CA1069254A - Dry replenishment of electroless copper solutions - Google Patents

Dry replenishment of electroless copper solutions

Info

Publication number
CA1069254A
CA1069254A CA260,042A CA260042A CA1069254A CA 1069254 A CA1069254 A CA 1069254A CA 260042 A CA260042 A CA 260042A CA 1069254 A CA1069254 A CA 1069254A
Authority
CA
Canada
Prior art keywords
plating solution
plating
replenisher
stabilizer
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA260,042A
Other languages
English (en)
French (fr)
Inventor
Oleh B. Dutkewych
Lebert A. Hofmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Original Assignee
Shipley Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co Inc filed Critical Shipley Co Inc
Application granted granted Critical
Publication of CA1069254A publication Critical patent/CA1069254A/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1617Purification and regeneration of coating baths

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
CA260,042A 1976-02-17 1976-08-27 Dry replenishment of electroless copper solutions Expired CA1069254A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US65828076A 1976-02-17 1976-02-17

Publications (1)

Publication Number Publication Date
CA1069254A true CA1069254A (en) 1980-01-08

Family

ID=24640605

Family Applications (1)

Application Number Title Priority Date Filing Date
CA260,042A Expired CA1069254A (en) 1976-02-17 1976-08-27 Dry replenishment of electroless copper solutions

Country Status (7)

Country Link
JP (1) JPS5299932A (ja)
CA (1) CA1069254A (ja)
DE (1) DE2631633A1 (ja)
FR (1) FR2341667A1 (ja)
GB (1) GB1557871A (ja)
IT (1) IT1059760B (ja)
SE (1) SE7608874L (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60248882A (ja) * 1984-05-24 1985-12-09 Aisin Seiki Co Ltd 高リン含有ニツケル合金の無電解めつき浴
JP6047714B2 (ja) * 2012-08-08 2016-12-21 石原ケミカル株式会社 無電解スズ系メッキ液用のペースト状スズ補給剤及び補給方法

Also Published As

Publication number Publication date
JPS5299932A (en) 1977-08-22
IT1059760B (it) 1982-06-21
SE7608874L (sv) 1977-08-18
FR2341667A1 (fr) 1977-09-16
GB1557871A (en) 1979-12-12
DE2631633A1 (de) 1977-08-18

Similar Documents

Publication Publication Date Title
US5248527A (en) Process for electroless plating tin, lead or tin-lead alloy
US2762723A (en) Processes of chemical nickel plating and baths therefor
US4684550A (en) Electroless copper plating and bath therefor
US3650777A (en) Electroless copper plating
CA1081406A (en) Electroless metal plating
US3717482A (en) Stabilized electroless plating solutions
JP7352515B2 (ja) 電解金合金めっき浴及び電解金合金めっき方法
US5803957A (en) Electroless gold plating bath
US3915717A (en) Stabilized autocatalytic metal deposition baths
US3915716A (en) Chemical nickel plating bath
US3257215A (en) Electroless copper plating
KR20040050887A (ko) 무전해 금도금 용액
US3607317A (en) Ductility promoter and stabilizer for electroless copper plating baths
EP0021757A1 (en) Electroless copper plating solution
US3770464A (en) Dry replenishment of electroless copper solutions
CA1069254A (en) Dry replenishment of electroless copper solutions
US3649308A (en) Stabilized electroless plating solutions
US3663242A (en) Stabilized electroless plating solutions
EP0384180B1 (en) Formaldehyde-free electroless copper plating solutions
US3935013A (en) Electroless deposition of a copper-nickel alloy on an imagewise pattern of physically developable metal nuclei
US3661596A (en) Stabilized, chemical nickel plating bath
US3915718A (en) Chemical silver bath
US2883288A (en) Silver plating bath
US4838937A (en) Stabilized alkaline gold bath for the electro-less deposition of gold
US3790392A (en) Electroless copper plating

Legal Events

Date Code Title Description
MKEX Expiry