BRPI0805225A2 - injection molding method and injection molding equipment - Google Patents
injection molding method and injection molding equipmentInfo
- Publication number
- BRPI0805225A2 BRPI0805225A2 BRPI0805225-5A BRPI0805225A BRPI0805225A2 BR PI0805225 A2 BRPI0805225 A2 BR PI0805225A2 BR PI0805225 A BRPI0805225 A BR PI0805225A BR PI0805225 A2 BRPI0805225 A2 BR PI0805225A2
- Authority
- BR
- Brazil
- Prior art keywords
- synthetic resin
- injection molding
- cavity
- compressed gas
- forming surface
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/57—Exerting after-pressure on the moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/1703—Introducing an auxiliary fluid into the mould
- B29C45/174—Applying a pressurised fluid to the outer surface of the injected material inside the mould cavity, e.g. for preventing shrinkage marks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
MéTODO DE MOLDAGEM POR INJEçãO E EQUIPAMENTO DE MOLDAGEM POR INJEçãO. Para eliminar uma deformação e irregularidades de transferência de molde de um produto moldado tanto quanto possível e encurtar um período de tempo de moldagem. Vapor é fornecido a um percurso de meio de aquecimento 12 de uma porção de matriz-fêmea 6 para iniciar o aquecimento de um lado de superfície de formação de cavidade para elevar uma sua temperatura, e fechar uma matriz. Então, quando o lado de superfície de formação de cavidade atinge uma temperatura predeterminada, a elevação de temperatura é suspensa e a quantidade predeterminada da resina sintética derretida j é injetada na cavidade S. Posteriormente, um gás comprimido é injetado em um espaço entre uma superfície posterior da resina sintética J e a superfície de formação de cavidade da porção de matriz-macho 27 para permitir que o gás comprimido pressione a resina sintética contra a superfície de formação de cavidade para repouso da resina sintética. Enquanto realizando o repouso, se começa a fornecer água de esfriamento ao percurso de meio de aquecimento 12 para curar a superfície frontal da resina sintética da porção de matriz-fêmea 6. Quando a resina sintética é curada em certo grau, uma aplicação de pressão é suspensa e o gás comprimido é descarregado para o lado externo de um equipamento de moldagem por injeção. Após a exaustão do gás comprimido, ar de esfriamento é injetado em um espaço entre a superfície posterior de resina sintética e a superfície de formação de cavidade da porção de matriz-macho 27. Finalmente, quando a resina sintética é curada até certo grau em que a resina sintética é curada satisfatoriamente para ser retirada, a matriz é aberta.INJECTION MOLDING METHOD AND INJECTION MOLDING EQUIPMENT. To eliminate deformation and mold transfer irregularities of a molded product as much as possible and shorten a molding time period. Steam is supplied to a heating medium path 12 of a female die portion 6 to initiate heating of a cavity forming surface side to raise a temperature thereof, and to close a die. Then, when the cavity-forming surface side reaches a predetermined temperature, the temperature rise is suspended and the predetermined amount of melted synthetic resin j is injected into the cavity S. Thereafter, a compressed gas is injected into a space between a surface of the synthetic resin J and the cavity forming surface of the male die portion 27 to allow the compressed gas to press the synthetic resin against the resting cavity surface of the synthetic resin. While performing the rest, cooling water is started to be provided to the heating medium path 12 to cure the front surface of the synthetic resin of the female die portion 6. When the synthetic resin is cured to some degree, a pressure application is applied. suspended and the compressed gas is discharged to the outside of an injection molding equipment. Upon exhaustion of the compressed gas, cooling air is injected into a space between the back surface of the synthetic resin and the cavity forming surface of the core matrix portion 27. Finally, when the synthetic resin is cured to some degree The synthetic resin is cured satisfactorily for removal, the matrix is opened.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007274540A JP4486117B2 (en) | 2007-10-23 | 2007-10-23 | Injection molding method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BRPI0805225A2 true BRPI0805225A2 (en) | 2009-10-06 |
Family
ID=40490500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0805225-5A BRPI0805225A2 (en) | 2007-10-23 | 2008-10-23 | injection molding method and injection molding equipment |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JP4486117B2 (en) |
| KR (1) | KR101046078B1 (en) |
| CN (1) | CN101422956A (en) |
| BR (1) | BRPI0805225A2 (en) |
| DE (1) | DE102008052771A1 (en) |
| PT (1) | PT104229B (en) |
| RU (1) | RU2401197C2 (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5392887B2 (en) * | 2008-04-15 | 2014-01-22 | 旭化成ケミカルズ株式会社 | Gas pressure injection molding method and injection molded body molded by the method |
| JP5565828B2 (en) | 2009-12-11 | 2014-08-06 | 株式会社富士精工 | Injection molding method |
| CN102029695B (en) * | 2010-11-15 | 2013-02-06 | 昆山乙盛机械工业有限公司 | Sharp quenching and sharp heating highlight molding technology of die |
| CN103395166B (en) * | 2013-07-30 | 2016-04-27 | 勋龙精密模具(昆山)有限公司 | A kind of mould eliminating product shrink and stress trace |
| KR101497512B1 (en) * | 2013-12-13 | 2015-03-04 | 추창오 | Injection mold parting lock |
| RU2596748C2 (en) * | 2014-05-12 | 2016-09-10 | Государственное научное учреждение "Институт механики металлополимерных систем имени В.А. Белого Национальной академии наук Беларуси" (ИММС НАН Беларуси) | Hot-runner mould for injection moulding of large-sized cylindrical articles |
| US10201094B2 (en) | 2014-05-20 | 2019-02-05 | Medtronic, Inc. | Systems for encapsulating a hybrid assembly of electronic components and associated methods |
| KR101796455B1 (en) | 2015-05-29 | 2017-11-10 | 한국에너지기술연구원 | Method for manufacturing injection molded products using injection mold having preheatable ejector |
| CN105058762A (en) * | 2015-08-07 | 2015-11-18 | 苏州华冲精密机械有限公司 | Novel blister mould |
| KR102171537B1 (en) | 2018-06-21 | 2020-10-29 | 지오네이션 주식회사 | Resin transfer molding method using the mold capable of rapid heating and cooling |
| RU2751702C1 (en) * | 2020-06-22 | 2021-07-15 | Акционерное общество "Национальный центр вертолетостроения им. М.Л. Миля и Н.И. Камова" (АО "НЦВ Миль и Камов") | Mold for making blade |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06254924A (en) | 1993-03-05 | 1994-09-13 | Asahi Chem Ind Co Ltd | Injection molding method |
| JPH10235723A (en) * | 1997-02-27 | 1998-09-08 | Toyoda Gosei Co Ltd | Molding method of hollow molded form |
| JPH11170304A (en) * | 1997-12-16 | 1999-06-29 | Canon Inc | Mold, molding method and resin molded product |
| JP4211286B2 (en) * | 2002-05-28 | 2009-01-21 | パナソニック電工株式会社 | Resin molded product and manufacturing method thereof |
| JP2007137008A (en) * | 2005-11-22 | 2007-06-07 | Toyoda Gosei Co Ltd | Manufacturing process of resin molding |
-
2007
- 2007-10-23 JP JP2007274540A patent/JP4486117B2/en active Active
-
2008
- 2008-10-16 KR KR1020080101681A patent/KR101046078B1/en not_active IP Right Cessation
- 2008-10-21 CN CNA2008101734308A patent/CN101422956A/en active Pending
- 2008-10-22 RU RU2008141965/12A patent/RU2401197C2/en not_active IP Right Cessation
- 2008-10-22 DE DE102008052771A patent/DE102008052771A1/en not_active Withdrawn
- 2008-10-23 PT PT104229A patent/PT104229B/en not_active IP Right Cessation
- 2008-10-23 BR BRPI0805225-5A patent/BRPI0805225A2/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| PT104229B (en) | 2009-10-16 |
| JP4486117B2 (en) | 2010-06-23 |
| RU2401197C2 (en) | 2010-10-10 |
| KR101046078B1 (en) | 2011-07-01 |
| CN101422956A (en) | 2009-05-06 |
| PT104229A (en) | 2009-04-23 |
| KR20090041319A (en) | 2009-04-28 |
| JP2009101557A (en) | 2009-05-14 |
| DE102008052771A1 (en) | 2009-04-30 |
| RU2008141965A (en) | 2010-04-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B03A | Publication of a patent application or of a certificate of addition of invention [chapter 3.1 patent gazette] | ||
| B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |
Free format text: REFERENTE A 6A ANUIDADE. |
|
| B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2277 DE 26/08/2014. |