BRPI0807278A2 - Cartão eletrônico e aeronave - Google Patents

Cartão eletrônico e aeronave

Info

Publication number
BRPI0807278A2
BRPI0807278A2 BRPI0807278-7A2A BRPI0807278A BRPI0807278A2 BR PI0807278 A2 BRPI0807278 A2 BR PI0807278A2 BR PI0807278 A BRPI0807278 A BR PI0807278A BR PI0807278 A2 BRPI0807278 A2 BR PI0807278A2
Authority
BR
Brazil
Prior art keywords
layer
electronic
situated
card
insulation
Prior art date
Application number
BRPI0807278-7A2A
Other languages
English (en)
Inventor
Stephane Ortet
Vincent Rebeyrotte
David Rousset
Original Assignee
Airbus France
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Airbus France filed Critical Airbus France
Publication of BRPI0807278A2 publication Critical patent/BRPI0807278A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09709—Staggered pads, lands or terminals; Parallel conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Credit Cards Or The Like (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
BRPI0807278-7A2A 2007-02-22 2008-02-18 Cartão eletrônico e aeronave BRPI0807278A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0753433A FR2913173B1 (fr) 2007-02-22 2007-02-22 Carte electronique et aeronef la comportant
PCT/FR2008/000211 WO2008129155A2 (fr) 2007-02-22 2008-02-18 Carte electronique et aeronef la comportant

Publications (1)

Publication Number Publication Date
BRPI0807278A2 true BRPI0807278A2 (pt) 2014-12-30

Family

ID=38473394

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0807278-7A2A BRPI0807278A2 (pt) 2007-02-22 2008-02-18 Cartão eletrônico e aeronave

Country Status (11)

Country Link
US (1) US8148644B2 (pt)
EP (1) EP2123137B1 (pt)
JP (1) JP5204128B2 (pt)
CN (1) CN101617571B (pt)
AT (1) ATE494762T1 (pt)
BR (1) BRPI0807278A2 (pt)
CA (1) CA2679084C (pt)
DE (1) DE602008004318D1 (pt)
FR (1) FR2913173B1 (pt)
RU (1) RU2467528C2 (pt)
WO (1) WO2008129155A2 (pt)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9232640B2 (en) 2013-03-10 2016-01-05 Qualcomm Incorporated Thermal isolation in printed circuit board assemblies
JP2016033973A (ja) * 2014-07-31 2016-03-10 アイシン・エィ・ダブリュ株式会社 電力変換装置の制御基板
WO2023110156A1 (en) * 2021-12-15 2023-06-22 Valeo Comfort And Driving Assistance Electronic assembly

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3244795A (en) * 1963-05-31 1966-04-05 Riegel Paper Corp Stacked, laminated printed circuit assemblies
JPS57145397A (en) * 1981-03-04 1982-09-08 Hitachi Ltd Method of producing multilayer printed circuit board
SU1058096A1 (ru) * 1982-06-11 1983-11-30 Организация П/Я В-8466 Герметичный корпус дл радиоэлектронной аппаратуры
US4755911A (en) * 1987-04-28 1988-07-05 Junkosha Co., Ltd. Multilayer printed circuit board
US4824511A (en) * 1987-10-19 1989-04-25 E. I. Du Pont De Nemours And Company Multilayer circuit board with fluoropolymer interlayers
JPH01161355U (pt) * 1988-04-30 1989-11-09
US4916260A (en) * 1988-10-11 1990-04-10 International Business Machines Corporation Circuit member for use in multilayered printed circuit board assembly and method of making same
US5739476A (en) * 1994-10-05 1998-04-14 Namgung; Chung Multilayer printed circuit board laminated with unreinforced resin
JPH11307888A (ja) * 1998-04-24 1999-11-05 Furukawa Electric Co Ltd:The 放熱層埋め込み型回路基板の製造方法
JP3956516B2 (ja) * 1999-01-11 2007-08-08 株式会社デンソー プリント基板の実装構造
JP2001085879A (ja) * 1999-09-13 2001-03-30 Hitachi Ltd 電子回路基板の組み立て構造
AU2003248743A1 (en) * 2002-06-27 2004-01-19 Ppg Industries Ohio, Inc. Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof
JP4099756B2 (ja) * 2002-08-07 2008-06-11 日立金属株式会社 積層基板
JP2004241526A (ja) * 2003-02-05 2004-08-26 Kyocera Corp 配線基板
DE10315768A1 (de) * 2003-04-07 2004-11-25 Siemens Ag Mehrlagige Leiterplatte
JP2004363568A (ja) * 2003-05-09 2004-12-24 Matsushita Electric Ind Co Ltd 回路素子内蔵モジュール
JP4394432B2 (ja) * 2003-12-15 2010-01-06 日東電工株式会社 配線回路基板保持シートの製造方法
JP2005191378A (ja) * 2003-12-26 2005-07-14 Toyota Industries Corp プリント基板における放熱構造
RU57053U1 (ru) * 2006-05-03 2006-09-27 Открытое акционерное общество "Научно-производственное объединение "Прибор" Устройство для тепловой защиты электронных модулей в аварийных условиях

Also Published As

Publication number Publication date
EP2123137B1 (fr) 2011-01-05
JP2010519755A (ja) 2010-06-03
CN101617571A (zh) 2009-12-30
CA2679084A1 (en) 2008-10-30
DE602008004318D1 (de) 2011-02-17
JP5204128B2 (ja) 2013-06-05
RU2467528C2 (ru) 2012-11-20
WO2008129155A2 (fr) 2008-10-30
FR2913173A1 (fr) 2008-08-29
US20100319965A1 (en) 2010-12-23
RU2009135264A (ru) 2011-03-27
FR2913173B1 (fr) 2009-05-15
ATE494762T1 (de) 2011-01-15
CN101617571B (zh) 2012-04-11
WO2008129155A3 (fr) 2009-02-05
EP2123137A2 (fr) 2009-11-25
CA2679084C (en) 2016-08-16
US8148644B2 (en) 2012-04-03

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Legal Events

Date Code Title Description
B25A Requested transfer of rights approved

Owner name: AIRBUS OPERATIONS SAS (FR)

B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 9A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]