JPH0147004B2 - - Google Patents
Info
- Publication number
- JPH0147004B2 JPH0147004B2 JP54161197A JP16119779A JPH0147004B2 JP H0147004 B2 JPH0147004 B2 JP H0147004B2 JP 54161197 A JP54161197 A JP 54161197A JP 16119779 A JP16119779 A JP 16119779A JP H0147004 B2 JPH0147004 B2 JP H0147004B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- layer
- semiconductor substrate
- alloy layer
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- High Energy & Nuclear Physics (AREA)
- General Physics & Mathematics (AREA)
- Toxicology (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16119779A JPS5683935A (en) | 1979-12-12 | 1979-12-12 | Formation of metal layer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16119779A JPS5683935A (en) | 1979-12-12 | 1979-12-12 | Formation of metal layer |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5683935A JPS5683935A (en) | 1981-07-08 |
JPH0147004B2 true JPH0147004B2 (enrdf_load_stackoverflow) | 1989-10-12 |
Family
ID=15730424
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16119779A Granted JPS5683935A (en) | 1979-12-12 | 1979-12-12 | Formation of metal layer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5683935A (enrdf_load_stackoverflow) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW232751B (en) | 1992-10-09 | 1994-10-21 | Semiconductor Energy Res Co Ltd | Semiconductor device and method for forming the same |
JP2746100B2 (ja) * | 1994-02-08 | 1998-04-28 | 日本電気株式会社 | 半導体装置の製造方法 |
JP7063242B2 (ja) * | 2018-11-09 | 2022-05-09 | 株式会社デンソー | 半導体装置の製造方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55111128A (en) * | 1979-02-20 | 1980-08-27 | Nec Corp | Manufacturing method of semiconductor device |
-
1979
- 1979-12-12 JP JP16119779A patent/JPS5683935A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5683935A (en) | 1981-07-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4234356A (en) | Dual wavelength optical annealing of materials | |
IE51992B1 (en) | Method for manufacturing a semiconductor device | |
CN101878519A (zh) | 形成硅太阳能电池的背面点接触结构的方法 | |
US6232207B1 (en) | Doping process for producing homojunctions in semiconductor substrates | |
JPH02152226A (ja) | 半導体装置の製造方法 | |
JP2019523986A (ja) | 深い接合の電子装置及びその製造方法 | |
US4319119A (en) | Process for gettering semiconductor components and integrated semiconductor circuits | |
GB2234968A (en) | Method of modifying the surface of a glass substrate | |
JPH0147004B2 (enrdf_load_stackoverflow) | ||
CA1129969A (en) | Dual wavelength optical annealing of materials | |
JPS633447B2 (enrdf_load_stackoverflow) | ||
JPS60216538A (ja) | 半導体基板への不純物拡散方法 | |
US20050112852A1 (en) | Using acoustic energy to activate implanted species | |
JPS6250972B2 (enrdf_load_stackoverflow) | ||
US3469308A (en) | Fabrication of semiconductive devices | |
JPS62271420A (ja) | 半導体基体の処理装置 | |
JPH07118444B2 (ja) | 半導体薄膜の熱処理方法 | |
JPS6119102B2 (enrdf_load_stackoverflow) | ||
JPS59112617A (ja) | 半導体装置のレ−ザアニ−ル方法 | |
Sapriel et al. | Raman vibrational studies of transient annealing of GaAs amorphous thin films | |
JPS62274620A (ja) | イオン注入層のアニ−ル方法 | |
JPS60154609A (ja) | 半導体装置の製造方法 | |
JPS59172736A (ja) | イオン注入用ウエハ−ス保持装置 | |
JPH01274422A (ja) | 半導体基板の熱処理方法 | |
JPS61163635A (ja) | 半導体不純物添加装置 |