BRPI1014695A2 - material de carga de núcleo à base de resina epóxi que gera baixo calor exotérmico. - Google Patents

material de carga de núcleo à base de resina epóxi que gera baixo calor exotérmico.

Info

Publication number
BRPI1014695A2
BRPI1014695A2 BRPI1014695A BRPI1014695A BRPI1014695A2 BR PI1014695 A2 BRPI1014695 A2 BR PI1014695A2 BR PI1014695 A BRPI1014695 A BR PI1014695A BR PI1014695 A BRPI1014695 A BR PI1014695A BR PI1014695 A2 BRPI1014695 A2 BR PI1014695A2
Authority
BR
Brazil
Prior art keywords
epoxy resin
based core
exothermic heat
loading material
generates low
Prior art date
Application number
BRPI1014695A
Other languages
English (en)
Portuguese (pt)
Inventor
Sohaib Elgimiabi
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of BRPI1014695A2 publication Critical patent/BRPI1014695A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C08G59/58—Amines together with other curing agents with polycarboxylic acids or with anhydrides, halides, or low-molecular-weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/32—Phosphorus-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1535—Five-membered rings
    • C08K5/1539—Cyclic anhydrides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
BRPI1014695A 2009-03-30 2010-03-26 material de carga de núcleo à base de resina epóxi que gera baixo calor exotérmico. BRPI1014695A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB0905362.0A GB0905362D0 (en) 2009-03-30 2009-03-30 Fire resistant epoxy resin based core filler material developing low exothermic heat
PCT/US2010/028778 WO2010117669A1 (en) 2009-03-30 2010-03-26 Epoxy resin based core filler material developing low exothermic heat

Publications (1)

Publication Number Publication Date
BRPI1014695A2 true BRPI1014695A2 (pt) 2016-04-12

Family

ID=40671879

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI1014695A BRPI1014695A2 (pt) 2009-03-30 2010-03-26 material de carga de núcleo à base de resina epóxi que gera baixo calor exotérmico.

Country Status (12)

Country Link
US (1) US8779032B2 (https=)
EP (1) EP2414425B1 (https=)
JP (1) JP5508516B2 (https=)
KR (1) KR101709360B1 (https=)
CN (1) CN102378772B (https=)
BR (1) BRPI1014695A2 (https=)
CA (1) CA2756886C (https=)
ES (1) ES2473968T3 (https=)
GB (1) GB0905362D0 (https=)
PL (1) PL2414425T3 (https=)
PT (1) PT2414425E (https=)
WO (1) WO2010117669A1 (https=)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0905362D0 (en) 2009-03-30 2009-05-13 3M Innovative Properties Co Fire resistant epoxy resin based core filler material developing low exothermic heat
EP2470583A1 (en) * 2009-08-27 2012-07-04 ABB Research Ltd. Curable epoxy resin composition
JP2014520937A (ja) * 2011-07-15 2014-08-25 ビーエーエスエフ ソシエタス・ヨーロピア エポキシ系における促進剤としてのポリエーテルアミン
EP2653486B1 (en) * 2012-04-20 2014-12-03 3M Innovative Properties Company Low density epoxy composition with low water uptake
EP2818490B1 (en) * 2013-06-28 2019-04-10 3M Innovative Properties Company Use of an epoxy resin-based composition as a filler honeycomb cells
JP6200715B2 (ja) * 2013-07-24 2017-09-20 ナミックス株式会社 エポキシ樹脂組成物、アンダーフィル剤、接着剤、および半導体装置
ES2625552T3 (es) * 2014-06-17 2017-07-19 3M Innovative Properties Company Composición de adhesivo epoxídico de curado rápido
US20170218237A1 (en) 2014-08-12 2017-08-03 3M Innovative Properties Company Film adhesive
US10662302B2 (en) * 2014-09-23 2020-05-26 The Boeing Company Polymer nanoparticles for improved distortion capability in composites
CN105000129B (zh) * 2015-04-08 2017-04-05 江苏宏强船舶重工有限公司 一种小型船滑油循环舱保护结构的施工工艺
EP3162829B1 (en) * 2015-10-29 2018-08-15 3M Innovative Properties Company Rapid curing and high thixotropy epoxy adhesive compositions
EP3239207B1 (en) 2016-04-27 2021-07-28 3M Innovative Properties Company Curable epoxy compositions
EP3333211B1 (en) 2016-12-09 2020-10-14 3M Innovative Properties Company Composite article comprising a honeycomb structure comprising hot/wet resistant low density epoxy compositions
EP3589694A4 (en) * 2017-03-01 2020-11-18 Purdue Research Foundation COMPOSITIONS OF PRODUCT RESULTING FROM THE EPOXY-TANNIN REACTION
JP7332684B2 (ja) * 2018-08-21 2023-08-23 エボニック オペレーションズ ゲーエムベーハー 硬質フォームを製造するための高速硬化エポキシ系および該フォームの複合材におけるまたは断熱材としての使用
EP3666812B1 (en) * 2018-12-13 2021-10-13 3M Innovative Properties Company Room temperature stable one-part void filler
KR20210142588A (ko) * 2018-12-18 2021-11-25 사이텍 인더스트리스 인코포레이티드 난연성 에폭시 조성물 및 이의 사용 방법
RU2747941C1 (ru) * 2020-03-03 2021-05-17 Общество с ограниченной ответственностью "Архитектурно-конструкторское бюро Монолит" (ООО "АКБ Монолит") Ячеистая негорючая эпоксидная композиция
CN112646521B (zh) * 2020-12-18 2022-02-11 深圳市彩田化工有限公司 一种低放热环氧树脂胶的制备工艺
CN113789034B (zh) * 2021-10-13 2023-07-14 航天特种材料及工艺技术研究所 一种低放热量环氧树脂组合物及其制备方法
EP4310127B1 (en) 2022-07-19 2025-05-14 3M Innovative Properties Company Low density potting adhesive

