CA1085061A - Transistor with emitter of high and low doping - Google Patents
Transistor with emitter of high and low dopingInfo
- Publication number
- CA1085061A CA1085061A CA277,047A CA277047A CA1085061A CA 1085061 A CA1085061 A CA 1085061A CA 277047 A CA277047 A CA 277047A CA 1085061 A CA1085061 A CA 1085061A
- Authority
- CA
- Canada
- Prior art keywords
- region
- layer
- silicon
- conductivity type
- micron
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
- H10D62/133—Emitter regions of BJTs
-
- H10P32/1408—
-
- H10P32/1412—
-
- H10P32/1414—
-
- H10P32/171—
-
- H10P95/00—
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/02—Contacts, special
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Bipolar Transistors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL7604445 | 1976-04-27 | ||
| NL7604445A NL7604445A (nl) | 1976-04-27 | 1976-04-27 | Werkwijze ter vervaardiging van een halfgelei- derinrichting, en inrichting vervaardigd door toepassing van de werkwijze. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1085061A true CA1085061A (en) | 1980-09-02 |
Family
ID=19826076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA277,047A Expired CA1085061A (en) | 1976-04-27 | 1977-04-26 | Transistor with emitter of high and low doping |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US4151006A (enExample) |
| JP (1) | JPS52139386A (enExample) |
| CA (1) | CA1085061A (enExample) |
| DE (1) | DE2718449A1 (enExample) |
| FR (1) | FR2349955A1 (enExample) |
| GB (1) | GB1522291A (enExample) |
| IT (1) | IT1078440B (enExample) |
| NL (1) | NL7604445A (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL7810549A (nl) * | 1978-10-23 | 1980-04-25 | Philips Nv | Werkwijze voor het vervaardigen van een halfgeleider- inrichting. |
| US4228452A (en) * | 1979-05-02 | 1980-10-14 | Eastman Kodak Company | Silicon device with uniformly thick polysilicon |
| US4452645A (en) * | 1979-11-13 | 1984-06-05 | International Business Machines Corporation | Method of making emitter regions by implantation through a non-monocrystalline layer |
| US4534806A (en) * | 1979-12-03 | 1985-08-13 | International Business Machines Corporation | Method for manufacturing vertical PNP transistor with shallow emitter |
| EP0029887B1 (de) * | 1979-12-03 | 1983-07-13 | International Business Machines Corporation | Verfahren zum Herstellen eines vertikalen PNP-Transistors und so hergestellter Transistor |
| US4301588A (en) * | 1980-02-01 | 1981-11-24 | International Business Machines Corporation | Consumable amorphous or polysilicon emitter process |
| US4380774A (en) * | 1980-12-19 | 1983-04-19 | The United States Of America As Represented By The Secretary Of The Navy | High-performance bipolar microwave transistor |
| US4633287A (en) * | 1982-08-09 | 1986-12-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor photoelectric conversion device |
| US4713355A (en) * | 1984-04-16 | 1987-12-15 | Trw Inc. | Bipolar transistor construction |
| US4604150A (en) * | 1985-01-25 | 1986-08-05 | At&T Bell Laboratories | Controlled boron doping of silicon |
| USRE35642E (en) * | 1987-12-22 | 1997-10-28 | Sgs-Thomson Microelectronics, S.R.L. | Integrated high-voltage bipolar power transistor and low voltage MOS power transistor structure in the emitter switching configuration and relative manufacturing process |
| IT1217323B (it) * | 1987-12-22 | 1990-03-22 | Sgs Microelettronica Spa | Struttura integrata di transistor bipolare di potenza di alta tensione e di transistor mos di potenza di bassa tensione nella configurazione"emitter switching"e relativo processo di fabbricazione |
| US5008208A (en) * | 1988-12-07 | 1991-04-16 | Honeywell Inc. | Method of making planarized, self-aligned bipolar integrated circuits |
| US5028973A (en) * | 1989-06-19 | 1991-07-02 | Harris Corporation | Bipolar transistor with high efficient emitter |
| US5296047A (en) * | 1992-01-28 | 1994-03-22 | Hewlett-Packard Co. | Epitaxial silicon starting material |
| US5324684A (en) * | 1992-02-25 | 1994-06-28 | Ag Processing Technologies, Inc. | Gas phase doping of semiconductor material in a cold-wall radiantly heated reactor under reduced pressure |
| US5989962A (en) * | 1997-09-26 | 1999-11-23 | Texas Instruments Incorporated | Semiconductor device having dual gate and method of formation |
| US7482642B2 (en) * | 2005-03-11 | 2009-01-27 | Lsi Corporation | Bipolar transistors having controllable temperature coefficient of current gain |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3536547A (en) * | 1968-03-25 | 1970-10-27 | Bell Telephone Labor Inc | Plasma deposition of oxide coatings on silicon and electron bombardment of portions thereof to be etched selectively |
| US3775191A (en) * | 1971-06-28 | 1973-11-27 | Bell Canada Northern Electric | Modification of channel regions in insulated gate field effect transistors |
