DE602008004318D1 - Elektronikkarte und flugzeug damit - Google Patents

Elektronikkarte und flugzeug damit

Info

Publication number
DE602008004318D1
DE602008004318D1 DE602008004318T DE602008004318T DE602008004318D1 DE 602008004318 D1 DE602008004318 D1 DE 602008004318D1 DE 602008004318 T DE602008004318 T DE 602008004318T DE 602008004318 T DE602008004318 T DE 602008004318T DE 602008004318 D1 DE602008004318 D1 DE 602008004318D1
Authority
DE
Germany
Prior art keywords
layer
plane
situated
electronic card
insulation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602008004318T
Other languages
English (en)
Inventor
Stephane Ortet
Vincent Rebeyrotte
David Rousset
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Airbus Operations SAS
Original Assignee
Airbus Operations SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Airbus Operations SAS filed Critical Airbus Operations SAS
Publication of DE602008004318D1 publication Critical patent/DE602008004318D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09709—Staggered pads, lands or terminals; Parallel conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Credit Cards Or The Like (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
DE602008004318T 2007-02-22 2008-02-18 Elektronikkarte und flugzeug damit Active DE602008004318D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0753433A FR2913173B1 (fr) 2007-02-22 2007-02-22 Carte electronique et aeronef la comportant
PCT/FR2008/000211 WO2008129155A2 (fr) 2007-02-22 2008-02-18 Carte electronique et aeronef la comportant

Publications (1)

Publication Number Publication Date
DE602008004318D1 true DE602008004318D1 (de) 2011-02-17

Family

ID=38473394

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602008004318T Active DE602008004318D1 (de) 2007-02-22 2008-02-18 Elektronikkarte und flugzeug damit

Country Status (11)

Country Link
US (1) US8148644B2 (de)
EP (1) EP2123137B1 (de)
JP (1) JP5204128B2 (de)
CN (1) CN101617571B (de)
AT (1) ATE494762T1 (de)
BR (1) BRPI0807278A2 (de)
CA (1) CA2679084C (de)
DE (1) DE602008004318D1 (de)
FR (1) FR2913173B1 (de)
RU (1) RU2467528C2 (de)
WO (1) WO2008129155A2 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9232640B2 (en) 2013-03-10 2016-01-05 Qualcomm Incorporated Thermal isolation in printed circuit board assemblies
JP2016033973A (ja) * 2014-07-31 2016-03-10 アイシン・エィ・ダブリュ株式会社 電力変換装置の制御基板
WO2023110156A1 (en) * 2021-12-15 2023-06-22 Valeo Comfort And Driving Assistance Electronic assembly

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3244795A (en) * 1963-05-31 1966-04-05 Riegel Paper Corp Stacked, laminated printed circuit assemblies
JPS57145397A (en) * 1981-03-04 1982-09-08 Hitachi Ltd Method of producing multilayer printed circuit board
SU1058096A1 (ru) * 1982-06-11 1983-11-30 Организация П/Я В-8466 Герметичный корпус дл радиоэлектронной аппаратуры
US4755911A (en) * 1987-04-28 1988-07-05 Junkosha Co., Ltd. Multilayer printed circuit board
US4824511A (en) * 1987-10-19 1989-04-25 E. I. Du Pont De Nemours And Company Multilayer circuit board with fluoropolymer interlayers
JPH01161355U (de) * 1988-04-30 1989-11-09
US4916260A (en) * 1988-10-11 1990-04-10 International Business Machines Corporation Circuit member for use in multilayered printed circuit board assembly and method of making same
US5739476A (en) * 1994-10-05 1998-04-14 Namgung; Chung Multilayer printed circuit board laminated with unreinforced resin
JPH11307888A (ja) * 1998-04-24 1999-11-05 Furukawa Electric Co Ltd:The 放熱層埋め込み型回路基板の製造方法
JP3956516B2 (ja) * 1999-01-11 2007-08-08 株式会社デンソー プリント基板の実装構造
JP2001085879A (ja) * 1999-09-13 2001-03-30 Hitachi Ltd 電子回路基板の組み立て構造
AU2003248743A1 (en) * 2002-06-27 2004-01-19 Ppg Industries Ohio, Inc. Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof
JP4099756B2 (ja) * 2002-08-07 2008-06-11 日立金属株式会社 積層基板
JP2004241526A (ja) * 2003-02-05 2004-08-26 Kyocera Corp 配線基板
DE10315768A1 (de) * 2003-04-07 2004-11-25 Siemens Ag Mehrlagige Leiterplatte
JP2004363568A (ja) * 2003-05-09 2004-12-24 Matsushita Electric Ind Co Ltd 回路素子内蔵モジュール
JP4394432B2 (ja) * 2003-12-15 2010-01-06 日東電工株式会社 配線回路基板保持シートの製造方法
JP2005191378A (ja) * 2003-12-26 2005-07-14 Toyota Industries Corp プリント基板における放熱構造
RU57053U1 (ru) * 2006-05-03 2006-09-27 Открытое акционерное общество "Научно-производственное объединение "Прибор" Устройство для тепловой защиты электронных модулей в аварийных условиях

Also Published As

Publication number Publication date
EP2123137B1 (de) 2011-01-05
JP2010519755A (ja) 2010-06-03
CN101617571A (zh) 2009-12-30
CA2679084A1 (en) 2008-10-30
JP5204128B2 (ja) 2013-06-05
RU2467528C2 (ru) 2012-11-20
WO2008129155A2 (fr) 2008-10-30
FR2913173A1 (fr) 2008-08-29
US20100319965A1 (en) 2010-12-23
RU2009135264A (ru) 2011-03-27
FR2913173B1 (fr) 2009-05-15
ATE494762T1 (de) 2011-01-15
CN101617571B (zh) 2012-04-11
WO2008129155A3 (fr) 2009-02-05
BRPI0807278A2 (pt) 2014-12-30
EP2123137A2 (de) 2009-11-25
CA2679084C (en) 2016-08-16
US8148644B2 (en) 2012-04-03

Similar Documents

Publication Publication Date Title
TW200715708A (en) Electronic substrate, manufacturing method for electronic substrate, and electronic device
MY197878A (en) Electronic device involving display
TW200640325A (en) Wiring board manufacturing method
WO2015069953A3 (en) Protective covering for wearable devices
WO2007120697A3 (en) Methods and apparatus for integrated circuit having multiple dies with at least one on chip capacitor
ATE557576T1 (de) Leiterplatine mit elektronischem bauelement
WO2008114681A1 (ja) 受動部品
TW200704582A (en) Semiconductor composite device and method of manufacturing the same
WO2009066629A1 (ja) アンテナ素子およびその製造方法
TW200627653A (en) Interconnection structure through passive component
EP2608408A3 (de) Schaltungssubstrat für Duplexers
ATE452051T1 (de) Strukturbauteil, insbesondere hitzeschild
GB2482039B (en) Electronic device
EP2752880A3 (de) Graphenelektronikvorrichtungen und Verfahren zur Herstellung davon
CL2011000284A1 (es) Una estructura laminada para un documento electronico, con elementos de interferencia electromagnetica.
HK1093097A1 (en) Angular speed measuring transducer
ATE494762T1 (de) Elektronikkarte und flugzeug damit
WO2014095316A3 (de) Elektronische vorrichtung und verfahren zur herstellung einer elektronischen vorrichtung
WO2017050047A1 (zh) 芯片组以及电子设备
DK1786034T3 (da) Effekthalvledermodul
ITMI20091294A1 (it) Modulo a semiconduttore e un procedimento per la produzione di un circuito elettronico
NL2001706A1 (nl) Printed circuit board assembly and manufacturing method for the same.
ATE498831T1 (de) Halbleiterbauelement
WO2012150777A3 (en) The printed circuit board and the method for manufacturing the same
TW200709389A (en) Semiconductor device