JPS5199263A - Kantsukoo motsupurintobanjono taihandahogosono seizohoho - Google Patents

Kantsukoo motsupurintobanjono taihandahogosono seizohoho

Info

Publication number
JPS5199263A
JPS5199263A JP50004633A JP463375A JPS5199263A JP S5199263 A JPS5199263 A JP S5199263A JP 50004633 A JP50004633 A JP 50004633A JP 463375 A JP463375 A JP 463375A JP S5199263 A JPS5199263 A JP S5199263A
Authority
JP
Japan
Prior art keywords
taihandahogosono
motsupurintobanjono
kantsukoo
seizohoho
taihandahogosono seizohoho
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50004633A
Other languages
Japanese (ja)
Inventor
Hatsuke Hansuyurugen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of JPS5199263A publication Critical patent/JPS5199263A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0582—Coating by resist, i.e. resist used as mask for application of insulating coating or of second resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP50004633A 1974-01-08 1975-01-07 Kantsukoo motsupurintobanjono taihandahogosono seizohoho Pending JPS5199263A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2400665A DE2400665C3 (en) 1974-01-08 1974-01-08 Process for producing a solder-repellent protection on printed circuit boards with through holes

Publications (1)

Publication Number Publication Date
JPS5199263A true JPS5199263A (en) 1976-09-01

Family

ID=5904309

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50004633A Pending JPS5199263A (en) 1974-01-08 1975-01-07 Kantsukoo motsupurintobanjono taihandahogosono seizohoho

Country Status (11)

Country Link
JP (1) JPS5199263A (en)
AT (1) AT346956B (en)
BE (1) BE824182A (en)
CA (1) CA1041848A (en)
CH (1) CH582980A5 (en)
DE (1) DE2400665C3 (en)
FR (1) FR2257188A1 (en)
GB (1) GB1474247A (en)
IT (1) IT1027981B (en)
NL (1) NL7417056A (en)
SE (1) SE7500019L (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5624180U (en) * 1979-07-31 1981-03-04
JPS60124894A (en) * 1983-12-08 1985-07-03 株式会社明電舎 Method of producing printed board

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT389793B (en) * 1986-03-25 1990-01-25 Philips Nv CIRCUIT BOARD FOR PRINTED CIRCUITS AND METHOD FOR PRODUCING SUCH CIRCUIT BOARDS
GB2230990A (en) * 1989-05-05 1990-11-07 Harwin Engineers S A Hole plug and method of plugging holes
DE19909505C2 (en) 1999-03-04 2001-11-15 Daimler Chrysler Ag Process for the production of circuit arrangements
DE10101359A1 (en) 2001-01-13 2002-07-25 Conti Temic Microelectronic Method of manufacturing an electronic assembly
FI130166B (en) * 2019-03-08 2023-03-23 Picosun Oy Solder mask

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5624180U (en) * 1979-07-31 1981-03-04
JPS60124894A (en) * 1983-12-08 1985-07-03 株式会社明電舎 Method of producing printed board
JPH0455359B2 (en) * 1983-12-08 1992-09-03 Meidensha Electric Mfg Co Ltd

Also Published As

Publication number Publication date
DE2400665C3 (en) 1979-04-05
DE2400665A1 (en) 1975-07-10
SE7500019L (en) 1975-07-09
FR2257188A1 (en) 1975-08-01
AT346956B (en) 1978-12-11
CH582980A5 (en) 1976-12-15
NL7417056A (en) 1975-07-10
ATA940974A (en) 1978-04-15
CA1041848A (en) 1978-11-07
DE2400665B2 (en) 1977-03-17
IT1027981B (en) 1978-12-20
GB1474247A (en) 1977-05-18
BE824182A (en) 1975-05-02

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