| US3847687A (en) * | 1972-11-15 | 1974-11-12 | Motorola Inc | Methods of forming self aligned transistor structure having polycrystalline contacts |
| US4032956A (en) * | 1972-12-29 | 1977-06-28 | Sony Corporation | Transistor circuit |
| US4032957A (en) * | 1972-12-29 | 1977-06-28 | Sony Corporation | Semiconductor device |
| US4007474A (en) * | 1972-12-29 | 1977-02-08 | Sony Corporation | Transistor having an emitter with a low impurity concentration portion and a high impurity concentration portion |
| US4027324A (en) * | 1972-12-29 | 1977-05-31 | Sony Corporation | Bidirectional transistor |
| US4028155A (en) * | 1974-02-28 | 1977-06-07 | Lfe Corporation | Process and material for manufacturing thin film integrated circuits |
| GB1502165A (en) * | 1974-04-10 | 1978-02-22 | Sony Corp | Semiconductor devices |
| JPS50137478A (enExample) * | 1974-04-18 | 1975-10-31 | ||
| DE2429957B2 (de) * | 1974-06-21 | 1980-08-28 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zur Herstellung einer dotierten Zone eines bestimmten Leitungstyps in einem Halbleiterkörper |
| DE2449688C3 (de) * | 1974-10-18 | 1980-07-10 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Verfahren zur Herstellung einer dotierten Zone eines Leitfähigkeitstyps in einem Halbleiterkörper |
-
1976
- 1976-04-27 NL NL7604445A patent/NL7604445A/xx not_active Application Discontinuation
-
1977
- 1977-04-19 US US05/788,732 patent/US4151006A/en not_active Expired - Lifetime
- 1977-04-22 IT IT22780/77A patent/IT1078440B/it active
- 1977-04-22 GB GB16818/77A patent/GB1522291A/en not_active Expired
- 1977-04-26 CA CA277,047A patent/CA1085061A/en not_active Expired
- 1977-04-26 DE DE19772718449 patent/DE2718449A1/de active Granted
- 1977-04-26 JP JP4749577A patent/JPS52139386A/ja active Granted
- 1977-04-27 FR FR7712719A patent/FR2349955A1/fr active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6112388B2 (enExample) | 1986-04-08 |
| DE2718449C2 (enExample) | 1987-11-26 |
| DE2718449A1 (de) | 1977-11-10 |
| FR2349955A1 (fr) | 1977-11-25 |
| NL7604445A (nl) | 1977-10-31 |
| FR2349955B1 (enExample) | 1983-06-17 |
| JPS52139386A (en) | 1977-11-21 |
| IT1078440B (it) | 1985-05-08 |
| GB1522291A (en) | 1978-08-23 |
| US4151006A (en) | 1979-04-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA1085061A (en) | Transistor with emitter of high and low doping | |
| US4044452A (en) | Process for making field effect and bipolar transistors on the same semiconductor chip | |
| US5057439A (en) | Method of fabricating polysilicon emitters for solar cells | |
| US6049098A (en) | Bipolar transistor having an emitter region formed of silicon carbide | |
| US4412868A (en) | Method of making integrated circuits utilizing ion implantation and selective epitaxial growth | |
| EP0090940B1 (en) | Method of forming emitter and intrinsic base regions of a bipolar transistor | |
| CA1071772A (en) | Method of manufacturing a semi-conductor device employing semi-conductor to semi-insulator conversion by ion implantation | |
| US4110125A (en) | Method for fabricating semiconductor devices | |
| US5698890A (en) | Semiconductor device having bipolar transistor free from leakage current across thin base region | |
| US4706378A (en) | Method of making vertical bipolar transistor having base above buried nitride dielectric formed by deep implantation | |
| US4438556A (en) | Method of forming doped polycrystalline silicon pattern by selective implantation and plasma etching of undoped regions | |
| US4069068A (en) | Semiconductor fabrication method for improved device yield by minimizing pipes between common conductivity type regions | |
| EP0137905B1 (en) | Method for making lateral bipolar transistors | |
| US4016007A (en) | Method for fabricating a silicon device utilizing ion-implantation and selective oxidation | |
| JPH07118478B2 (ja) | 横方向トランジスタの製造方法 | |
| US3423651A (en) | Microcircuit with complementary dielectrically isolated mesa-type active elements | |
| JPS62588B2 (enExample) | ||
| US4437897A (en) | Fabrication process for a shallow emitter/base transistor using same polycrystalline layer | |
| US4408387A (en) | Method for producing a bipolar transistor utilizing an oxidized semiconductor masking layer in conjunction with an anti-oxidation mask | |
| EP0078725B1 (en) | Method for forming submicron bipolar transistors without epitaxial growth and the resulting structure | |
| JPH05129319A (ja) | エピタキシヤル・ベース領域を持つたトランジスタ構造とその作製方法 | |
| US5354696A (en) | Method of manufacturing a semiconductor device with a heterojunction by implantation with carbon-halogen compound | |
| JPS62570B2 (enExample) | ||
| US3615938A (en) | Method for diffusion of acceptor impurities into semiconductors | |
| US3951693A (en) | Ion-implanted self-aligned transistor device including the fabrication method therefor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MKEX | Expiry |