GB1474247A - Provision of solder-stop protection for conductor paths on circuit boards - Google Patents
Provision of solder-stop protection for conductor paths on circuit boardsInfo
- Publication number
- GB1474247A GB1474247A GB5200474A GB5200474A GB1474247A GB 1474247 A GB1474247 A GB 1474247A GB 5200474 A GB5200474 A GB 5200474A GB 5200474 A GB5200474 A GB 5200474A GB 1474247 A GB1474247 A GB 1474247A
- Authority
- GB
- United Kingdom
- Prior art keywords
- lacquer
- face
- solder
- apertures
- areas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0582—Coating by resist, i.e. resist used as mask for application of insulating coating or of second resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0079—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the method of application or removal of the mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
1474247 Soldering SIEMENS AG 2 Dec 1974 [8 Jan 1974] 52004/74 Heading B3R In a method of providing solder-stop protection for conductor paths 2 on a face 8, where soldered joints are to made, on a circuit board 1 having apertures 3 therein each surrounded on the said face with a metal soldering area 4, a viscous lacquer 5 is applied to the opposite face of the board, the lacquer is pressed into the apertures so that the lacquer emerges from the apertures at the face 8 and covers the metal soldering areas 4, solder-stop properties are provided on the conductor paths on the face 8 not required to be soldered and the lacquer is removed or substantially removed. The lacquer which may be a water-soluble mixture of polyvinylalcohol, gelatine, glycerine and dye, is in an embodiment, pressed into the apertures by a blade 7 Fig. 2 or a roller and initially part spherical drops 9 emerge which pull back because of surface tension so that the menisci 10 covers the areas 4, 9 solder-stop lacquer 11 having an epoxide base is sprayed or roller coated on the surface 8 of the board, Fig. 3, and then the lacquer 5 is removed using water as a solvent. When the lacquer is removed from the areas 4 the lacquer 11 is also removed by light brushing from those areas and the treated board is as shown in Fig. 4 ready for soldering. The lacquer 11 may be replaced by an oxidised coating and the removal of the lacquers 5 and 11 may be assisted by spraying, compressed air, or ultrasonics during or after the use of the solvent.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2400665A DE2400665C3 (en) | 1974-01-08 | 1974-01-08 | Process for producing a solder-repellent protection on printed circuit boards with through holes |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1474247A true GB1474247A (en) | 1977-05-18 |
Family
ID=5904309
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB5200474A Expired GB1474247A (en) | 1974-01-08 | 1974-12-02 | Provision of solder-stop protection for conductor paths on circuit boards |
Country Status (11)
Country | Link |
---|---|
JP (1) | JPS5199263A (en) |
AT (1) | AT346956B (en) |
BE (1) | BE824182A (en) |
CA (1) | CA1041848A (en) |
CH (1) | CH582980A5 (en) |
DE (1) | DE2400665C3 (en) |
FR (1) | FR2257188A1 (en) |
GB (1) | GB1474247A (en) |
IT (1) | IT1027981B (en) |
NL (1) | NL7417056A (en) |
SE (1) | SE7500019L (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2230990A (en) * | 1989-05-05 | 1990-11-07 | Harwin Engineers S A | Hole plug and method of plugging holes |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5624180U (en) * | 1979-07-31 | 1981-03-04 | ||
JPS60124894A (en) * | 1983-12-08 | 1985-07-03 | 株式会社明電舎 | Method of producing printed board |
AT389793B (en) * | 1986-03-25 | 1990-01-25 | Philips Nv | CIRCUIT BOARD FOR PRINTED CIRCUITS AND METHOD FOR PRODUCING SUCH CIRCUIT BOARDS |
DE19909505C2 (en) | 1999-03-04 | 2001-11-15 | Daimler Chrysler Ag | Process for the production of circuit arrangements |
DE10101359A1 (en) | 2001-01-13 | 2002-07-25 | Conti Temic Microelectronic | Method of manufacturing an electronic assembly |
-
1974
- 1974-01-08 DE DE2400665A patent/DE2400665C3/en not_active Expired
- 1974-11-25 AT AT940974A patent/AT346956B/en not_active IP Right Cessation
- 1974-12-02 GB GB5200474A patent/GB1474247A/en not_active Expired
- 1974-12-12 CH CH1653074A patent/CH582980A5/xx not_active IP Right Cessation
- 1974-12-23 IT IT30940/74A patent/IT1027981B/en active
- 1974-12-31 NL NL7417056A patent/NL7417056A/en not_active Application Discontinuation
-
1975
- 1975-01-02 SE SE7500019A patent/SE7500019L/xx unknown
- 1975-01-03 CA CA217,327A patent/CA1041848A/en not_active Expired
- 1975-01-03 FR FR7500110A patent/FR2257188A1/fr not_active Withdrawn
- 1975-01-07 JP JP50004633A patent/JPS5199263A/en active Pending
- 1975-01-08 BE BE152211A patent/BE824182A/en unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2230990A (en) * | 1989-05-05 | 1990-11-07 | Harwin Engineers S A | Hole plug and method of plugging holes |
Also Published As
Publication number | Publication date |
---|---|
NL7417056A (en) | 1975-07-10 |
BE824182A (en) | 1975-05-02 |
ATA940974A (en) | 1978-04-15 |
JPS5199263A (en) | 1976-09-01 |
FR2257188A1 (en) | 1975-08-01 |
SE7500019L (en) | 1975-07-09 |
AT346956B (en) | 1978-12-11 |
IT1027981B (en) | 1978-12-20 |
DE2400665C3 (en) | 1979-04-05 |
CH582980A5 (en) | 1976-12-15 |
DE2400665B2 (en) | 1977-03-17 |
DE2400665A1 (en) | 1975-07-10 |
CA1041848A (en) | 1978-11-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |