CA1123920A - Laser soldering apparatus - Google Patents
Laser soldering apparatusInfo
- Publication number
- CA1123920A CA1123920A CA331,825A CA331825A CA1123920A CA 1123920 A CA1123920 A CA 1123920A CA 331825 A CA331825 A CA 331825A CA 1123920 A CA1123920 A CA 1123920A
- Authority
- CA
- Canada
- Prior art keywords
- solder
- chip
- component
- soldering
- energy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 30
- 229910000679 solder Inorganic materials 0.000 claims abstract description 46
- 238000000034 method Methods 0.000 claims abstract description 14
- 230000001427 coherent effect Effects 0.000 claims abstract description 6
- 230000005855 radiation Effects 0.000 claims description 15
- 239000004020 conductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 230000003287 optical effect Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 16
- 239000003990 capacitor Substances 0.000 description 15
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 206010001497 Agitation Diseases 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- -1 Neodymium Yttrium Aluminum Chemical compound 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- VIKNJXKGJWUCNN-XGXHKTLJSA-N norethisterone Chemical compound O=C1CC[C@@H]2[C@H]3CC[C@](C)([C@](CC4)(O)C#C)[C@@H]4[C@@H]3CCC2=C1 VIKNJXKGJWUCNN-XGXHKTLJSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000002226 simultaneous effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000007847 structural defect Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0619—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams with spots located on opposed surfaces of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0652—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Laser Beam Processing (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US93667178A | 1978-08-24 | 1978-08-24 | |
| US936,671 | 1978-08-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1123920A true CA1123920A (en) | 1982-05-18 |
Family
ID=25468940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA331,825A Expired CA1123920A (en) | 1978-08-24 | 1979-07-13 | Laser soldering apparatus |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JPS5530895A (enrdf_load_stackoverflow) |
| CA (1) | CA1123920A (enrdf_load_stackoverflow) |
| DE (1) | DE2934407A1 (enrdf_load_stackoverflow) |
| FR (1) | FR2434002A1 (enrdf_load_stackoverflow) |
| GB (1) | GB2038220B (enrdf_load_stackoverflow) |
| IT (1) | IT1120489B (enrdf_load_stackoverflow) |
| NL (1) | NL7906042A (enrdf_load_stackoverflow) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0085278A1 (en) * | 1982-01-28 | 1983-08-10 | Battelle Development Corporation | Split beam method of altering material properties |
| JPH0347730Y2 (enrdf_load_stackoverflow) * | 1985-04-18 | 1991-10-11 | ||
| DE3539933A1 (de) * | 1985-11-11 | 1987-05-14 | Nixdorf Computer Ag | Vorrichtung zum aufloeten elektronischer bauelemente auf eine schaltungsplatine |
| JPH0677811B2 (ja) * | 1986-01-20 | 1994-10-05 | 株式会社ハイベツク | 自動半田付け装置 |
| JPH0783036B2 (ja) * | 1987-12-11 | 1995-09-06 | 三菱電機株式会社 | キヤリアテープ |
| JPH02138066U (enrdf_load_stackoverflow) * | 1989-04-17 | 1990-11-19 | ||
| US5060288A (en) * | 1990-08-27 | 1991-10-22 | Sierra Research And Technology, Inc. | Infrared heater array for IC soldering |
| US5309545A (en) * | 1990-08-27 | 1994-05-03 | Sierra Research And Technology, Inc. | Combined radiative and convective rework system |
| DE19833368C1 (de) * | 1998-07-24 | 2000-02-17 | Schott Glas | Verfahren und Vorrichtung zur Bearbeitung von Bauteilen aus sprödbrüchigen Werkstoffen |
| JP2005347415A (ja) * | 2004-06-01 | 2005-12-15 | Miyachi Technos Corp | 電気部品実装方法 |
| ATE438478T1 (de) | 2004-10-06 | 2009-08-15 | Limo Patentverwaltung Gmbh | Laseranordnung |
| WO2006037370A1 (de) * | 2004-10-06 | 2006-04-13 | Hentze-Lissotschenko Patentverwaltungs Gmbh & Co. Kg | Laseranordnung |
| CN110948079B (zh) * | 2019-12-24 | 2023-10-10 | 武汉嘉铭激光股份有限公司 | 一种双激光锡焊的组合装置及其焊接方法 |
| CN114682948B (zh) * | 2022-03-04 | 2023-10-31 | 广东风华高新科技股份有限公司 | 片式元器件的可焊性测试方法、装置及系统 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1565832A1 (de) * | 1966-09-06 | 1970-02-12 | Siemens Ag | Optische Anordnung fuer Laserstrahlen |
| US3524046A (en) * | 1968-04-26 | 1970-08-11 | Aluminum Co Of America | Apparatus and method for piercing holes in elastomeric articles |
| GB1371624A (en) * | 1971-03-26 | 1974-10-23 | Atomic Energy Authority Uk | Optical processing of materials |
| JPS5539434B2 (enrdf_load_stackoverflow) * | 1972-08-25 | 1980-10-11 | ||
| JPS5310937B2 (enrdf_load_stackoverflow) * | 1973-05-18 | 1978-04-18 | ||
| JPS5148917B2 (enrdf_load_stackoverflow) * | 1973-10-26 | 1976-12-23 | ||
| GB1510899A (en) * | 1975-11-21 | 1978-05-17 | Boc Ltd | Laser machining |
| JPS5297696U (enrdf_load_stackoverflow) * | 1976-01-21 | 1977-07-22 | ||
| US4083629A (en) * | 1976-11-29 | 1978-04-11 | Gte Laboratories Incorporated | Beam splitting system for a welding laser |
-
1979
- 1979-07-13 CA CA331,825A patent/CA1123920A/en not_active Expired
- 1979-07-20 GB GB7925327A patent/GB2038220B/en not_active Expired
- 1979-07-31 FR FR7919725A patent/FR2434002A1/fr active Granted
- 1979-08-07 NL NL7906042A patent/NL7906042A/nl not_active Application Discontinuation
- 1979-08-07 IT IT49988/79A patent/IT1120489B/it active
- 1979-08-24 DE DE19792934407 patent/DE2934407A1/de not_active Withdrawn
- 1979-08-24 JP JP10805979A patent/JPS5530895A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| FR2434002A1 (fr) | 1980-03-21 |
| FR2434002B1 (enrdf_load_stackoverflow) | 1983-08-12 |
| GB2038220B (en) | 1982-10-20 |
| JPS5530895A (en) | 1980-03-04 |
| JPS6349594B2 (enrdf_load_stackoverflow) | 1988-10-05 |
| DE2934407A1 (de) | 1980-03-06 |
| IT1120489B (it) | 1986-03-26 |
| GB2038220A (en) | 1980-07-23 |
| NL7906042A (nl) | 1980-02-26 |
| IT7949988A0 (it) | 1979-08-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |