CA1041848A - Process for the production of a solder-rejecting protection on circuit boards provided with apertures - Google Patents
Process for the production of a solder-rejecting protection on circuit boards provided with aperturesInfo
- Publication number
- CA1041848A CA1041848A CA217,327A CA217327A CA1041848A CA 1041848 A CA1041848 A CA 1041848A CA 217327 A CA217327 A CA 217327A CA 1041848 A CA1041848 A CA 1041848A
- Authority
- CA
- Canada
- Prior art keywords
- solder
- lacquer
- auxiliary
- circuit board
- auxiliary lacquer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0582—Coating by resist, i.e. resist used as mask for application of insulating coating or of second resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
A B S T R A C T
A process for producing a solder-rejecting protection on circuit boards including applying a viscous auxiliary lacquer to the top of a circuit board, pressing the auxiliary lacquer through apertures in the circuit board to cover solder edges on the solder side of the circuit board, apply-ing a solder-rejecting substance to the solder side to cover conductor paths, and removing the auxiliary lacquer by a solvent to leave the solder edges free for the application of a solder.
A process for producing a solder-rejecting protection on circuit boards including applying a viscous auxiliary lacquer to the top of a circuit board, pressing the auxiliary lacquer through apertures in the circuit board to cover solder edges on the solder side of the circuit board, apply-ing a solder-rejecting substance to the solder side to cover conductor paths, and removing the auxiliary lacquer by a solvent to leave the solder edges free for the application of a solder.
Description
~041848 This invention relates to a process for providing solder-rejecting protection to the conductor paths on the solder side of circuit boards.
In the production of printed circuits the circuit boards are equip-ped with the associated components and the electrical connections produced by soldering All the solder joints are arranged in one plane on the so-called solder side of the circuit boards so that they can be produced sim-ultaneously in one solder path> for example, by surge soldering or trail soldering In soldering, one must distinguish between full soldering and sel-ective soldering. Full soldering is generally used in connection with cir-cuit boards of large construction, In a compact construction the use of the full soldering process would considerably increase the danger of short cir- -cuits through the formation of solder bridges. Therefore, selective solder-ing is popularly used for circuit boards of compact construction, in partic-ular those with miniaturised conductor patterns. In the selective soldering process the solder side of the circuit boards is covered with a solder-rejocting solder-stop lacquer. ~nly the required solder seams are not cover- --ed with solder stop lacquer and thus accept the solder. The solder stop lacquer is usually applied by the silk screen printing method in which, how- -ever, the correct application of a printed pattern to the finished conductor pattern presents considerable difficulties. In addition, the required print-ing prototypes and printing tools are extremely expensive so that when there ~ -sro only a small number of boards and a large number of types the application of the solder stop lacquer by the silk screen printing method becomes un-econo~ical.
Fro~ tho German Offenlegungschrift 1,640,269 it is known to pro- ~- -toct tho conductor paths on the circuit boards during the soldering process by a photo printing procoss, wherein the entire board is covered with a photo lacquor with the oxception of those paths which are not to be soldered ~0 and which aro caused to reject solder by subsèquent passivation. Due to the - ~-- 1 - '':~
~0418~
good resolution of the photo lacquer the pattern produced by the photo print-ing can be correctly applied to the conductor pattern. This known process, however, is extremely uneconomical as it can be executed only with a sub-stantial outlay and since photo masks which are dependent upon the patterns are required.
It is an object of this invention to provide a process whereby solder-rejecting protection may bo applied to the conductor paths of a cir-cuit board while at the same time leaving certain portions of the circuit board free to accept solder applied thereto.
It is a further object of this invention to provide a process as referred to in the preceeding object which is easy to perform and economical -to carry out.
It is a further object to provide a method for applying solder- -rejecting protection to selected conductor paths of a circuit board which does not require the use of pattorn depondent printing tools or masks.
~ . . ,,.,,;., Other objects and advantages of the invention herein will become uore apparent when considering the following description and accompanying -~
drawings.
Figure 1 is an edge view showing a portion of a circuit boart with conductor paths applied to both sides and with apertures for the reception of components;
Figure 2 is an edge view of the circuit board of Figure 1 showing the application of tho auxiliary lacquer to the top of the circuit board;
Figure 3 is an edgo view of the circuit board following the application of a solder stop lacquer to the solder side;
Pigure 4 is an edge view of the circuit board following the re- -~ :
~oral of the auxiliary lacquer; and Pigure S is an edge viow of the circuit board following the solder- - -ing proces~.
The ai~ of the invention heroin is to provide a process for achiev-:':
In the production of printed circuits the circuit boards are equip-ped with the associated components and the electrical connections produced by soldering All the solder joints are arranged in one plane on the so-called solder side of the circuit boards so that they can be produced sim-ultaneously in one solder path> for example, by surge soldering or trail soldering In soldering, one must distinguish between full soldering and sel-ective soldering. Full soldering is generally used in connection with cir-cuit boards of large construction, In a compact construction the use of the full soldering process would considerably increase the danger of short cir- -cuits through the formation of solder bridges. Therefore, selective solder-ing is popularly used for circuit boards of compact construction, in partic-ular those with miniaturised conductor patterns. In the selective soldering process the solder side of the circuit boards is covered with a solder-rejocting solder-stop lacquer. ~nly the required solder seams are not cover- --ed with solder stop lacquer and thus accept the solder. The solder stop lacquer is usually applied by the silk screen printing method in which, how- -ever, the correct application of a printed pattern to the finished conductor pattern presents considerable difficulties. In addition, the required print-ing prototypes and printing tools are extremely expensive so that when there ~ -sro only a small number of boards and a large number of types the application of the solder stop lacquer by the silk screen printing method becomes un-econo~ical.
Fro~ tho German Offenlegungschrift 1,640,269 it is known to pro- ~- -toct tho conductor paths on the circuit boards during the soldering process by a photo printing procoss, wherein the entire board is covered with a photo lacquor with the oxception of those paths which are not to be soldered ~0 and which aro caused to reject solder by subsèquent passivation. Due to the - ~-- 1 - '':~
~0418~
good resolution of the photo lacquer the pattern produced by the photo print-ing can be correctly applied to the conductor pattern. This known process, however, is extremely uneconomical as it can be executed only with a sub-stantial outlay and since photo masks which are dependent upon the patterns are required.
It is an object of this invention to provide a process whereby solder-rejecting protection may bo applied to the conductor paths of a cir-cuit board while at the same time leaving certain portions of the circuit board free to accept solder applied thereto.
It is a further object of this invention to provide a process as referred to in the preceeding object which is easy to perform and economical -to carry out.
It is a further object to provide a method for applying solder- -rejecting protection to selected conductor paths of a circuit board which does not require the use of pattorn depondent printing tools or masks.
~ . . ,,.,,;., Other objects and advantages of the invention herein will become uore apparent when considering the following description and accompanying -~
drawings.
Figure 1 is an edge view showing a portion of a circuit boart with conductor paths applied to both sides and with apertures for the reception of components;
Figure 2 is an edge view of the circuit board of Figure 1 showing the application of tho auxiliary lacquer to the top of the circuit board;
Figure 3 is an edgo view of the circuit board following the application of a solder stop lacquer to the solder side;
Pigure 4 is an edge view of the circuit board following the re- -~ :
~oral of the auxiliary lacquer; and Pigure S is an edge viow of the circuit board following the solder- - -ing proces~.
The ai~ of the invention heroin is to provide a process for achiev-:':
- 2 ~
1041~4~
ing solder-rejecting protection of the conductor paths on a circuit board which process can be carried out economically and without a special outlay, and in which no pa~tern dependent printing tools or masks are required.
In accordance with the invention, there is provided a process for the production of a solder rejecting protection for the conductor paths on the solder side of circuit boards with apertures which are surrounded by solder edges including the steps of: applying a viscous auxiliary lacquer to the top surface of a circuit board; pressing the auxiliary lacquer into the apertures in the circuit board in such manner that menisci of the auxiliary lacquer cover the solder edges formed on the solder side; providing the conductor paths on the solder side which are not to be soldered with solder-rejecting properties; and removing the auxiliary lacquer.
The process of the invention presents a number of advantages in comparison to the known processes. For example, all matching problems dis-appear as, irrespective of the position of the apertures in the solder edges, only the solder edges are ever wetted by the auxiliary lacquer and those paths which are not to be soldered can be caused to reject solder, completely irrespective of the pattern. In addition, no expensive pattern-dependent printing prototypes or masks are required. Thus the economics of the process of the invention are not dependent upon the number of boards so that it is particularly suitable for the now usual large number of types, coupled with small lot sizes. Furthermore, the process of the invention can easily be automated as it can be carried out with an extremely low outlay in apparatus.
With particular advantage those paths on the solder side which are not to be soldered are caused to reject solder by passivation. The passivation may be carried out by oxidizing the surface of the paths or by the applicaSion :
of a solder-rejecting substance.
Preferably, after the application of the solder lacquer, a solder stop lacquer is applied to the whole of the solder side and is dried and then -the auxiliary lacquer is removed by a solvent having a selective action, and the solder stop lacquer is removed fro~ the solder edges. As a result of the removal of the auxiliary lacquer the solder stop lacquer loses its
1041~4~
ing solder-rejecting protection of the conductor paths on a circuit board which process can be carried out economically and without a special outlay, and in which no pa~tern dependent printing tools or masks are required.
In accordance with the invention, there is provided a process for the production of a solder rejecting protection for the conductor paths on the solder side of circuit boards with apertures which are surrounded by solder edges including the steps of: applying a viscous auxiliary lacquer to the top surface of a circuit board; pressing the auxiliary lacquer into the apertures in the circuit board in such manner that menisci of the auxiliary lacquer cover the solder edges formed on the solder side; providing the conductor paths on the solder side which are not to be soldered with solder-rejecting properties; and removing the auxiliary lacquer.
The process of the invention presents a number of advantages in comparison to the known processes. For example, all matching problems dis-appear as, irrespective of the position of the apertures in the solder edges, only the solder edges are ever wetted by the auxiliary lacquer and those paths which are not to be soldered can be caused to reject solder, completely irrespective of the pattern. In addition, no expensive pattern-dependent printing prototypes or masks are required. Thus the economics of the process of the invention are not dependent upon the number of boards so that it is particularly suitable for the now usual large number of types, coupled with small lot sizes. Furthermore, the process of the invention can easily be automated as it can be carried out with an extremely low outlay in apparatus.
With particular advantage those paths on the solder side which are not to be soldered are caused to reject solder by passivation. The passivation may be carried out by oxidizing the surface of the paths or by the applicaSion :
of a solder-rejecting substance.
Preferably, after the application of the solder lacquer, a solder stop lacquer is applied to the whole of the solder side and is dried and then -the auxiliary lacquer is removed by a solvent having a selective action, and the solder stop lacquer is removed fro~ the solder edges. As a result of the removal of the auxiliary lacquer the solder stop lacquer loses its
- 3 -B :
adhesion to the solder borders so that in these regions it can easily be removed. The removal of the auxiliary lacquer and thus of the solder stop lacquer from the solder borders can, depending upon the nature of the lacquer systems employed and the layer thicknesses, be made easier by a spray treat-ment, a light brushing, blowing with compressed air or by the use of ultra-sonics during or following the treatment with the selective solvent.
When an auxiliary lacquer having a flux additive is used, the danger of poor solderability of the solder borders in the case of non-optimum removal, can be reduced.
Figure 1 shows a circuit board which consists of an insulating carrier 1 to both sides of which conductor paths 2 have been applied. Aper- -~
tures 3, with solder edges 4, are provided for the reception of components. -~
Figure 2 shows the application of a viscous auxiliary lacquer 5 to the top 6 of the circuit board. The application of the auxiliary lacquer S may be carried out with the aid of a curved doctor 7. The auxiliary lac-quer S is pressed into the apertures 3 in such manner that initially spher- -ical drops 9 are formed on the solder side 8 of the circuit board. These drops 9 then withdraw back into the apertures 3 due to surface tension, to such an extont that only menisci 10 remain which wet and completely cover the solder edges 4. To enable this meniscus formation to occur, the aux-iliary lacquer 5 must have a specific ~iscosity. The required viscosity may bo detormined expori~entally and depents in part upon the diameter of the aperturos. After the application, tho auxiliary lacquer 5 which may consist, for exa~ple, of a water soluble mixture of polyvinylalcohol, gelatine, glycerine and dye, is dried.
Pigure 3 shows the circuit board following the application of a solder stop lacquer 11 which covers the whole of the solder site 8. Commer-cially available solder stop lacquers, for example, a two compo~ent lacquer havin8 an epoxido base can bo used which are applied by spraying, roller-coating or similar ~ethods.
adhesion to the solder borders so that in these regions it can easily be removed. The removal of the auxiliary lacquer and thus of the solder stop lacquer from the solder borders can, depending upon the nature of the lacquer systems employed and the layer thicknesses, be made easier by a spray treat-ment, a light brushing, blowing with compressed air or by the use of ultra-sonics during or following the treatment with the selective solvent.
When an auxiliary lacquer having a flux additive is used, the danger of poor solderability of the solder borders in the case of non-optimum removal, can be reduced.