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3205914B2 (ja) * 1991-09-13 2001-09-04 大倉工業株式会社 エポキシ樹脂組成物
US5679719A (en) * 1993-03-24 1997-10-21 Loctite Corporation Method of preparing fiber/resin composites
JPH07216057A (ja) * 1994-01-27 1995-08-15 Bridgestone Corp エポキシ樹脂組成物
US5597886A (en) * 1994-03-10 1997-01-28 Ciba-Geigy Corporation Heat-curable epoxy resin systems having a good reactivity/stability ratio
DE59502297D1 (de) 1994-03-10 1998-07-02 Ciba Geigy Ag Thermisch härtbare Epoxidharzsysteme mit gutem Reaktivitäts-/Stabilitätsverhalten
KR100504652B1 (ko) * 1995-11-18 2005-09-26 반티코 아게 분말화가능한반응성수지조성물
IL142339A0 (en) 1998-10-23 2002-03-10 Vantico Ag Method for filling and reinforcing honeycomb sandwich panels
US6534181B2 (en) 2000-03-27 2003-03-18 Neltec, Inc. Styrene-maleic anhydride copolymer and epoxy resin blend crosslinked with multifunctional amine compounds
EP1674518A1 (en) * 2004-12-23 2006-06-28 3M Innovative Properties Company Fire-retardant low-density epoxy composition
US8475694B2 (en) * 2005-10-25 2013-07-02 Zephyros, Inc. Shaped expandable material
GB0905362D0 (en) 2009-03-30 2009-05-13 3M Innovative Properties Co Fire resistant epoxy resin based core filler material developing low exothermic heat

Also Published As

Publication number Publication date
CN102378772B (zh) 2014-07-09
CN102378772A (zh) 2012-03-14
WO2010117669A1 (en) 2010-10-14
PT2414425E (pt) 2014-06-25
US8779032B2 (en) 2014-07-15
US20120022185A1 (en) 2012-01-26
KR20120013349A (ko) 2012-02-14
GB0905362D0 (en) 2009-05-13
JP5508516B2 (ja) 2014-06-04
CA2756886C (en) 2017-06-13
EP2414425B1 (en) 2014-04-23
ES2473968T3 (es) 2014-07-08
PL2414425T3 (pl) 2014-09-30
CA2756886A1 (en) 2010-10-14
JP2012522113A (ja) 2012-09-20
EP2414425A1 (en) 2012-02-08
KR101709360B1 (ko) 2017-02-22

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06T Formal requirements before examination [chapter 6.20 patent gazette]
B11E Dismissal acc. art. 34 of ipl - requirements for examination incomplete
B11T Dismissal: dismissal of application maintained