BRPI0719012A2 - Processo não eletrolítico aperfeiçoado de metalização de um substrato por meio da redução de sal (sais) metálicos(s) e por projeção de aerossol (aerossóis) - Google Patents

Processo não eletrolítico aperfeiçoado de metalização de um substrato por meio da redução de sal (sais) metálicos(s) e por projeção de aerossol (aerossóis)

Info

Publication number
BRPI0719012A2
BRPI0719012A2 BRPI0719012-3A2A BRPI0719012A BRPI0719012A2 BR PI0719012 A2 BRPI0719012 A2 BR PI0719012A2 BR PI0719012 A BRPI0719012 A BR PI0719012A BR PI0719012 A2 BRPI0719012 A2 BR PI0719012A2
Authority
BR
Brazil
Prior art keywords
projection
substrate
phases
metallisation
duration
Prior art date
Application number
BRPI0719012-3A2A
Other languages
English (en)
Inventor
Samuel Stremsdoerfer
Original Assignee
Jet Metal Technologies
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=38217232&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=BRPI0719012(A2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Jet Metal Technologies filed Critical Jet Metal Technologies
Publication of BRPI0719012A2 publication Critical patent/BRPI0719012A2/pt
Publication of BRPI0719012B1 publication Critical patent/BRPI0719012B1/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1617—Purification and regeneration of coating baths
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1658—Process features with two steps starting with metal deposition followed by addition of reducing agent
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/166—Process features with two steps starting with addition of reducing agent followed by metal deposition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1683—Control of electrolyte composition, e.g. measurement, adjustment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T50/00—Aeronautics or air transport
    • Y02T50/60—Efficient propulsion technologies, e.g. for aircraft

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
BRPI0719012A 2006-11-24 2007-11-26 processo não eletrolítico de metalização de pelo menos uma parte da superfície de um substrato ou superfície a ser metalizada e dispositivo para a condução do processo BRPI0719012B1 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0610287A FR2909101B1 (fr) 2006-11-24 2006-11-24 Procede non electrolytique prefectionne de metallisation d'un substrat par voie de reduction de sel(s) metallique(s) et par projection d'aerosol(s)
PCT/EP2007/062815 WO2008062070A1 (fr) 2006-11-24 2007-11-26 Procede non electrolytique perfectionne de metallisation d'un substrat par voie de reduction de sel(s) metallique(s) et par projection d'aerosol(s)

Publications (2)

Publication Number Publication Date
BRPI0719012A2 true BRPI0719012A2 (pt) 2014-01-14
BRPI0719012B1 BRPI0719012B1 (pt) 2018-10-16

Family

ID=38217232

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0719012A BRPI0719012B1 (pt) 2006-11-24 2007-11-26 processo não eletrolítico de metalização de pelo menos uma parte da superfície de um substrato ou superfície a ser metalizada e dispositivo para a condução do processo

Country Status (16)

Country Link
US (1) US8507043B2 (pt)
EP (1) EP2087147B1 (pt)
JP (1) JP5647789B2 (pt)
KR (1) KR101509825B1 (pt)
CN (1) CN101605924B (pt)
AT (1) ATE503036T1 (pt)
BR (1) BRPI0719012B1 (pt)
CA (1) CA2670213C (pt)
DE (1) DE602007013454D1 (pt)
DK (1) DK2087147T3 (pt)
ES (1) ES2366262T3 (pt)
FR (1) FR2909101B1 (pt)
MX (1) MX2009005488A (pt)
PL (1) PL2087147T3 (pt)
PT (1) PT2087147E (pt)
WO (1) WO2008062070A1 (pt)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2934609B1 (fr) 2008-07-30 2011-07-22 Jet Metal Technologies Procede non eletrolytique de metallisation en ligne de substrats par projection avec traitement de surface prealable et dispositif pour la mise en oeuvre du procede.
FR2934964B1 (fr) * 2008-08-12 2010-10-22 Jet Metal Technologies Procede de traitement optophysique de surface de substrats polymere et dispositif pour la mise en oeuvre du procede
FR2943144B1 (fr) 2009-03-13 2012-12-14 Jet Metal Technologies Miroir anticorrosion, son procede de fabrication et ses applications dans la recuperation de l'energie solaire
IT1401234B1 (it) * 2010-07-14 2013-07-12 Polymtec Engineering Ag Mauren Fl Succursale Di Lugano Serbatoio per contenere carburante e relativo procedimento di realizzazione.
FR2994197B1 (fr) * 2012-08-06 2014-08-22 Plastic Omnium Cie Procede de metallisation d'une surface d'une piece pour vehicule automobile
WO2014098774A1 (en) * 2012-12-21 2014-06-26 Agency For Science, Technology And Research Porous metallic membrane
FR3032724B1 (fr) * 2015-02-12 2019-12-13 Jet Metal Technologies Procede et dispositif de realisation de motifs metalliques sur un substrat a des fins decoratives et/ou fonctionnelles fabrication d'objets integrant cette realisation et ensemble de consommables utilises
US9433826B1 (en) * 2015-03-27 2016-09-06 Acushnet Company Golf ball incorporating metallic film and method of making
KR102233897B1 (ko) * 2020-11-18 2021-03-31 (주)엔젤엠엘 항균 손잡이의 제조 방법 및 이에 의해 제조된 항균 손잡이

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3783005A (en) * 1972-02-04 1974-01-01 Western Electric Co Method of depositing a metal on a surface of a nonconductive substrate
US4144361A (en) * 1977-07-06 1979-03-13 Nathan Feldstein Methods for applying metallic silver coatings
HU184308B (en) * 1980-07-04 1984-08-28 Bacsmegyei Allami Epitoeipari Process for coating glas threads with metal-glas
CN87100440B (zh) * 1987-01-27 1988-05-11 中国人民解放军装甲兵工程学院 在不导电材料上刷镀铜的方法
US5976383A (en) * 1991-04-08 1999-11-02 Romar Technologies, Inc. Recycle process for removing dissolved heavy metals from water with aluminum particles
US6268016B1 (en) * 1996-06-28 2001-07-31 International Business Machines Corporation Manufacturing computer systems with fine line circuitized substrates
FR2763962B1 (fr) 1997-05-29 1999-10-15 Guy Stremsdoerfer Procede non electrolytique de metallisation d'un substrat par voie de reduction de sel(s) metallique(s) et par projection d'aerosol(s)
JPH11335858A (ja) * 1998-05-27 1999-12-07 Yuji Shikamata 銀鏡面の形成方法及びその溶液
JP3352422B2 (ja) * 1999-02-10 2002-12-03 セントラル硝子株式会社 銀被膜形成用薬液および銀被膜形成方法
FR2796962B1 (fr) 1999-07-30 2003-11-21 Bio Merieux Procede de culture in vitro de virus des familles togaviridae et flaviviridae, lignee cellulaire et utilisations
JP3866012B2 (ja) * 2000-06-02 2007-01-10 株式会社荏原製作所 無電解めっき方法及び装置
US6843852B2 (en) * 2002-01-16 2005-01-18 Intel Corporation Apparatus and method for electroless spray deposition
US6800569B2 (en) * 2002-01-30 2004-10-05 Kabushiki Kaisha Toshiba Film forming method, film forming apparatus, pattern forming method, and manufacturing method of semiconductor apparatus
GB0301933D0 (en) * 2003-01-28 2003-02-26 Conductive Inkjet Tech Ltd Method of forming a conductive metal region on a substrate
JP2006111938A (ja) * 2004-10-15 2006-04-27 Tokyo Electron Ltd 無電解めっき装置

Also Published As

Publication number Publication date
CN101605924A (zh) 2009-12-16
PL2087147T3 (pl) 2011-11-30
FR2909101A1 (fr) 2008-05-30
FR2909101B1 (fr) 2009-02-27
US20100075053A1 (en) 2010-03-25
DK2087147T3 (da) 2011-07-18
WO2008062070A1 (fr) 2008-05-29
CN101605924B (zh) 2013-05-29
CA2670213C (fr) 2014-10-14
KR101509825B1 (ko) 2015-04-06
JP5647789B2 (ja) 2015-01-07
KR20090097892A (ko) 2009-09-16
ATE503036T1 (de) 2011-04-15
CA2670213A1 (fr) 2008-05-29
ES2366262T3 (es) 2011-10-18
JP2010510389A (ja) 2010-04-02
US8507043B2 (en) 2013-08-13
EP2087147A1 (fr) 2009-08-12
EP2087147B1 (fr) 2011-03-23
PT2087147E (pt) 2011-07-04
BRPI0719012B1 (pt) 2018-10-16
DE602007013454D1 (de) 2011-05-05
MX2009005488A (es) 2009-08-07

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