CA1041673A - Transistor - Google Patents
TransistorInfo
- Publication number
- CA1041673A CA1041673A CA233,056A CA233056A CA1041673A CA 1041673 A CA1041673 A CA 1041673A CA 233056 A CA233056 A CA 233056A CA 1041673 A CA1041673 A CA 1041673A
- Authority
- CA
- Canada
- Prior art keywords
- emitter
- zone
- transistor
- base
- emitter zone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 6
- 238000009792 diffusion process Methods 0.000 claims abstract description 5
- 238000005468 ion implantation Methods 0.000 claims abstract description 3
- 230000035515 penetration Effects 0.000 claims description 11
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 239000000969 carrier Substances 0.000 claims description 2
- 239000013078 crystal Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 abstract description 11
- 230000010354 integration Effects 0.000 abstract description 3
- 239000000306 component Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 230000003321 amplification Effects 0.000 description 5
- 238000003199 nucleic acid amplification method Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000002019 doping agent Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 241000429017 Pectis Species 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002674 ointment Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/0112—Integrating together multiple components covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating multiple BJTs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
- H01L21/28525—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table the conductive layers comprising semiconducting material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
- H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Bipolar Transistors (AREA)
- Element Separation (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2439408A DE2439408A1 (de) | 1974-08-16 | 1974-08-16 | Halbleiterbauelement |
Publications (1)
Publication Number | Publication Date |
---|---|
CA1041673A true CA1041673A (en) | 1978-10-31 |
Family
ID=5923395
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CA233,056A Expired CA1041673A (en) | 1974-08-16 | 1975-08-07 | Transistor |
Country Status (9)
Country | Link |
---|---|
JP (1) | JPS5164370A (enrdf_load_stackoverflow) |
AT (1) | AT372805B (enrdf_load_stackoverflow) |
BR (1) | BR7505197A (enrdf_load_stackoverflow) |
CA (1) | CA1041673A (enrdf_load_stackoverflow) |
DE (1) | DE2439408A1 (enrdf_load_stackoverflow) |
FR (1) | FR2282166A1 (enrdf_load_stackoverflow) |
GB (1) | GB1494802A (enrdf_load_stackoverflow) |
IT (1) | IT1040480B (enrdf_load_stackoverflow) |
ZA (1) | ZA754328B (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61224448A (ja) * | 1985-03-29 | 1986-10-06 | Toshiba Corp | 半導体装置の製造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4855663A (enrdf_load_stackoverflow) * | 1971-11-10 | 1973-08-04 | ||
JPS499186A (enrdf_load_stackoverflow) * | 1972-05-11 | 1974-01-26 |
-
1974
- 1974-08-16 DE DE2439408A patent/DE2439408A1/de not_active Ceased
-
1975
- 1975-06-20 GB GB26264/75A patent/GB1494802A/en not_active Expired
- 1975-07-07 ZA ZA00754328A patent/ZA754328B/xx unknown
- 1975-07-15 AT AT0546075A patent/AT372805B/de not_active IP Right Cessation
- 1975-08-05 IT IT26108/75A patent/IT1040480B/it active
- 1975-08-06 FR FR7524515A patent/FR2282166A1/fr active Granted
- 1975-08-07 CA CA233,056A patent/CA1041673A/en not_active Expired
- 1975-08-14 BR BR7505197*A patent/BR7505197A/pt unknown
- 1975-08-15 JP JP50099451A patent/JPS5164370A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
DE2439408A1 (de) | 1976-02-26 |
ATA546075A (de) | 1983-03-15 |
ZA754328B (en) | 1976-06-30 |
AT372805B (de) | 1983-11-25 |
FR2282166A1 (fr) | 1976-03-12 |
JPS5164370A (enrdf_load_stackoverflow) | 1976-06-03 |
IT1040480B (it) | 1979-12-20 |
BR7505197A (pt) | 1976-08-03 |
GB1494802A (en) | 1977-12-14 |
FR2282166B1 (enrdf_load_stackoverflow) | 1980-10-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3196058A (en) | Method of making semiconductor devices | |
US5620907A (en) | Method for making a heterojunction bipolar transistor | |
US4492008A (en) | Methods for making high performance lateral bipolar transistors | |
Lanzerotti et al. | Suppression of boron transient enhanced diffusion in SiGe heterojunction bipolar transistors by carbon incorporation | |
JPH07193078A (ja) | ヘテロ接合トランジスタ及びその製造方法 | |
US3611067A (en) | Complementary npn/pnp structure for monolithic integrated circuits | |
JP4807931B2 (ja) | 狭いドーピング・プロファイルを有する高性能半導体デバイスを作成する構造および方法 | |
US5272357A (en) | Semiconductor device and electronic device by use of the semiconductor | |
JPH05347313A (ja) | 高速半導体デバイスの極薄活性領域の製造方法 | |
JP3507830B1 (ja) | 半導体装置 | |
US3709746A (en) | Double epitaxial method of fabricating a pedestal transistor | |
CA1041673A (en) | Transistor | |
US4109272A (en) | Lateral bipolar transistor | |
US4101349A (en) | Integrated injection logic structure fabricated by outdiffusion and epitaxial deposition | |
US4109273A (en) | Contact electrode for semiconductor component | |
JPS61248470A (ja) | ▲iii▼―▲v▼族半導体デバイス | |
US4165516A (en) | Semiconductor device and method of manufacturing same | |
JP2008235560A (ja) | ヘテロ接合バイポーラトランジスタ | |
JPH07245418A (ja) | 半導体装置 | |
JP2953666B2 (ja) | 半導体装置及び電子装置 | |
JP3140879B2 (ja) | 半導体装置及びその製造方法 | |
EP0431835A1 (en) | Bipolar semiconductor device | |
JP3001601B2 (ja) | 半導体装置 | |
JP3001600B2 (ja) | 半導体装置 | |
US3299330A (en) | Intermetallic compound semiconductor devices |