of transient annealing of GaAs amorphous thin films | |
JPH11121375A (ja) | 半導体装置の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MKEX | Expiry |