Figure 1 shows a circuit board which consists of an insulating carrier 1 to both sides of which conductor paths 2 have been applied. Aper- -~
tures 3, with solder edges 4, are provided for the reception of components. -~
Figure 2 shows the application of a viscous auxiliary lacquer 5 to the top 6 of the circuit board. The application of the auxiliary lacquer S may be carried out with the aid of a curved doctor 7. The auxiliary lac-quer S is pressed into the apertures 3 in such manner that initially spher- -ical drops 9 are formed on the solder side 8 of the circuit board. These drops 9 then withdraw back into the apertures 3 due to surface tension, to such an extont that only menisci 10 remain which wet and completely cover the solder edges 4. To enable this meniscus formation to occur, the aux-iliary lacquer 5 must have a specific ~iscosity. The required viscosity may bo detormined expori~entally and depents in part upon the diameter of the aperturos. After the application, tho auxiliary lacquer 5 which may consist, for exa~ple, of a water soluble mixture of polyvinylalcohol, gelatine, glycerine and dye, is dried.
Pigure 3 shows the circuit board following the application of a solder stop lacquer 11 which covers the whole of the solder site 8. Commer-cially available solder stop lacquers, for example, a two compo~ent lacquer havin8 an epoxido base can bo used which are applied by spraying, roller-coating or similar ~ethods.
- 4 After the drying of the solder stop lacquer 11, the auxiliary lacquer 5 is completely removed by means of a selective action solvent.
When the auxiliary lacquer 5 has been removed from the solder edges 4, the solder stop lacquer 11 loses its adhesion in these regions.
Figure 4 shows the circuit board following the removal of the solder stop lacquer 11 from the solder edges 4. The solder stop lacquer 11 can, for example, be removed by light brushing. ~hen merely the solder edges 4 are exposed on the solder side 8 and all the other regions have been covered with the solder stop lacquer 11, components may be applied to the circuit board and soldered in place.
Figure S shows the circuit board after the soldering. Through capillary action the solder 12 fills up the entire aperture 3 and thus pro-duces a durable solder connection between the terminal wires 13 of the com-ponents and the solder sdges 4.
It will be apparent that I have advantageously provided a process whereby solder-rejecting protection may be applied to the conductor paths on ~ -a circuit board which is simple and economical and requires very little in the way of expensive apparatus. -~
While a preferred manner of carrying out the invention has been ~-disclosed, it will be appreciated that this has been shown by way of example -only, and ths invention is not to be limitet thereto as other variations may be apparent to those skilled in the art and the invention is to be given its fullest possible interpretation within the terms of the following claims. -~
," '"-'; ' ., .
:: -,
When the auxiliary lacquer 5 has been removed from the solder edges 4, the solder stop lacquer 11 loses its adhesion in these regions.
Figure 4 shows the circuit board following the removal of the solder stop lacquer 11 from the solder edges 4. The solder stop lacquer 11 can, for example, be removed by light brushing. ~hen merely the solder edges 4 are exposed on the solder side 8 and all the other regions have been covered with the solder stop lacquer 11, components may be applied to the circuit board and soldered in place.
Figure S shows the circuit board after the soldering. Through capillary action the solder 12 fills up the entire aperture 3 and thus pro-duces a durable solder connection between the terminal wires 13 of the com-ponents and the solder sdges 4.
It will be apparent that I have advantageously provided a process whereby solder-rejecting protection may be applied to the conductor paths on ~ -a circuit board which is simple and economical and requires very little in the way of expensive apparatus. -~
While a preferred manner of carrying out the invention has been ~-disclosed, it will be appreciated that this has been shown by way of example -only, and ths invention is not to be limitet thereto as other variations may be apparent to those skilled in the art and the invention is to be given its fullest possible interpretation within the terms of the following claims. -~
," '"-'; ' ., .
:: -,
- 5 -
Claims (10)
PROPERTY OR PRIVILEGE IS CLAIMED ARE DEFINED AS FOLLOWS:
1. A process for the production of a solder rejecting protection for the conductor paths on the solder side of circuit boards with apertures which are surrounded by solder edges including the steps of: applying a viscous auxiliary lacquer to the top surface of a circuit board; pressing the auxiliary lacquer into the apertures in the circuit board in such manner that menisci of the auxiliary lacquer cover the solder edges formed on the solder side; providing the conductor paths on the solder side which are not to be soldered with solder-rejecting properties; and removing the auxiliary lacquer.
2. A process as claimed in claim 1 including providing those con-ductor paths on the solder side which are not to be soldered with solder-rejecting properties by passivation.
3. A process as claimed in claim 1 including drying the auxiliary lacquer after application.
4, A process as claimed in claim 1 including applying a solder stop lacquer to the solder side after applying the auxiliary lacquer; drying the solder stop lacquer; removing the auxiliary lacquer by a solvent which has a selective action; and removing the solder stop lacquer from the solder edges.
