BRPI0714507A8 - Estrutura de montagem,e, método para montagem de um componente eletro-óptico em alinhamento com um elemento óptico - Google Patents

Estrutura de montagem,e, método para montagem de um componente eletro-óptico em alinhamento com um elemento óptico

Info

Publication number
BRPI0714507A8
BRPI0714507A8 BRPI0714507A BRPI0714507A BRPI0714507A8 BR PI0714507 A8 BRPI0714507 A8 BR PI0714507A8 BR PI0714507 A BRPI0714507 A BR PI0714507A BR PI0714507 A BRPI0714507 A BR PI0714507A BR PI0714507 A8 BRPI0714507 A8 BR PI0714507A8
Authority
BR
Brazil
Prior art keywords
electro
optical element
assembly
optical component
alignment
Prior art date
Application number
BRPI0714507A
Other languages
English (en)
Inventor
Lenderink Egbert
H Peters Ralph
A Schug Josef
A De Samber Marc
Original Assignee
Koninklijke Philips Electronics Nv
Koninklijke Philips Nv
Lumileds Holding Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics Nv, Koninklijke Philips Nv, Lumileds Holding Bv filed Critical Koninklijke Philips Electronics Nv
Publication of BRPI0714507A2 publication Critical patent/BRPI0714507A2/pt
Publication of BRPI0714507A8 publication Critical patent/BRPI0714507A8/pt

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

ESTRUTURA DE MONTAGEM, E, MÉTODO PARA MONTAGEM DE UM COMPONENTE ELETRO-ÓPTICO EM ALINHAMENTO COM UM ELEMENTO ÓPTICO. Montagem de um componente eletro-óptico (1) em um substrato portador (2) em uma posição exata com relação a um elemento óptico (6), o substrato portador e o componente eletro-óptico sendo, cada um, dotado de pelo menos um bloco de solda (3, 4). Os blocos de solda são dispostos de modo que, quando o referido componente eletro-óptico é soldado nos blocos, uma força é gerada que atua sobre o componente eletro-óptico em uma direção (x) para o elemento óptico e a estrutura é projetada para permitir que o referido componente eletro-óptico se mova lateralmente durante uma soldagem, de modo que ele seja posto em apoio com o referido elemento óptico, assim, assegurando um posicionamento relativo preciso entre o componente eletro-óptico e o elemento óptico.
BRPI0714507A 2006-07-14 2007-07-12 Estrutura de montagem,e, método para montagem de um componente eletro-óptico em alinhamento com um elemento óptico BRPI0714507A8 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP06117193 2006-07-14
EP061171893.0 2006-07-14
PCT/IB2007/052784 WO2008010160A2 (en) 2006-07-14 2007-07-12 Mounting an electro-optical component in alignment with an optical element

Publications (2)

Publication Number Publication Date
BRPI0714507A2 BRPI0714507A2 (pt) 2013-03-12
BRPI0714507A8 true BRPI0714507A8 (pt) 2015-10-06

Family

ID=38896709

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0714507A BRPI0714507A8 (pt) 2006-07-14 2007-07-12 Estrutura de montagem,e, método para montagem de um componente eletro-óptico em alinhamento com um elemento óptico

Country Status (6)

Country Link
US (1) US8086082B2 (pt)
EP (1) EP2044477B1 (pt)
JP (1) JP5225273B2 (pt)
CN (1) CN101490591A (pt)
BR (1) BRPI0714507A8 (pt)
WO (1) WO2008010160A2 (pt)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10444448B2 (en) 2017-08-04 2019-10-15 Electronics And Telecommunications Research Institute Optical module platform structure and method of manufacturing the same
JP7408292B2 (ja) * 2019-03-29 2024-01-05 日東電工株式会社 光素子付き光電気混載基板およびその製造方法
WO2021158784A1 (en) * 2020-02-04 2021-08-12 Fluxus, Inc. Alignment of photonic system components using a reference surface

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6048265U (ja) * 1983-09-08 1985-04-04 富士通株式会社 レ−ザダイオ−ドアレイモジユ−ル
JPH06295937A (ja) * 1993-03-26 1994-10-21 Nec Corp 光電素子の実装方法
US5472886A (en) 1994-12-27 1995-12-05 At&T Corp. Structure of and method for manufacturing an LED
JPH09218325A (ja) * 1996-02-13 1997-08-19 Mitsubishi Electric Corp 半導体レーザモジュール
JP3036446B2 (ja) 1996-12-10 2000-04-24 日本電気株式会社 光素子の実装方法
JP3485455B2 (ja) * 1997-10-24 2004-01-13 京セラ株式会社 光モジュール
DE10392365T5 (de) * 2002-03-08 2005-04-21 Rohm Co. Ltd. Halbleitervorrichtung mit einem Halbleiterchip
JP3509809B2 (ja) * 2002-04-30 2004-03-22 住友電気工業株式会社 サブマウントおよび半導体装置
JP3877642B2 (ja) 2002-05-21 2007-02-07 ローム株式会社 半導体チップを使用した半導体装置
JP2004004195A (ja) 2002-05-30 2004-01-08 Ricoh Co Ltd 光素子の高精度位置合わせ方法、高精度位置合わせ装置、及び光伝送用モジュール
US7303339B2 (en) * 2002-08-28 2007-12-04 Phosistor Technologies, Inc. Optical beam transformer module for light coupling between a fiber array and a photonic chip and the method of making the same
US7397133B2 (en) * 2004-05-18 2008-07-08 Jiahn-Chang Wu Submount for diode with single bottom electrode
JP2005347660A (ja) * 2004-06-07 2005-12-15 Alps Electric Co Ltd 面実装部品の取付構造、及びその取付方法

Also Published As

Publication number Publication date
US8086082B2 (en) 2011-12-27
JP5225273B2 (ja) 2013-07-03
WO2008010160A2 (en) 2008-01-24
BRPI0714507A2 (pt) 2013-03-12
EP2044477A2 (en) 2009-04-08
WO2008010160A3 (en) 2008-04-03
EP2044477B1 (en) 2016-09-07
CN101490591A (zh) 2009-07-22
US20090317036A1 (en) 2009-12-24
JP2009544147A (ja) 2009-12-10

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Legal Events

Date Code Title Description
B25D Requested change of name of applicant approved

Owner name: KONINKLIJKE PHILIPS N.V. (NL)

B25G Requested change of headquarter approved

Owner name: KONINKLIJKE PHILIPS N.V. (NL)

B25A Requested transfer of rights approved

Owner name: LUMILEDS HOLDING B.V. (NL)

B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06T Formal requirements before examination [chapter 6.20 patent gazette]
B11E Dismissal acc. art. 34 of ipl - requirements for examination incomplete
B11T Dismissal of application maintained [chapter 11.20 patent gazette]