CA1014838A - Flexible metal-clad laminates and method for manufacturing the same - Google Patents

Flexible metal-clad laminates and method for manufacturing the same

Info

Publication number
CA1014838A
CA1014838A CA192,887A CA192887A CA1014838A CA 1014838 A CA1014838 A CA 1014838A CA 192887 A CA192887 A CA 192887A CA 1014838 A CA1014838 A CA 1014838A
Authority
CA
Canada
Prior art keywords
manufacturing
same
flexible metal
clad laminates
laminates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA192,887A
Other languages
English (en)
Other versions
CA192887S (en
Inventor
Takahiro Nakayama
Sigenori Yamaoka
Tsutomu Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2024673A external-priority patent/JPS49109475A/ja
Priority claimed from JP6880073A external-priority patent/JPS5515116B2/ja
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Application granted granted Critical
Publication of CA1014838A publication Critical patent/CA1014838A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31525—Next to glass or quartz
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Reinforced Plastic Materials (AREA)
CA192,887A 1973-02-21 1974-02-19 Flexible metal-clad laminates and method for manufacturing the same Expired CA1014838A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2024673A JPS49109475A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1973-02-21 1973-02-21
JP6880073A JPS5515116B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1973-06-20 1973-06-20

Publications (1)

Publication Number Publication Date
CA1014838A true CA1014838A (en) 1977-08-02

Family

ID=26357155

Family Applications (1)

Application Number Title Priority Date Filing Date
CA192,887A Expired CA1014838A (en) 1973-02-21 1974-02-19 Flexible metal-clad laminates and method for manufacturing the same

Country Status (6)

Country Link
US (1) US3936575A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CA (1) CA1014838A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CH (1) CH605119A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR (1) FR2218717B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
GB (1) GB1459487A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
IT (1) IT1002973B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

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US4029845A (en) * 1974-08-15 1977-06-14 Sumitomo Bakelite Company, Limited Printed circuit base board and method for manufacturing same
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US4358503A (en) * 1979-12-03 1982-11-09 Homeyer H H H Glass fibre reinforced plastic sheeting material
DE3028496C2 (de) * 1980-07-26 1986-04-24 Preh, Elektrofeinmechanische Werke Jakob Preh Nachf. Gmbh & Co, 8740 Bad Neustadt Haftvermittler für ein Trägermaterial
JPS5758396A (en) * 1980-09-25 1982-04-08 Kanegafuchi Chemical Ind Method of producing metal foil lined laminated board
DE3112437C1 (de) * 1981-03-28 1982-09-30 Heinz Dipl.-Ing. 5227 Windeck Bungard Verfahren zur kontinuierlichen Herstellung von metallkaschiertem Basismaterial für Leiterplatten
US4533597A (en) * 1982-03-29 1985-08-06 Multi-Tex Products Corp. Adhesive for composite yarn product
US4529755A (en) * 1982-10-23 1985-07-16 Denki Kagaku Kogyo Kabushiki Kaisha Epoxy resin composition for encapsulating semiconductor
US4680346A (en) * 1985-12-13 1987-07-14 Ppg Industries, Inc. Flexible primer composition and method of providing a substrate with a flexible multilayer coating
US4750262A (en) * 1986-05-01 1988-06-14 International Business Machines Corp. Method of fabricating a printed circuitry substrate
US4774127A (en) * 1987-06-15 1988-09-27 Tektronix, Inc. Fabrication of a multilayer conductive pattern on a dielectric substrate
US4851613A (en) * 1988-06-08 1989-07-25 Flex Technology, Inc. Flexible circuit laminate for surface mount devices
US5071701A (en) * 1989-11-22 1991-12-10 B. F. Goodrich Corporation Copolymer for use in preparing prepregs, printed circuit wiring boards prepared from such prepregs and processes for preparing such printed circuit wiring boards
IE75901B1 (en) * 1990-05-16 1997-10-08 Becton Dickinson Co Multiconductor and support and machine and method for making
US5376232A (en) * 1993-08-23 1994-12-27 Parlex Corporation Method of manufacturing a printed circuit board
US5362534A (en) * 1993-08-23 1994-11-08 Parlex Corporation Multiple layer printed circuit boards and method of manufacture
JPH08193188A (ja) * 1995-01-18 1996-07-30 Mitsui Mining & Smelting Co Ltd 銅箔用接着剤および該接着剤付き銅箔
JP3400164B2 (ja) * 1995-01-23 2003-04-28 三井金属鉱業株式会社 多層プリント配線板およびその製造方法
JP3062435B2 (ja) * 1995-11-10 2000-07-10 日本碍子株式会社 フレキシブル基板並びにそれに用いるＢｅ−Ｃｕ合金箔およびその製造方法
KR100473241B1 (ko) * 1996-10-29 2005-03-07 아이솔라 라미네이트 시스템스 코포레이션 에폭시 수지 조성물과 보조 가교제를 포함하는, 스티렌과 말레산 무수물의 공중합체
WO1998030073A1 (en) * 1996-12-27 1998-07-09 Matsushita Electric Industrial Co., Ltd. Method and device for mounting electronic component on circuit board
JP3612594B2 (ja) * 1998-05-29 2005-01-19 三井金属鉱業株式会社 樹脂付複合箔およびその製造方法並びに該複合箔を用いた多層銅張り積層板および多層プリント配線板の製造方法
WO2000076764A1 (en) * 1999-06-10 2000-12-21 Isola Laminate Systems Corp. Epoxy resin, styrene-maleic anhydride copolymer and flexibilizer
US20020030257A1 (en) * 1999-06-18 2002-03-14 Joseph M. Brand Semiconductor device utiling an encapsulant for locking a semiconductor die to circuit substrate
US6468666B2 (en) * 1999-11-22 2002-10-22 Premark Rwp Holdings, Inc. Magnetic susceptible markerboard
CN1205257C (zh) * 2000-03-27 2005-06-08 日本复合材料有限责任公司 低热膨胀层压板
KR100917101B1 (ko) * 2000-08-04 2009-09-15 도요 보세키 가부시키가이샤 플렉시블 금속적층체 및 그 제조방법
US6472083B1 (en) * 2000-08-16 2002-10-29 Premark Rwp Holdings, Inc. Metal surfaced high pressure laminate
US6495265B1 (en) * 2000-08-28 2002-12-17 Premark Rwp Holdings, Inc. Radiation shielded laminate
US20030006007A1 (en) * 2001-07-03 2003-01-09 Chia-Pin Lin Method of laminating copper foil onto a printed circuit board
TWI303959B (en) * 2003-01-17 2008-12-01 Matsushita Electric Ind Co Ltd Manufacturing method of substrate, release sheet, manufacturing method of substrate, and manufacturing method using the same
JP5085081B2 (ja) * 2006-09-22 2012-11-28 パナソニック株式会社 電子部品実装構造体
KR100835277B1 (ko) * 2006-11-23 2008-06-05 삼성전자주식회사 희생 양극을 갖는 전자 장치의 제조방법 및 그에 의해제조된 전자 장치
US20100043689A1 (en) * 2008-08-21 2010-02-25 Madsen Kenneth M Apparatus And Method Of Producing Reinforced Laminated Panels As A Continuous Batch
US8114508B2 (en) * 2009-10-20 2012-02-14 Nan Ya Plastics Corporation Composition of modified maleic anhydride and epdxy resin
DE102010041247A1 (de) 2010-09-23 2012-03-29 Evonik Degussa Gmbh Verfahren zur Herstellung von lagerstabilen Polyurethan-Prepregs und daraus hergestellte Formkörper aus Polyurethanzusammensetzung in Lösung
DE102011006163A1 (de) * 2011-03-25 2012-09-27 Evonik Degussa Gmbh Lagerstabile Polyurethan-Prepregs und daraus hergestellte Formkörper aus Polyurethanzusammensetzung mit flüssigen Harzkomponenten
US9441069B2 (en) * 2012-03-27 2016-09-13 Dic Corporation Epoxy resin, method for producing epoxy resin, epoxy resin composition, cured product thereof, and heat-dissipating resin material
CN104396356B (zh) 2012-06-28 2017-06-27 3M创新有限公司 导热基板制品
JP6095297B2 (ja) * 2012-08-24 2017-03-15 ヘンケルジャパン株式会社 積層シート用接着剤
TW201526742A (zh) * 2013-10-30 2015-07-01 Samsung Electro Mech 玻璃核心層之製造方法
JP6788807B2 (ja) * 2015-04-28 2020-11-25 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート、及びプリント配線板
CN110754141A (zh) * 2017-05-30 2020-02-04 阿莫绿色技术有限公司 用于制造柔性印刷电路板的方法及由该方法制造的柔性印刷电路板

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US2920990A (en) * 1954-06-02 1960-01-12 Rubber And Asbestos Corp Structural adhesive compositions
US3208894A (en) * 1959-11-24 1965-09-28 Yanagihara Kotaro Method of making impregnated base materials, employing unsaturated polyester resin
US3686045A (en) * 1967-10-27 1972-08-22 Westinghouse Electric Corp Bonding insulation material with half ester of an epoxy resin and unsaturated dicarboxylic acid anhydride composition
US3639500A (en) * 1968-05-09 1972-02-01 Avery Products Corp Curable pressure sensitive adhesive containing a polyepoxide a carboxylated diene polymer and an acrylic ester tackifier
CH520391A (de) * 1969-04-08 1972-03-15 Micafil Ag Verfahren zum Isolieren elektrischer Leiter und nach dem Verfahren isolierter Leiter
US3709840A (en) * 1970-10-08 1973-01-09 Vanderbilt Co R T Curing agent for epoxy resin comprising a cyclic anhydride treated with an amino alcohol
US3732332A (en) * 1970-10-16 1973-05-08 Allied Chem Production of low molecular weight polyanhydrides and epoxy compositions derived therefrom
US3723223A (en) * 1971-01-11 1973-03-27 Nat Starch Chem Corp Heat curing adhesive
US3717543A (en) * 1971-01-13 1973-02-20 Rexham Corp Laminations of polyimide films to like films and/or to metal foils
US3759777A (en) * 1971-01-20 1973-09-18 Trw Inc Process for producing reinforced plastic laminates from polydiene block polymers
DE2142571B1 (de) * 1971-08-20 1972-06-08 Siemens Ag Isolierband zur herstellung einer mit einer heisshaertenden epoxidharz-saeureanhydridhaertermischung impraegnierten isolierhuelse fuer elektrische leiter

Also Published As

Publication number Publication date
CH605119A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1978-09-29
US3936575A (en) 1976-02-03
GB1459487A (en) 1976-12-22
FR2218717B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1977-03-04
DE2407923B2 (de) 1975-08-28
IT1002973B (it) 1976-05-20
DE2407923A1 (de) 1974-09-05
AU6589574A (en) 1975-08-28
FR2218717A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1974-09-13

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