5, A process as claimed in claim 4 wherein a water-soluble auxiliary lacquer is used ant water is used as selective solvent.
6. A process as claimed in claim 1 in which a doctor or roller is used to apply the auxiliary lacquer and press it into the apertures.
7. A process as claimed in claim 1 in which the auxiliary lacquer is first applied to an intermediate carrier from which it is transferred to the top of the circuit board.
8, A process as claimed in claim 1 in which a flux additive is used in the auxiliary lacquer.
9. A process as claimed in claim 1 wherein the auxiliary lacquer com-prises a water-soluble mixture of polyvinylalcohol, gelatine, glycerine and dye.
10. A process as claimed in claim 1 wherein the auxiliary lacquer com-prises a water-soluble mixture of polyvinylalcohol, gelatine, glycerine and dye, and including drying the auxiliary lacquer after application.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2400665A DE2400665C3 (en) | 1974-01-08 | 1974-01-08 | Process for producing a solder-repellent protection on printed circuit boards with through holes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1041848A true CA1041848A (en) | 1978-11-07 |
Family
ID=5904309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA217,327A Expired CA1041848A (en) | 1974-01-08 | 1975-01-03 | Process for the production of a solder-rejecting protection on circuit boards provided with apertures |
Country Status (11)
| Country | Link |
|---|---|
| JP (1) | JPS5199263A (en) |
| AT (1) | AT346956B (en) |
| BE (1) | BE824182A (en) |
| CA (1) | CA1041848A (en) |
| CH (1) | CH582980A5 (en) |
| DE (1) | DE2400665C3 (en) |
| FR (1) | FR2257188A1 (en) |
| GB (1) | GB1474247A (en) |
| IT (1) | IT1027981B (en) |
| NL (1) | NL7417056A (en) |
| SE (1) | SE7500019L (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5624180U (en) * | 1979-07-31 | 1981-03-04 | ||
| JPS60124894A (en) * | 1983-12-08 | 1985-07-03 | 株式会社明電舎 | Method of producing printed board |
| AT389793B (en) * | 1986-03-25 | 1990-01-25 | Philips Nv | CIRCUIT BOARD FOR PRINTED CIRCUITS AND METHOD FOR PRODUCING SUCH CIRCUIT BOARDS |
| GB2230990A (en) * | 1989-05-05 | 1990-11-07 | Harwin Engineers S A | Hole plug and method of plugging holes |
| DE19909505C2 (en) | 1999-03-04 | 2001-11-15 | Daimler Chrysler Ag | Process for the production of circuit arrangements |
| DE10101359A1 (en) | 2001-01-13 | 2002-07-25 | Conti Temic Microelectronic | Method of manufacturing an electronic assembly |
| FI130166B (en) * | 2019-03-08 | 2023-03-23 | Picosun Oy | Solder mask |
-
1974
- 1974-01-08 DE DE2400665A patent/DE2400665C3/en not_active Expired
- 1974-11-25 AT AT940974A patent/AT346956B/en not_active IP Right Cessation
- 1974-12-02 GB GB5200474A patent/GB1474247A/en not_active Expired
- 1974-12-12 CH CH1653074A patent/CH582980A5/xx not_active IP Right Cessation
- 1974-12-23 IT IT30940/74A patent/IT1027981B/en active
- 1974-12-31 NL NL7417056A patent/NL7417056A/en not_active Application Discontinuation
-
1975
- 1975-01-02 SE SE7500019A patent/SE7500019L/xx unknown
- 1975-01-03 FR FR7500110A patent/FR2257188A1/fr not_active Withdrawn
- 1975-01-03 CA CA217,327A patent/CA1041848A/en not_active Expired
- 1975-01-07 JP JP50004633A patent/JPS5199263A/en active Pending
- 1975-01-08 BE BE152211A patent/BE824182A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| DE2400665C3 (en) | 1979-04-05 |
| DE2400665A1 (en) | 1975-07-10 |
| SE7500019L (en) | 1975-07-09 |
| FR2257188A1 (en) | 1975-08-01 |
| AT346956B (en) | 1978-12-11 |
| CH582980A5 (en) | 1976-12-15 |
| NL7417056A (en) | 1975-07-10 |
| ATA940974A (en) | 1978-04-15 |
| JPS5199263A (en) | 1976-09-01 |
| DE2400665B2 (en) | 1977-03-17 |
| IT1027981B (en) | 1978-12-20 |
| GB1474247A (en) | 1977-05-18 |
| BE824182A (en) | 1975-05-02 |
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